Report Detail
Global 3D ICs Market Professional Survey Report 2019
- RnM3789791 |
- 27 September, 2019 |
- Global |
- 106 Pages |
- QYResearch |
- Electronics & Semiconductor
3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
The global 3D ICs market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 3D ICs volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D ICs market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of 3D ICs in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their 3D ICs manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Xilinx
Advanced Semiconductor Engineering (ASE)
Samsung
STMicroelectronics
Taiwan Semiconductors Manufacturing (TSMC)
Toshiba
EV Group
Tessera
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
3D SiCs
Monolithic 3D ICs
Segment by Application
Automotive
Smart Technologies
Robotics
Electronics
Medical
Industrial
Table of Contents
Executive Summary
1 Industry Overview of 3D ICs
- 1.1 Definition of 3D ICs
- 1.2 3D ICs Segment by Type
- 1.2.1 Global 3D ICs Production Growth Rate Comparison by Types (2014-2025)
- 1.2.2 3D SiCs
- 1.2.3 Monolithic 3D ICs
- 1.3 3D ICs Segment by Applications
- 1.3.1 Global 3D ICs Consumption Comparison by Applications (2014-2025)
- 1.3.2 Automotive
- 1.3.3 Smart Technologies
- 1.3.4 Robotics
- 1.3.5 Electronics
- 1.3.6 Medical
- 1.3.7 Industrial
- 1.4 Global 3D ICs Overall Market
- 1.4.1 Global 3D ICs Revenue (2014-2025)
- 1.4.2 Global 3D ICs Production (2014-2025)
- 1.4.3 North America 3D ICs Status and Prospect (2014-2025)
- 1.4.4 Europe 3D ICs Status and Prospect (2014-2025)
- 1.4.5 China 3D ICs Status and Prospect (2014-2025)
- 1.4.6 Japan 3D ICs Status and Prospect (2014-2025)
- 1.4.7 Southeast Asia 3D ICs Status and Prospect (2014-2025)
- 1.4.8 India 3D ICs Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
- 2.1 Raw Material and Suppliers
- 2.2 Manufacturing Cost Structure Analysis of 3D ICs
- 2.3 Manufacturing Process Analysis of 3D ICs
- 2.4 Industry Chain Structure of 3D ICs
3 Development and Manufacturing Plants Analysis of 3D ICs
- 3.1 Capacity and Commercial Production Date
- 3.2 Global 3D ICs Manufacturing Plants Distribution
- 3.3 Major Manufacturers Technology Source and Market Position of 3D ICs
- 3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
- 4.1 3D ICs Production and Capacity Analysis
- 4.2 3D ICs Revenue Analysis
- 4.3 3D ICs Price Analysis
- 4.4 Market Concentration Degree
5 3D ICs Regional Market Analysis
- 5.1 3D ICs Production by Regions
- 5.1.1 Global 3D ICs Production by Regions
- 5.1.2 Global 3D ICs Revenue by Regions
- 5.2 3D ICs Consumption by Regions
- 5.3 North America 3D ICs Market Analysis
- 5.3.1 North America 3D ICs Production
- 5.3.2 North America 3D ICs Revenue
- 5.3.3 Key Manufacturers in North America
- 5.3.4 North America 3D ICs Import and Export
- 5.4 Europe 3D ICs Market Analysis
- 5.4.1 Europe 3D ICs Production
- 5.4.2 Europe 3D ICs Revenue
- 5.4.3 Key Manufacturers in Europe
- 5.4.4 Europe 3D ICs Import and Export
- 5.5 China 3D ICs Market Analysis
- 5.5.1 China 3D ICs Production
- 5.5.2 China 3D ICs Revenue
- 5.5.3 Key Manufacturers in China
- 5.5.4 China 3D ICs Import and Export
- 5.6 Japan 3D ICs Market Analysis
- 5.6.1 Japan 3D ICs Production
- 5.6.2 Japan 3D ICs Revenue
- 5.6.3 Key Manufacturers in Japan
- 5.6.4 Japan 3D ICs Import and Export
- 5.7 Southeast Asia 3D ICs Market Analysis
- 5.7.1 Southeast Asia 3D ICs Production
- 5.7.2 Southeast Asia 3D ICs Revenue
- 5.7.3 Key Manufacturers in Southeast Asia
- 5.7.4 Southeast Asia 3D ICs Import and Export
- 5.8 India 3D ICs Market Analysis
- 5.8.1 India 3D ICs Production
- 5.8.2 India 3D ICs Revenue
- 5.8.3 Key Manufacturers in India
- 5.8.4 India 3D ICs Import and Export
6 3D ICs Segment Market Analysis (by Type)
- 6.1 Global 3D ICs Production by Type
- 6.2 Global 3D ICs Revenue by Type
- 6.3 3D ICs Price by Type
7 3D ICs Segment Market Analysis (by Application)
- 7.1 Global 3D ICs Consumption by Application
- 7.2 Global 3D ICs Consumption Market Share by Application (2014-2019)
8 3D ICs Major Manufacturers Analysis
- 8.1 Xilinx
- 8.1.1 Xilinx 3D ICs Production Sites and Area Served
- 8.1.2 Xilinx Product Introduction, Application and Specification
- 8.1.3 Xilinx 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.1.4 Main Business and Markets Served
- 8.2 Advanced Semiconductor Engineering (ASE)
- 8.2.1 Advanced Semiconductor Engineering (ASE) 3D ICs Production Sites and Area Served
- 8.2.2 Advanced Semiconductor Engineering (ASE) Product Introduction, Application and Specification
- 8.2.3 Advanced Semiconductor Engineering (ASE) 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.2.4 Main Business and Markets Served
- 8.3 Samsung
- 8.3.1 Samsung 3D ICs Production Sites and Area Served
- 8.3.2 Samsung Product Introduction, Application and Specification
- 8.3.3 Samsung 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.3.4 Main Business and Markets Served
- 8.4 STMicroelectronics
- 8.4.1 STMicroelectronics 3D ICs Production Sites and Area Served
- 8.4.2 STMicroelectronics Product Introduction, Application and Specification
- 8.4.3 STMicroelectronics 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.4.4 Main Business and Markets Served
- 8.5 Taiwan Semiconductors Manufacturing (TSMC)
- 8.5.1 Taiwan Semiconductors Manufacturing (TSMC) 3D ICs Production Sites and Area Served
- 8.5.2 Taiwan Semiconductors Manufacturing (TSMC) Product Introduction, Application and Specification
- 8.5.3 Taiwan Semiconductors Manufacturing (TSMC) 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.5.4 Main Business and Markets Served
- 8.6 Toshiba
- 8.6.1 Toshiba 3D ICs Production Sites and Area Served
- 8.6.2 Toshiba Product Introduction, Application and Specification
- 8.6.3 Toshiba 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.6.4 Main Business and Markets Served
- 8.7 EV Group
- 8.7.1 EV Group 3D ICs Production Sites and Area Served
- 8.7.2 EV Group Product Introduction, Application and Specification
- 8.7.3 EV Group 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.7.4 Main Business and Markets Served
- 8.8 Tessera
- 8.8.1 Tessera 3D ICs Production Sites and Area Served
- 8.8.2 Tessera Product Introduction, Application and Specification
- 8.8.3 Tessera 3D ICs Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.8.4 Main Business and Markets Served
9 Development Trend of Analysis of 3D ICs Market
- 9.1 Global 3D ICs Market Trend Analysis
- 9.1.1 Global 3D ICs Market Size (Volume and Value) Forecast 2019-2025
- 9.2 3D ICs Regional Market Trend
- 9.2.1 North America 3D ICs Forecast 2019-2025
- 9.2.2 Europe 3D ICs Forecast 2019-2025
- 9.2.3 China 3D ICs Forecast 2019-2025
- 9.2.4 Japan 3D ICs Forecast 2019-2025
- 9.2.5 Southeast Asia 3D ICs Forecast 2019-2025
- 9.2.6 India 3D ICs Forecast 2019-2025
- 9.3 3D ICs Market Trend (Product Type)
- 9.4 3D ICs Market Trend (Application)
- 10.1 Marketing Channel
- 10.1.1 Direct Marketing
- 10.1.2 Indirect Marketing
- 10.3 3D ICs Customers
11 Market Dynamics
- 11.1 Market Trends
- 11.2 Opportunities
- 11.3 Market Drivers
- 11.4 Challenges
- 11.5 Influence Factors
12 Conclusion
13 Appendix
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
Summary:
Get latest Market Research Reports on 3D ICs. Industry analysis & Market Report on 3D ICs is a syndicated market report, published as Global 3D ICs Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of 3D ICs market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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