Report Detail
Global 3D IC and 2.5D IC Market Research Report 2019
- RnM2874350 |
- 04 February, 2019 |
- Global |
- 99 Pages |
- QYResearch |
- Electronics & Semiconductor
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
The global 3D IC and 2.5D IC market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 3D IC and 2.5D IC volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D IC and 2.5D IC market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
The following manufacturers are covered:
TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)
Segment by Regions
North America
Europe
China
Japan
Segment by Type
3D wafer-level chip-scale packaging
3D TSV
2.5D
Segment by Application
Consumer electronics
Telecommunication
Industry sector
Automotive
Military and Aerospace
Smart technologies
Medical devices
Table of Contents
Executive Summary
1 3D IC and 2.5D IC Market Overview
- 1.1 Product Overview and Scope of 3D IC and 2.5D IC
- 1.2 3D IC and 2.5D IC Segment by Type
- 1.2.1 Global 3D IC and 2.5D IC Production Growth Rate Comparison by Type (2014-2025)
- 1.2.2 3D wafer-level chip-scale packaging
- 1.2.3 3D TSV
- 1.2.4 2.5D
- 1.3 3D IC and 2.5D IC Segment by Application
- 1.3.1 3D IC and 2.5D IC Consumption Comparison by Application (2014-2025)
- 1.3.2 Consumer electronics
- 1.3.3 Telecommunication
- 1.3.4 Industry sector
- 1.3.5 Automotive
- 1.3.6 Military and Aerospace
- 1.3.7 Smart technologies
- 1.3.8 Medical devices
- 1.3 Global 3D IC and 2.5D IC Market by Region
- 1.3.1 Global 3D IC and 2.5D IC Market Size Region
- 1.3.2 North America Status and Prospect (2014-2025)
- 1.3.3 Europe Status and Prospect (2014-2025)
- 1.3.4 China Status and Prospect (2014-2025)
- 1.3.5 Japan Status and Prospect (2014-2025)
- 1.3.6 Southeast Asia Status and Prospect (2014-2025)
- 1.3.7 India Status and Prospect (2014-2025)
- 1.4 Global 3D IC and 2.5D IC Market Size
- 1.4.1 Global 3D IC and 2.5D IC Revenue (2014-2025)
- 1.4.2 Global 3D IC and 2.5D IC Production (2014-2025)
2 Global 3D IC and 2.5D IC Market Competition by Manufacturers
- 2.1 Global 3D IC and 2.5D IC Production Market Share by Manufacturers (2014-2019)
- 2.2 Global 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019)
- 2.3 Global 3D IC and 2.5D IC Average Price by Manufacturers (2014-2019)
- 2.4 Manufacturers 3D IC and 2.5D IC Production Sites, Area Served, Product Types
- 2.5 3D IC and 2.5D IC Market Competitive Situation and Trends
- 2.5.1 3D IC and 2.5D IC Market Concentration Rate
- 2.5.2 3D IC and 2.5D IC Market Share of Top 3 and Top 5 Manufacturers
- 2.5.3 Mergers & Acquisitions, Expansion
3 Global 3D IC and 2.5D IC Production Market Share by Regions
- 3.1 Global 3D IC and 2.5D IC Production Market Share by Regions
- 3.2 Global 3D IC and 2.5D IC Revenue Market Share by Regions (2014-2019)
- 3.3 Global 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 3.4 North America 3D IC and 2.5D IC Production
- 3.4.1 North America 3D IC and 2.5D IC Production Growth Rate (2014-2019)
- 3.4.2 North America 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 3.5 Europe 3D IC and 2.5D IC Production
- 3.5.1 Europe 3D IC and 2.5D IC Production Growth Rate (2014-2019)
- 3.5.2 Europe 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 3.6 China 3D IC and 2.5D IC Production (2014-2019)
- 3.6.1 China 3D IC and 2.5D IC Production Growth Rate (2014-2019)
- 3.6.2 China 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 3.7 Japan 3D IC and 2.5D IC Production (2014-2019)
- 3.7.1 Japan 3D IC and 2.5D IC Production Growth Rate (2014-2019)
- 3.7.2 Japan 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
4 Global 3D IC and 2.5D IC Consumption by Regions
- 4.1 Global 3D IC and 2.5D IC Consumption by Regions
- 4.2 North America 3D IC and 2.5D IC Consumption (2014-2019)
- 4.3 Europe 3D IC and 2.5D IC Consumption (2014-2019)
- 4.4 China 3D IC and 2.5D IC Consumption (2014-2019)
- 4.5 Japan 3D IC and 2.5D IC Consumption (2014-2019)
5 Global 3D IC and 2.5D IC Production, Revenue, Price Trend by Type
- 5.1 Global 3D IC and 2.5D IC Production Market Share by Type (2014-2019)
- 5.2 Global 3D IC and 2.5D IC Revenue Market Share by Type (2014-2019)
- 5.3 Global 3D IC and 2.5D IC Price by Type (2014-2019)
- 5.4 Global 3D IC and 2.5D IC Production Growth by Type (2014-2019)
6 Global 3D IC and 2.5D IC Market Analysis by Applications
- 6.1 Global 3D IC and 2.5D IC Consumption Market Share by Application (2014-2019)
- 6.2 Global 3D IC and 2.5D IC Consumption Growth Rate by Application (2014-2019)
7 Company Profiles and Key Figures in 3D IC and 2.5D IC Business
- 7.1 TSMC (Taiwan)
- 7.1.1 TSMC (Taiwan) 3D IC and 2.5D IC Production Sites and Area Served
- 7.1.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.1.4 Main Business and Markets Served
- 7.2 Samsung (South Korea)
- 7.2.1 Samsung (South Korea) 3D IC and 2.5D IC Production Sites and Area Served
- 7.2.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.2.3 Samsung (South Korea) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.2.4 Main Business and Markets Served
- 7.3 Toshiba (Japan)
- 7.3.1 Toshiba (Japan) 3D IC and 2.5D IC Production Sites and Area Served
- 7.3.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.3.3 Toshiba (Japan) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.3.4 Main Business and Markets Served
- 7.4 ASE Group (Taiwan)
- 7.4.1 ASE Group (Taiwan) 3D IC and 2.5D IC Production Sites and Area Served
- 7.4.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.4.4 Main Business and Markets Served
- 7.5 Amkor (U.S.)
- 7.5.1 Amkor (U.S.) 3D IC and 2.5D IC Production Sites and Area Served
- 7.5.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.5.3 Amkor (U.S.) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.5.4 Main Business and Markets Served
- 7.6 UMC (Taiwan)
- 7.6.1 UMC (Taiwan) 3D IC and 2.5D IC Production Sites and Area Served
- 7.6.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.6.3 UMC (Taiwan) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.6.4 Main Business and Markets Served
- 7.7 Stmicroelectronics (Switzerland)
- 7.7.1 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production Sites and Area Served
- 7.7.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.7.4 Main Business and Markets Served
- 7.8 Broadcom (U.S.)
- 7.8.1 Broadcom (U.S.) 3D IC and 2.5D IC Production Sites and Area Served
- 7.8.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.8.4 Main Business and Markets Served
- 7.9 Intel (U.S.)
- 7.9.1 Intel (U.S.) 3D IC and 2.5D IC Production Sites and Area Served
- 7.9.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.9.3 Intel (U.S.) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.9.4 Main Business and Markets Served
- 7.10 Jiangsu Changjiang Electronics (China)
- 7.10.1 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production Sites and Area Served
- 7.10.2 3D IC and 2.5D IC Product Introduction, Application and Specification
- 7.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
- 7.10.4 Main Business and Markets Served
8 3D IC and 2.5D IC Manufacturing Cost Analysis
- 8.1 3D IC and 2.5D IC Key Raw Materials Analysis
- 8.1.1 Key Raw Materials
- 8.1.2 Price Trend of Key Raw Materials
- 8.1.3 Key Suppliers of Raw Materials
- 8.2 Proportion of Manufacturing Cost Structure
- 8.3 Manufacturing Process Analysis of 3D IC and 2.5D IC
- 8.4 3D IC and 2.5D IC Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
- 9.1 Marketing Channel
- 9.1.1 Direct Marketing
- 9.1.2 Indirect Marketing
- 9.2 3D IC and 2.5D IC Distributors List
- 9.3 3D IC and 2.5D IC Customers
10 Market Dynamics
- 10.1 Market Trends
- 10.2 Opportunities
- 10.3 Market Drivers
- 10.4 Challenges
- 10.5 Influence Factors
11 Global 3D IC and 2.5D IC Market Forecast
- 11.1 Global 3D IC and 2.5D IC Production, Revenue Forecast
- 11.1.1 Global 3D IC and 2.5D IC Production Growth Rate Forecast (2019-2025)
- 11.1.2 Global 3D IC and 2.5D IC Revenue and Growth Rate Forecast (2019-2025)
- 11.1.3 Global 3D IC and 2.5D IC Price and Trend Forecast (2019-2025)
- 11.2 Global 3D IC and 2.5D IC Production Forecast by Regions (2019-2025)
- 11.2.1 North America 3D IC and 2.5D IC Production, Revenue Forecast (2019-2025)
- 11.2.2 Europe 3D IC and 2.5D IC Production, Revenue Forecast (2019-2025)
- 11.2.3 China 3D IC and 2.5D IC Production, Revenue Forecast (2019-2025)
- 11.2.4 Japan 3D IC and 2.5D IC Production, Revenue Forecast (2019-2025)
- 11.3 Global 3D IC and 2.5D IC Consumption Forecast by Regions (2019-2025)
- 11.3.1 North America 3D IC and 2.5D IC Consumption Forecast (2019-2025)
- 11.3.2 Europe 3D IC and 2.5D IC Consumption Forecast (2019-2025)
- 11.3.3 China 3D IC and 2.5D IC Consumption Forecast (2019-2025)
- 11.3.4 Japan 3D IC and 2.5D IC Consumption Forecast (2019-2025)
- 11.4 Global 3D IC and 2.5D IC Production, Revenue and Price Forecast by Type (2019-2025)
- 11.5 Global 3D IC and 2.5D IC Consumption Forecast by Application (2019-2025)
12 Research Findings and Conclusion
13 Methodology and Data Source
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
Summary:
Get latest Market Research Reports on 3D IC and 2.5D IC . Industry analysis & Market Report on 3D IC and 2.5D IC is a syndicated market report, published as Global 3D IC and 2.5D IC Market Research Report 2019. It is complete Research Study and Industry Analysis of 3D IC and 2.5D IC market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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