Global (United States, European Union and China) 2D IC Flip Chip Product Market Research Report 2019-2025

Table of Contents

1 Report Overview

• 1.1 Research Scope
• 1.2 Major Manufacturers Covered in This Report
• 1.3 Market Segment by Type
  • 1.3.1 Global 2D IC Flip Chip Product Market Size Growth Rate by Type (2019-2025)
  • 1.3.2 Copper Pillar
  • 1.3.3 Solder Bumping
  • 1.3.4 Tin-lead eutectic solder
  • 1.3.5 Lead-free solder
  • 1.3.6 Gold Bumping
  • 1.3.7 Others
• 1.4 Market Segment by Application
  • 1.4.1 Global 2D IC Flip Chip Product Market Share by Application (2019-2025)
  • 1.4.2 Electronics
  • 1.4.3 Industrial
  • 1.4.4 Automotive & Transport
  • 1.4.5 Healthcare
  • 1.4.6 IT & Telecommunication
  • 1.4.7 Aerospace and Defense
  • 1.4.8 Others
• 1.5 Study Objectives
• 1.6 Years Considered

2 Global Growth Trends

• 2.1 Production and Capacity Analysis
  • 2.1.1 Global 2D IC Flip Chip Product Production Value 2014-2025
  • 2.1.2 Global 2D IC Flip Chip Product Production 2014-2025
  • 2.1.3 Global 2D IC Flip Chip Product Capacity 2014-2025
  • 2.1.4 Global 2D IC Flip Chip Product Marketing Pricing and Trends
• 2.2 Key Producers Growth Rate (CAGR) 2019-2025
  • 2.2.1 Global 2D IC Flip Chip Product Market Size CAGR of Key Regions
  • 2.2.2 Global 2D IC Flip Chip Product Market Share of Key Regions
• 2.3 Industry Trends
  • 2.3.1 Market Top Trends
  • 2.3.2 Market Drivers

3 Market Share by Manufacturers

• 3.1 Capacity and Production by Manufacturers
  • 3.1.1 Global 2D IC Flip Chip Product Capacity by Manufacturers
  • 3.1.2 Global 2D IC Flip Chip Product Production by Manufacturers
• 3.2 Revenue by Manufacturers
  • 3.2.1 2D IC Flip Chip Product Revenue by Manufacturers (2014-2019)
  • 3.2.2 2D IC Flip Chip Product Revenue Share by Manufacturers (2014-2019)
  • 3.2.3 Global 2D IC Flip Chip Product Market Concentration Ratio (CR5 and HHI)
• 3.3 2D IC Flip Chip Product Price by Manufacturers
• 3.4 Key Manufacturers 2D IC Flip Chip Product Plants/Factories Distribution and Area Served
• 3.5 Date of Key Manufacturers Enter into 2D IC Flip Chip Product Market
• 3.6 Key Manufacturers 2D IC Flip Chip Product Product Offered
• 3.7 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type

• 4.1 Production and Production Value for Each Type
  • 4.1.1 Copper Pillar Production and Production Value (2014-2019)
  • 4.1.2 Solder Bumping Production and Production Value (2014-2019)
  • 4.1.3 Tin-lead eutectic solder Production and Production Value (2014-2019)
  • 4.1.4 Lead-free solder Production and Production Value (2014-2019)
  • 4.1.5 Gold Bumping Production and Production Value (2014-2019)
  • 4.1.6 Others Production and Production Value (2014-2019)
• 4.2 Global 2D IC Flip Chip Product Production Market Share by Type
• 4.3 Global 2D IC Flip Chip Product Production Value Market Share by Type
• 4.4 2D IC Flip Chip Product Ex-factory Price by Type

5 Market Size by Application

• 5.1 Overview
• 5.2 Global 2D IC Flip Chip Product Consumption by Application

6 Production by Regions

• 6.1 Global 2D IC Flip Chip Product Production (History Data) by Regions 2014-2019
• 6.2 Global 2D IC Flip Chip Product Production Value (History Data) by Regions
• 6.3 United States
  • 6.3.1 United States 2D IC Flip Chip Product Production Growth Rate 2014-2019
  • 6.3.2 United States 2D IC Flip Chip Product Production Value Growth Rate 2014-2019
  • 6.3.3 Key Players in United States
  • 6.3.4 United States 2D IC Flip Chip Product Import & Export
• 6.4 European Union
  • 6.4.1 European Union 2D IC Flip Chip Product Production Growth Rate 2014-2019
  • 6.4.2 European Union 2D IC Flip Chip Product Production Value Growth Rate 2014-2019
  • 6.4.3 Key Players in European Union
  • 6.4.4 European Union 2D IC Flip Chip Product Import & Export
• 6.5 China
  • 6.5.1 China 2D IC Flip Chip Product Production Growth Rate 2014-2019
  • 6.5.2 China 2D IC Flip Chip Product Production Value Growth Rate 2014-2019
  • 6.5.3 Key Players in China
  • 6.5.4 China 2D IC Flip Chip Product Import & Export
• 6.6 Rest of World
  • 6.6.1 Japan
  • 6.6.2 Korea
  • 6.6.3 India
  • 6.6.4 Southeast Asia

7 2D IC Flip Chip Product Consumption by Regions

• 7.1 Global 2D IC Flip Chip Product Consumption (History Data) by Regions
• 7.2 United States
  • 7.2.1 United States 2D IC Flip Chip Product Consumption by Type
  • 7.2.2 United States 2D IC Flip Chip Product Consumption by Application
• 7.3 European Union
  • 7.3.1 European Union 2D IC Flip Chip Product Consumption by Type
  • 7.3.2 European Union 2D IC Flip Chip Product Consumption by Application
• 7.4 China
  • 7.4.1 China 2D IC Flip Chip Product Consumption by Type
  • 7.4.2 China 2D IC Flip Chip Product Consumption by Application
• 7.5 Rest of World
  • 7.5.1 Rest of World 2D IC Flip Chip Product Consumption by Type
  • 7.5.2 Rest of World 2D IC Flip Chip Product Consumption by Application
  • 7.5.1 Japan
  • 7.5.2 Korea
  • 7.5.3 India
  • 7.5.4 Southeast Asia

8 Company Profiles

• 8.1 Intel (US)
  • 8.1.1 Intel (US) Company Details
  • 8.1.2 Company Description and Business Overview
  • 8.1.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.1.4 2D IC Flip Chip Product Product Introduction
  • 8.1.5 Intel (US) Recent Development
• 8.2 TSMC (Taiwan)
  • 8.2.1 TSMC (Taiwan) Company Details
  • 8.2.2 Company Description and Business Overview
  • 8.2.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.2.4 2D IC Flip Chip Product Product Introduction
  • 8.2.5 TSMC (Taiwan) Recent Development
• 8.3 Samsung (South Korea)
  • 8.3.1 Samsung (South Korea) Company Details
  • 8.3.2 Company Description and Business Overview
  • 8.3.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.3.4 2D IC Flip Chip Product Product Introduction
  • 8.3.5 Samsung (South Korea) Recent Development
• 8.4 ASE Group (Taiwan)
  • 8.4.1 ASE Group (Taiwan) Company Details
  • 8.4.2 Company Description and Business Overview
  • 8.4.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.4.4 2D IC Flip Chip Product Product Introduction
  • 8.4.5 ASE Group (Taiwan) Recent Development
• 8.5 Amkor Technology (US)
  • 8.5.1 Amkor Technology (US) Company Details
  • 8.5.2 Company Description and Business Overview
  • 8.5.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.5.4 2D IC Flip Chip Product Product Introduction
  • 8.5.5 Amkor Technology (US) Recent Development
• 8.6 UMC (Taiwan)
  • 8.6.1 UMC (Taiwan) Company Details
  • 8.6.2 Company Description and Business Overview
  • 8.6.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.6.4 2D IC Flip Chip Product Product Introduction
  • 8.6.5 UMC (Taiwan) Recent Development
• 8.7 STATS ChipPAC (Singapore)
  • 8.7.1 STATS ChipPAC (Singapore) Company Details
  • 8.7.2 Company Description and Business Overview
  • 8.7.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.7.4 2D IC Flip Chip Product Product Introduction
  • 8.7.5 STATS ChipPAC (Singapore) Recent Development
• 8.8 Powertech Technology (Taiwan)
  • 8.8.1 Powertech Technology (Taiwan) Company Details
  • 8.8.2 Company Description and Business Overview
  • 8.8.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.8.4 2D IC Flip Chip Product Product Introduction
  • 8.8.5 Powertech Technology (Taiwan) Recent Development
• 8.9 STMicroelectronics (Switzerland)
  • 8.9.1 STMicroelectronics (Switzerland) Company Details
  • 8.9.2 Company Description and Business Overview
  • 8.9.3 Production and Revenue of 2D IC Flip Chip Product
  • 8.9.4 2D IC Flip Chip Product Product Introduction
  • 8.9.5 STMicroelectronics (Switzerland) Recent Development

9 Market Forecast

• 9.1 Global Market Size Forecast
  • 9.1.1 Global 2D IC Flip Chip Product Capacity, Production Forecast 2019-2025
  • 9.1.2 Global 2D IC Flip Chip Product Production Value Forecast 2019-2025
• 9.2 Market Forecast by Regions
  • 9.2.1 Global 2D IC Flip Chip Product Production and Value Forecast by Regions 2019-2025
  • 9.2.2 Global 2D IC Flip Chip Product Consumption Forecast by Regions 2019-2025
• 9.3 United States
  • 9.3.1 Production and Value Forecast in United States
  • 9.3.2 Consumption Forecast in United States
• 9.4 European Union
  • 9.4.1 Production and Value Forecast in European Union
  • 9.4.2 Consumption Forecast in European Union
• 9.5 China
  • 9.5.1 Production and Value Forecast in China
  • 9.5.2 Consumption Forecast in China
• 9.6 Rest of World
  • 9.6.1 Japan
  • 9.6.2 Korea
  • 9.6.3 India
  • 9.6.4 Southeast Asia
• 9.7 Forecast by Type
  • 9.7.1 Global 2D IC Flip Chip Product Production Forecast by Type
  • 9.7.2 Global 2D IC Flip Chip Product Production Value Forecast by Type
• 9.8 Consumption Forecast by Application

10 Value Chain and Sales Channels Analysis

• 10.1 Value Chain Analysis
• 10.2 Sales Channels Analysis
  • 10.2.1 2D IC Flip Chip Product Sales Channels
  • 10.2.2 2D IC Flip Chip Product Distributors
• 10.3 2D IC Flip Chip Product Customers

11 Opportunities & Challenges, Threat and Affecting Factors

• 11.1 Market Opportunities
• 11.2 Market Challenges
• 11.3 Porter's Five Forces Analysis

12 Key Findings

13 Appendix

• 13.1 Research Methodology
  • 13.1.1 Methodology/Research Approach
    • 13.1.1.1 Research Programs/Design
    • 13.1.1.2 Market Size Estimation
    • 13.1.1.3 Market Breakdown and Data Triangulation
  • 13.1.2 Data Source
    • 13.1.2.1 Secondary Sources
    • 13.1.2.2 Primary Sources
• 13.2 Author Details