Core technology for ultra-small 3D image sensor

A silicon optical phased array chip, which can be a core component for three-dimensional image sensors has been developed by a KAIST research group.

Many automobile and drone companies are focusing on developing 3D image sensor systems, based on mechanical light detection and ranging (LiDAR) systems. However, it can only get as small as the size of a fist and has a high possibility of malfunctioning because it employs a mechanical method for laser beam-steering.

OPAs have gained attention as a key component to implement solid-state LiDAR because it can control the light direction electronically without moving parts. Silicon-based OPAs are small, durable, and can be mass-produced through conventional Si-CMOS processes.

However, in the development of OPAs, a big issue has been raised about how to achieve wide beam-steering in transversal and longitudinal directions. In the transversal direction, a wide beam-steering has been implemented, relatively easily, through a thermo-optic or electro-optic control of the phase shifters integrated with a 1D array. But the longitudinal beam-steering has been remaining as a technical challenge since only narrow steering was possible with the same 1D array by changing the wavelengths of light, which is hard to implement in semiconductor processes.

If a light wavelength is changed, characteristics of element devices consisting the OPA can vary, which makes it difficult to control the light direction with reliability as well as to integrate a wavelength-tunable laser on a silicon-based chip. Therefore, it is essential to devise a new structure that can easily adjust the radiated light in both transversal and longitudinal directions.

By integrating tuneable radiator, instead of a tunable laser in a conventional OPA, Professor Hyo-Hoon Park from the School of Electrical Engineering and his team developed an ultra-small, low-power OPA chip that facilitates a wide 2D beam-steering with a monochromatic light source.    

             
This OPA structure allows the minimizing of the 3D image sensors, as small as a dragonfly’s eye.
According to the team, the OPA can function as a 3D image sensor and also as a wireless transmitter sending the image data to the desired direction, enabling high-quality image data to be freely communicated between electronic devices.

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