Global Wafer Level Packaging Market Insights and Forecast to 2026
Table of Content
1 Study Coverage
- 1.1 Wafer Level Packaging Product Introduction
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered: Ranking of Global Top Wafer Level Packaging Manufacturers by Revenue in 2019
- 1.4 Market by Type
- 1.4.1 Global Wafer Level Packaging Market Size Growth Rate by Type
- 1.4.2 3D TSV WLP
- 1.4.3 2.5D TSV WLP
- 1.4.4 WLCSP
- 1.4.5 Nano WLP
- 1.4.6 Others ( 2D TSV WLP and Compliant WLP)
- 1.5 Market by Application
- 1.5.1 Global Wafer Level Packaging Market Size Growth Rate by Application
- 1.5.2 Electronics
- 1.5.3 IT & Telecommunication
- 1.5.4 Industrial
- 1.5.5 Automotive
- 1.5.6 Aerospace & Defense
- 1.5.7 Healthcare
- 1.5.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global Wafer Level Packaging Market Size, Estimates and Forecasts
- 2.1.1 Global Wafer Level Packaging Revenue Estimates and Forecasts 2015-2026
- 2.1.2 Global Wafer Level Packaging Production Capacity Estimates and Forecasts 2015-2026
- 2.1.3 Global Wafer Level Packaging Production Estimates and Forecasts 2015-2026
- 2.2 Global Wafer Level Packaging, Market Size by Producing Regions: 2015 VS 2020 VS 2026
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Global Wafer Level Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
- 2.3.3 Global Wafer Level Packaging Manufacturers Geographical Distribution
- 2.4 Key Trends for Wafer Level Packaging Markets & Products
- 2.5 Primary Interviews with Key Wafer Level Packaging Players (Opinion Leaders)
3 Market Size by Manufacturers
- 3.1 Global Top Wafer Level Packaging Manufacturers by Production Capacity
- 3.1.1 Global Top Wafer Level Packaging Manufacturers by Production Capacity (2015-2020)
- 3.1.2 Global Top Wafer Level Packaging Manufacturers by Production (2015-2020)
- 3.1.3 Global Top Wafer Level Packaging Manufacturers Market Share by Production
- 3.2 Global Top Wafer Level Packaging Manufacturers by Revenue
- 3.2.1 Global Top Wafer Level Packaging Manufacturers by Revenue (2015-2020)
- 3.2.2 Global Top Wafer Level Packaging Manufacturers Market Share by Revenue (2015-2020)
- 3.2.3 Global Top 10 and Top 5 Companies by Wafer Level Packaging Revenue in 2019
- 3.3 Global Wafer Level Packaging Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 Wafer Level Packaging Production by Regions
- 4.1 Global Wafer Level Packaging Historic Market Facts & Figures by Regions
- 4.1.1 Global Top Wafer Level Packaging Regions by Production (2015-2020)
- 4.1.2 Global Top Wafer Level Packaging Regions by Revenue (2015-2020)
- 4.2 North America
- 4.2.1 North America Wafer Level Packaging Production (2015-2020)
- 4.2.2 North America Wafer Level Packaging Revenue (2015-2020)
- 4.2.3 Key Players in North America
- 4.2.4 North America Wafer Level Packaging Import & Export (2015-2020)
- 4.3 Europe
- 4.3.1 Europe Wafer Level Packaging Production (2015-2020)
- 4.3.2 Europe Wafer Level Packaging Revenue (2015-2020)
- 4.3.3 Key Players in Europe
- 4.3.4 Europe Wafer Level Packaging Import & Export (2015-2020)
- 4.4 China
- 4.4.1 China Wafer Level Packaging Production (2015-2020)
- 4.4.2 China Wafer Level Packaging Revenue (2015-2020)
- 4.4.3 Key Players in China
- 4.4.4 China Wafer Level Packaging Import & Export (2015-2020)
- 4.5 Japan
- 4.5.1 Japan Wafer Level Packaging Production (2015-2020)
- 4.5.2 Japan Wafer Level Packaging Revenue (2015-2020)
- 4.5.3 Key Players in Japan
- 4.5.4 Japan Wafer Level Packaging Import & Export (2015-2020)
- 4.6 South Korea
- 4.6.1 South Korea Wafer Level Packaging Production (2015-2020)
- 4.6.2 South Korea Wafer Level Packaging Revenue (2015-2020)
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea Wafer Level Packaging Import & Export (2015-2020)
5 Wafer Level Packaging Consumption by Region
- 5.1 Global Top Wafer Level Packaging Regions by Consumption
- 5.1.1 Global Top Wafer Level Packaging Regions by Consumption (2015-2020)
- 5.1.2 Global Top Wafer Level Packaging Regions Market Share by Consumption (2015-2020)
- 5.2 North America
- 5.2.1 North America Wafer Level Packaging Consumption by Application
- 5.2.2 North America Wafer Level Packaging Consumption by Countries
- 5.2.3 U.S.
- 5.2.4 Canada
- 5.3 Europe
- 5.3.1 Europe Wafer Level Packaging Consumption by Application
- 5.3.2 Europe Wafer Level Packaging Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 U.K.
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific Wafer Level Packaging Consumption by Application
- 5.4.2 Asia Pacific Wafer Level Packaging Consumption by Regions
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Taiwan
- 5.4.9 Indonesia
- 5.4.10 Thailand
- 5.4.11 Malaysia
- 5.4.12 Philippines
- 5.4.13 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America Wafer Level Packaging Consumption by Application
- 5.5.2 Central & South America Wafer Level Packaging Consumption by Country
- 5.5.3 Mexico
- 5.5.3 Brazil
- 5.5.3 Argentina
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa Wafer Level Packaging Consumption by Application
- 5.6.2 Middle East and Africa Wafer Level Packaging Consumption by Countries
- 5.6.3 Turkey
- 5.6.4 Saudi Arabia
- 5.6.5 U.A.E
6 Market Size by Type (2015-2026)
- 6.1 Global Wafer Level Packaging Market Size by Type (2015-2020)
- 6.1.1 Global Wafer Level Packaging Production by Type (2015-2020)
- 6.1.2 Global Wafer Level Packaging Revenue by Type (2015-2020)
- 6.1.3 Wafer Level Packaging Price by Type (2015-2020)
- 6.2 Global Wafer Level Packaging Market Forecast by Type (2021-2026)
- 6.2.1 Global Wafer Level Packaging Production Forecast by Type (2021-2026)
- 6.2.2 Global Wafer Level Packaging Revenue Forecast by Type (2021-2026)
- 6.2.3 Global Wafer Level Packaging Price Forecast by Type (2021-2026)
- 6.3 Global Wafer Level Packaging Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End
7 Market Size by Application (2015-2026)
- 7.2.1 Global Wafer Level Packaging Consumption Historic Breakdown by Application (2015-2020)
- 7.2.2 Global Wafer Level Packaging Consumption Forecast by Application (2021-2026)
8 Corporate Profiles
- 8.1 Amkor Technology Inc
- 8.1.1 Amkor Technology Inc Corporation Information
- 8.1.2 Amkor Technology Inc Overview
- 8.1.3 Amkor Technology Inc Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.1.4 Amkor Technology Inc Product Description
- 8.1.5 Amkor Technology Inc Related Developments
- 8.2 Fujitsu Ltd
- 8.2.1 Fujitsu Ltd Corporation Information
- 8.2.2 Fujitsu Ltd Overview
- 8.2.3 Fujitsu Ltd Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.2.4 Fujitsu Ltd Product Description
- 8.2.5 Fujitsu Ltd Related Developments
- 8.3 Jiangsu Changjiang Electronics
- 8.3.1 Jiangsu Changjiang Electronics Corporation Information
- 8.3.2 Jiangsu Changjiang Electronics Overview
- 8.3.3 Jiangsu Changjiang Electronics Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.3.4 Jiangsu Changjiang Electronics Product Description
- 8.3.5 Jiangsu Changjiang Electronics Related Developments
- 8.4 Deca Technologies
- 8.4.1 Deca Technologies Corporation Information
- 8.4.2 Deca Technologies Overview
- 8.4.3 Deca Technologies Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.4.4 Deca Technologies Product Description
- 8.4.5 Deca Technologies Related Developments
- 8.5 Qualcomm Inc
- 8.5.1 Qualcomm Inc Corporation Information
- 8.5.2 Qualcomm Inc Overview
- 8.5.3 Qualcomm Inc Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.5.4 Qualcomm Inc Product Description
- 8.5.5 Qualcomm Inc Related Developments
- 8.6 Toshiba Corp
- 8.6.1 Toshiba Corp Corporation Information
- 8.6.2 Toshiba Corp Overview
- 8.6.3 Toshiba Corp Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.6.4 Toshiba Corp Product Description
- 8.6.5 Toshiba Corp Related Developments
- 8.7 Tokyo Electron Ltd
- 8.7.1 Tokyo Electron Ltd Corporation Information
- 8.7.2 Tokyo Electron Ltd Overview
- 8.7.3 Tokyo Electron Ltd Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.7.4 Tokyo Electron Ltd Product Description
- 8.7.5 Tokyo Electron Ltd Related Developments
- 8.8 Applied Materials, Inc
- 8.8.1 Applied Materials, Inc Corporation Information
- 8.8.2 Applied Materials, Inc Overview
- 8.8.3 Applied Materials, Inc Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.8.4 Applied Materials, Inc Product Description
- 8.8.5 Applied Materials, Inc Related Developments
- 8.9 ASML Holding NV
- 8.9.1 ASML Holding NV Corporation Information
- 8.9.2 ASML Holding NV Overview
- 8.9.3 ASML Holding NV Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.9.4 ASML Holding NV Product Description
- 8.9.5 ASML Holding NV Related Developments
- 8.10 Lam Research Corp
- 8.10.1 Lam Research Corp Corporation Information
- 8.10.2 Lam Research Corp Overview
- 8.10.3 Lam Research Corp Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.10.4 Lam Research Corp Product Description
- 8.10.5 Lam Research Corp Related Developments
- 8.11 KLA-Tencor Corration
- 8.11.1 KLA-Tencor Corration Corporation Information
- 8.11.2 KLA-Tencor Corration Overview
- 8.11.3 KLA-Tencor Corration Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.11.4 KLA-Tencor Corration Product Description
- 8.11.5 KLA-Tencor Corration Related Developments
- 8.12 China Wafer Level CSP Co. Ltd
- 8.12.1 China Wafer Level CSP Co. Ltd Corporation Information
- 8.12.2 China Wafer Level CSP Co. Ltd Overview
- 8.12.3 China Wafer Level CSP Co. Ltd Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.12.4 China Wafer Level CSP Co. Ltd Product Description
- 8.12.5 China Wafer Level CSP Co. Ltd Related Developments
- 8.13 Marvell Technology Group Ltd
- 8.13.1 Marvell Technology Group Ltd Corporation Information
- 8.13.2 Marvell Technology Group Ltd Overview
- 8.13.3 Marvell Technology Group Ltd Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.13.4 Marvell Technology Group Ltd Product Description
- 8.13.5 Marvell Technology Group Ltd Related Developments
- 8.14 Siliconware Precision Industries
- 8.14.1 Siliconware Precision Industries Corporation Information
- 8.14.2 Siliconware Precision Industries Overview
- 8.14.3 Siliconware Precision Industries Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.14.4 Siliconware Precision Industries Product Description
- 8.14.5 Siliconware Precision Industries Related Developments
- 8.15 Nanium SA
- 8.15.1 Nanium SA Corporation Information
- 8.15.2 Nanium SA Overview
- 8.15.3 Nanium SA Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.15.4 Nanium SA Product Description
- 8.15.5 Nanium SA Related Developments
- 8.16 STATS Chip
- 8.16.1 STATS Chip Corporation Information
- 8.16.2 STATS Chip Overview
- 8.16.3 STATS Chip Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.16.4 STATS Chip Product Description
- 8.16.5 STATS Chip Related Developments
- 8.17 PAC Ltd
- 8.17.1 PAC Ltd Corporation Information
- 8.17.2 PAC Ltd Overview
- 8.17.3 PAC Ltd Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.17.4 PAC Ltd Product Description
- 8.17.5 PAC Ltd Related Developments
9 Wafer Level Packaging Production Forecast by Regions
- 9.1 Global Top Wafer Level Packaging Regions Forecast by Revenue (2021-2026)
- 9.2 Global Top Wafer Level Packaging Regions Forecast by Production (2021-2026)
- 9.3 Key Wafer Level Packaging Production Regions Forecast
- 9.3.1 North America
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
10 Wafer Level Packaging Consumption Forecast by Region
- 10.1 Global Wafer Level Packaging Consumption Forecast by Region (2021-2026)
- 10.2 North America Wafer Level Packaging Consumption Forecast by Region (2021-2026)
- 10.3 Europe Wafer Level Packaging Consumption Forecast by Region (2021-2026)
- 10.4 Asia Pacific Wafer Level Packaging Consumption Forecast by Region (2021-2026)
- 10.5 Latin America Wafer Level Packaging Consumption Forecast by Region (2021-2026)
- 10.6 Middle East and Africa Wafer Level Packaging Consumption Forecast by Region (2021-2026)
11 Value Chain and Sales Channels Analysis
- 11.1 Value Chain Analysis
- 11.2 Sales Channels Analysis
- 11.2.1 Wafer Level Packaging Sales Channels
- 11.2.2 Wafer Level Packaging Distributors
- 11.3 Wafer Level Packaging Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
- 12.1 Wafer Level Packaging Industry
- 12.2 Market Trends
- 12.3 Market Opportunities and Drivers
- 12.4 Market Challenges
- 12.5 Wafer Level Packaging Market Risks/Restraints
- 12.6 Porter's Five Forces Analysis
13 Key Finding in The Global Wafer Level Packaging Study
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.2 Data Source
- 14.2 Author Details
Description
Wafer Level Packaging market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Level Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2015-2026.
Segment by Type, the Wafer Level Packaging market is segmented into
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)
Segment by Application, the Wafer Level Packaging market is segmented into
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)
Regional and Country-level Analysis
The Wafer Level Packaging market is analysed and market size information is provided by regions (countries).
The key regions covered in the Wafer Level Packaging market report are North America, Europe, China, Japan and South Korea. It also covers key regions (countries), viz, the U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of production capacity, price and revenue for the period 2015-2026.
Competitive Landscape and Wafer Level Packaging Market Share Analysis
Wafer Level Packaging market competitive landscape provides details and data information by manufacturers. The report offers comprehensive analysis and accurate statistics on production capacity, price, revenue of Wafer Level Packaging by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on production, revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue, and the production capacity, price, revenue generated in Wafer Level Packaging business, the date to enter into the Wafer Level Packaging market, Wafer Level Packaging product introduction, recent developments, etc.
The major vendors covered:
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd