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Global (United States, European Union and China) Wafer Level Packaging Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Wafer Level Packaging Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 3D TSV WLP
      • 1.3.3 2.5D TSV WLP
      • 1.3.4 WLCSP
      • 1.3.5 Nano WLP
      • 1.3.6 Others ( 2D TSV WLP and Compliant WLP)
    • 1.4 Market Segment by Application
      • 1.4.1 Global Wafer Level Packaging Market Share by Application (2019-2025)
      • 1.4.2 Electronics
      • 1.4.3 IT & Telecommunication
      • 1.4.4 Industrial
      • 1.4.5 Automotive
      • 1.4.6 Aerospace & Defense
      • 1.4.7 Healthcare
      • 1.4.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Wafer Level Packaging Production Value 2014-2025
      • 2.1.2 Global Wafer Level Packaging Production 2014-2025
      • 2.1.3 Global Wafer Level Packaging Capacity 2014-2025
      • 2.1.4 Global Wafer Level Packaging Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Wafer Level Packaging Market Size CAGR of Key Regions
      • 2.2.2 Global Wafer Level Packaging Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Wafer Level Packaging Capacity by Manufacturers
      • 3.1.2 Global Wafer Level Packaging Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Wafer Level Packaging Revenue by Manufacturers (2014-2019)
      • 3.2.2 Wafer Level Packaging Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Wafer Level Packaging Market Concentration Ratio (CR5 and HHI)
    • 3.3 Wafer Level Packaging Price by Manufacturers
    • 3.4 Key Manufacturers Wafer Level Packaging Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Wafer Level Packaging Market
    • 3.6 Key Manufacturers Wafer Level Packaging Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 3D TSV WLP Production and Production Value (2014-2019)
      • 4.1.2 2.5D TSV WLP Production and Production Value (2014-2019)
      • 4.1.3 WLCSP Production and Production Value (2014-2019)
      • 4.1.4 Nano WLP Production and Production Value (2014-2019)
      • 4.1.5 Others ( 2D TSV WLP and Compliant WLP) Production and Production Value (2014-2019)
    • 4.2 Global Wafer Level Packaging Production Market Share by Type
    • 4.3 Global Wafer Level Packaging Production Value Market Share by Type
    • 4.4 Wafer Level Packaging Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Wafer Level Packaging Consumption by Application

    6 Production by Regions

    • 6.1 Global Wafer Level Packaging Production (History Data) by Regions 2014-2019
    • 6.2 Global Wafer Level Packaging Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Wafer Level Packaging Production Growth Rate 2014-2019
      • 6.3.2 United States Wafer Level Packaging Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Wafer Level Packaging Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Wafer Level Packaging Production Growth Rate 2014-2019
      • 6.4.2 European Union Wafer Level Packaging Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Wafer Level Packaging Import & Export
    • 6.5 China
      • 6.5.1 China Wafer Level Packaging Production Growth Rate 2014-2019
      • 6.5.2 China Wafer Level Packaging Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Wafer Level Packaging Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Wafer Level Packaging Consumption by Regions

    • 7.1 Global Wafer Level Packaging Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Wafer Level Packaging Consumption by Type
      • 7.2.2 United States Wafer Level Packaging Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Wafer Level Packaging Consumption by Type
      • 7.3.2 European Union Wafer Level Packaging Consumption by Application
    • 7.4 China
      • 7.4.1 China Wafer Level Packaging Consumption by Type
      • 7.4.2 China Wafer Level Packaging Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Wafer Level Packaging Consumption by Type
      • 7.5.2 Rest of World Wafer Level Packaging Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Amkor Technology Inc
      • 8.1.1 Amkor Technology Inc Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Wafer Level Packaging
      • 8.1.4 Wafer Level Packaging Product Introduction
      • 8.1.5 Amkor Technology Inc Recent Development
    • 8.2 Fujitsu Ltd
      • 8.2.1 Fujitsu Ltd Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Wafer Level Packaging
      • 8.2.4 Wafer Level Packaging Product Introduction
      • 8.2.5 Fujitsu Ltd Recent Development
    • 8.3 Jiangsu Changjiang Electronics
      • 8.3.1 Jiangsu Changjiang Electronics Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Wafer Level Packaging
      • 8.3.4 Wafer Level Packaging Product Introduction
      • 8.3.5 Jiangsu Changjiang Electronics Recent Development
    • 8.4 Deca Technologies
      • 8.4.1 Deca Technologies Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Wafer Level Packaging
      • 8.4.4 Wafer Level Packaging Product Introduction
      • 8.4.5 Deca Technologies Recent Development
    • 8.5 Qualcomm Inc
      • 8.5.1 Qualcomm Inc Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Wafer Level Packaging
      • 8.5.4 Wafer Level Packaging Product Introduction
      • 8.5.5 Qualcomm Inc Recent Development
    • 8.6 Toshiba Corp
      • 8.6.1 Toshiba Corp Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Wafer Level Packaging
      • 8.6.4 Wafer Level Packaging Product Introduction
      • 8.6.5 Toshiba Corp Recent Development
    • 8.7 Tokyo Electron Ltd
      • 8.7.1 Tokyo Electron Ltd Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Wafer Level Packaging
      • 8.7.4 Wafer Level Packaging Product Introduction
      • 8.7.5 Tokyo Electron Ltd Recent Development
    • 8.8 Applied Materials, Inc
      • 8.8.1 Applied Materials, Inc Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Wafer Level Packaging
      • 8.8.4 Wafer Level Packaging Product Introduction
      • 8.8.5 Applied Materials, Inc Recent Development
    • 8.9 ASML Holding NV
      • 8.9.1 ASML Holding NV Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Wafer Level Packaging
      • 8.9.4 Wafer Level Packaging Product Introduction
      • 8.9.5 ASML Holding NV Recent Development
    • 8.10 Lam Research Corp
      • 8.10.1 Lam Research Corp Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Wafer Level Packaging
      • 8.10.4 Wafer Level Packaging Product Introduction
      • 8.10.5 Lam Research Corp Recent Development
    • 8.11 KLA-Tencor Corration
    • 8.12 China Wafer Level CSP Co. Ltd
    • 8.13 Marvell Technology Group Ltd
    • 8.14 Siliconware Precision Industries
    • 8.15 Nanium SA
    • 8.16 STATS Chip
    • 8.17 PAC Ltd

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Wafer Level Packaging Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Wafer Level Packaging Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Wafer Level Packaging Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Wafer Level Packaging Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Wafer Level Packaging Production Forecast by Type
      • 9.7.2 Global Wafer Level Packaging Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Wafer Level Packaging Sales Channels
      • 10.2.2 Wafer Level Packaging Distributors
    • 10.3 Wafer Level Packaging Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

      Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

      There is no single industry-standard method of wafer-level packaging at present.

      A major application area of WLPs are smartphones due to the size constraints.
      In 2019, the market size of Wafer Level Packaging is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wafer Level Packaging.

      This report studies the global market size of Wafer Level Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Wafer Level Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Amkor Technology Inc
      Fujitsu Ltd
      Jiangsu Changjiang Electronics
      Deca Technologies
      Qualcomm Inc
      Toshiba Corp
      Tokyo Electron Ltd
      Applied Materials, Inc
      ASML Holding NV
      Lam Research Corp
      KLA-Tencor Corration
      China Wafer Level CSP Co. Ltd
      Marvell Technology Group Ltd
      Siliconware Precision Industries
      Nanium SA
      STATS Chip
      PAC Ltd

      Market Segment by Product Type
      3D TSV WLP
      2.5D TSV WLP
      WLCSP
      Nano WLP
      Others ( 2D TSV WLP and Compliant WLP)

      Market Segment by Application
      Electronics
      IT & Telecommunication
      Industrial
      Automotive
      Aerospace & Defense
      Healthcare
      Others (Media & Entertainment and Non-Conventional Energy Resources)

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Wafer Level Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Wafer Level Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Wafer Level Packaging are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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