Wafer Level Packaging Market Report – Research, Industry Analysis Reports and Market Demands

Global Wafer Level Packaging Market Insights, Forecast to 2025

Request for Sample of this report

Buy now

Table of Content

1 Study Coverage

1.1 Wafer Level Packaging Product
1.2 Key Market Segments in This Study
1.3 Key Manufacturers Covered
1.4 Market by Type
- 1.4.1 Global Wafer Level Packaging Market Size Growth Rate by Type
- 1.4.2 3D TSV WLP
- 1.4.3 2.5D TSV WLP
- 1.4.4 WLCSP
- 1.4.5 Nano WLP
- 1.4.6 Others ( 2D TSV WLP and Compliant WLP)
1.5 Market by Application
- 1.5.1 Global Wafer Level Packaging Market Size Growth Rate by Application
- 1.5.2 Electronics
- 1.5.3 IT & Telecommunication
- 1.5.4 Industrial
- 1.5.5 Automotive
- 1.5.6 Aerospace & Defense
- 1.5.7 Healthcare
- 1.5.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
1.6 Study Objectives
1.7 Years Considered

2 Executive Summary

2.1 Global Wafer Level Packaging Market Size
- 2.1.1 Global Wafer Level Packaging Revenue 2014-2025
- 2.1.2 Global Wafer Level Packaging Production 2014-2025
2.2 Wafer Level Packaging Growth Rate (CAGR) 2019-2025
2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Key Wafer Level Packaging Manufacturers
  - 2.3.2.1 Wafer Level Packaging Manufacturing Base Distribution, Headquarters
  - 2.3.2.2 Manufacturers Wafer Level Packaging Product Offered
  - 2.3.2.3 Date of Manufacturers Enter into Wafer Level Packaging Market
2.4 Key Trends for Wafer Level Packaging Markets & Products

3 Market Size by Manufacturers

3.1 Wafer Level Packaging Production by Manufacturers
- 3.1.1 Wafer Level Packaging Production by Manufacturers
- 3.1.2 Wafer Level Packaging Production Market Share by Manufacturers
3.2 Wafer Level Packaging Revenue by Manufacturers
- 3.2.1 Wafer Level Packaging Revenue by Manufacturers (2014-2019)
- 3.2.2 Wafer Level Packaging Revenue Share by Manufacturers (2014-2019)
3.3 Wafer Level Packaging Price by Manufacturers
3.4 Mergers & Acquisitions, Expansion Plans

4 Wafer Level Packaging Production by Regions

4.1 Global Wafer Level Packaging Production by Regions
- 4.1.1 Global Wafer Level Packaging Production Market Share by Regions
- 4.1.2 Global Wafer Level Packaging Revenue Market Share by Regions
4.2 United States
- 4.2.1 United States Wafer Level Packaging Production
- 4.2.2 United States Wafer Level Packaging Revenue
- 4.2.3 Key Players in United States
- 4.2.4 United States Wafer Level Packaging Import & Export
4.3 Europe
- 4.3.1 Europe Wafer Level Packaging Production
- 4.3.2 Europe Wafer Level Packaging Revenue
- 4.3.3 Key Players in Europe
- 4.3.4 Europe Wafer Level Packaging Import & Export
4.4 China
- 4.4.1 China Wafer Level Packaging Production
- 4.4.2 China Wafer Level Packaging Revenue
- 4.4.3 Key Players in China
- 4.4.4 China Wafer Level Packaging Import & Export
4.5 Japan
- 4.5.1 Japan Wafer Level Packaging Production
- 4.5.2 Japan Wafer Level Packaging Revenue
- 4.5.3 Key Players in Japan
- 4.5.4 Japan Wafer Level Packaging Import & Export
4.6 South Korea
- 4.6.1 South Korea Wafer Level Packaging Production
- 4.6.2 South Korea Wafer Level Packaging Revenue
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea Wafer Level Packaging Import & Export
4.7 Other Regions
- 4.7.1 Taiwan
- 4.7.2 India
- 4.7.3 Southeast Asia

5 Wafer Level Packaging Consumption by Regions

5.1 Global Wafer Level Packaging Consumption by Regions
- 5.1.1 Global Wafer Level Packaging Consumption by Regions
- 5.1.2 Global Wafer Level Packaging Consumption Market Share by Regions
5.2 North America
- 5.2.1 North America Wafer Level Packaging Consumption by Application
- 5.2.2 North America Wafer Level Packaging Consumption by Countries
- 5.2.3 United States
- 5.2.4 Canada
- 5.2.5 Mexico
5.3 Europe
- 5.3.1 Europe Wafer Level Packaging Consumption by Application
- 5.3.2 Europe Wafer Level Packaging Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 UK
- 5.3.6 Italy
- 5.3.7 Russia
5.4 Asia Pacific
- 5.4.1 Asia Pacific Wafer Level Packaging Consumption by Application
- 5.4.2 Asia Pacific Wafer Level Packaging Consumption by Countries
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Indonesia
- 5.4.9 Thailand
- 5.4.10 Malaysia
- 5.4.11 Philippines
- 5.4.12 Vietnam
5.5 Central & South America
- 5.5.1 Central & South America Wafer Level Packaging Consumption by Application
- 5.5.2 Central & South America Wafer Level Packaging Consumption by Country
- 5.5.3 Brazil
5.6 Middle East and Africa
- 5.6.1 Middle East and Africa Wafer Level Packaging Consumption by Application
- 5.6.2 Middle East and Africa Wafer Level Packaging Consumption by Countries
- 5.6.3 GCC Countries
- 5.6.4 Egypt
- 5.6.5 South Africa

6 Market Size by Type

6.1 Global Wafer Level Packaging Production by Type
6.2 Global Wafer Level Packaging Revenue by Type
6.3 Wafer Level Packaging Price by Type

7 Market Size by Application

7.1 Overview
7.2 Global Wafer Level Packaging Breakdown Dada by Application
- 7.2.1 Global Wafer Level Packaging Consumption by Application
- 7.2.2 Global Wafer Level Packaging Consumption Market Share by Application (2014-2019)

8 Manufacturers Profiles

9 Production Forecasts

9.1 Wafer Level Packaging Production and Revenue Forecast
- 9.1.1 Global Wafer Level Packaging Production Forecast 2019-2025
- 9.1.2 Global Wafer Level Packaging Revenue Forecast 2019-2025
9.2 Wafer Level Packaging Production and Revenue Forecast by Regions
- 9.2.1 Global Wafer Level Packaging Revenue Forecast by Regions
- 9.2.2 Global Wafer Level Packaging Production Forecast by Regions
9.3 Wafer Level Packaging Key Producers Forecast
- 9.3.1 United States
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
9.4 Forecast by Type
- 9.4.1 Global Wafer Level Packaging Production Forecast by Type
- 9.4.2 Global Wafer Level Packaging Revenue Forecast by Type

10 Consumption Forecast

10.1 Wafer Level Packaging Consumption Forecast by Application
10.2 Wafer Level Packaging Consumption Forecast by Regions
10.3 North America Market Consumption Forecast
- 10.3.1 North America Wafer Level Packaging Consumption Forecast by Regions 2019-2025
- 10.3.2 United States
- 10.3.3 Canada
- 10.3.4 Mexico
10.4 Europe Market Consumption Forecast
- 10.4.1 Europe Wafer Level Packaging Consumption Forecast by Regions 2019-2025
- 10.4.2 Germany
- 10.4.3 France
- 10.4.4 UK
- 10.4.5 Italy
- 10.4.6 Russia
10.5 Asia Pacific Market Consumption Forecast
- 10.5.1 Asia Pacific Wafer Level Packaging Consumption Forecast by Regions 2019-2025
- 10.5.2 China
- 10.5.3 Japan
- 10.5.4 South Korea
- 10.5.5 India
- 10.5.6 Australia
- 10.5.7 Indonesia
- 10.5.8 Thailand
- 10.5.9 Malaysia
- 10.5.10 Philippines
- 10.5.11 Vietnam
10.6 Central & South America Market Consumption Forecast
- 10.6.1 Central & South America Wafer Level Packaging Consumption Forecast by Regions 2019-2025
- 10.6.2 Brazil
10.7 Middle East and Africa Market Consumption Forecast
- 10.7.1 Middle East and Africa Wafer Level Packaging Consumption Forecast by Regions 2019-2025
- 10.7.2 GCC Countries
- 10.7.3 Egypt
- 10.7.4 South Africa

11 Value Chain and Sales Channels Analysis

11.1 Value Chain Analysis
11.2 Sales Channels Analysis
- 11.2.1 Wafer Level Packaging Sales Channels
- 11.2.2 Wafer Level Packaging Distributors
11.3 Wafer Level Packaging Customers

12 Market Opportunities & Challenges, Risks and Influences Factors Analysis

12.1 Market Opportunities and Drivers
12.2 Market Challenges
12.3 Market Risks/Restraints

13 Key Findings in the Global Wafer Level Packaging Study

14 Appendix

14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
  - 14.1.1.1 Research Programs/Design
  - 14.1.1.2 Market Size Estimation
  - 14.1.1.3 Market Breakdown and Data Triangulation
- 14.1.2 Data Source
  - 14.1.2.1 Secondary Sources
  - 14.1.2.2 Primary Sources
14.2 Author Details

Description

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

There is no single industry-standard method of wafer-level packaging at present.

A major application area of WLPs are smartphones due to the size constraints.
The Wafer Level Packaging market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wafer Level Packaging.

This report presents the worldwide Wafer Level Packaging market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd

Wafer Level Packaging Breakdown Data by Type
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)
Wafer Level Packaging Breakdown Data by Application
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)

Wafer Level Packaging Production by Region
United States
Europe
China
Japan
South Korea
Other Regions

Wafer Level Packaging Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

The study objectives are:
To analyze and research the global Wafer Level Packaging status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Wafer Level Packaging manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Wafer Level Packaging :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025

This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Wafer Level Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.