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Global Wafer Level Packaging Market Research Report 2019

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Table of Contents

    Executive Summary

      1 Wafer Level Packaging Market Overview

      • 1.1 Product Overview and Scope of Wafer Level Packaging
      • 1.2 Wafer Level Packaging Segment by Type
        • 1.2.1 Global Wafer Level Packaging Production Growth Rate Comparison by Type (2014-2025)
        • 1.2.2 3D TSV WLP
        • 1.2.3 2.5D TSV WLP
        • 1.2.4 WLCSP
        • 1.2.5 Nano WLP
        • 1.2.6 Others ( 2D TSV WLP and Compliant WLP)
      • 1.3 Wafer Level Packaging Segment by Application
        • 1.3.1 Wafer Level Packaging Consumption Comparison by Application (2014-2025)
        • 1.3.2 Electronics
        • 1.3.3 IT & Telecommunication
        • 1.3.4 Industrial
        • 1.3.5 Automotive
        • 1.3.6 Aerospace & Defense
        • 1.3.7 Healthcare
        • 1.3.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
      • 1.4 Global Wafer Level Packaging Market by Region
        • 1.4.1 Global Wafer Level Packaging Market Size Region
        • 1.4.2 North America Status and Prospect (2014-2025)
        • 1.4.3 Europe Status and Prospect (2014-2025)
        • 1.4.4 China Status and Prospect (2014-2025)
        • 1.4.5 Japan Status and Prospect (2014-2025)
      • 1.5 Global Wafer Level Packaging Market Size
        • 1.5.1 Global Wafer Level Packaging Revenue (2014-2025)
        • 1.5.2 Global Wafer Level Packaging Production (2014-2025)

      2 Global Wafer Level Packaging Market Competition by Manufacturers

      • 2.1 Global Wafer Level Packaging Production Market Share by Manufacturers (2014-2019)
      • 2.2 Global Wafer Level Packaging Revenue Share by Manufacturers (2014-2019)
      • 2.3 Global Wafer Level Packaging Average Price by Manufacturers (2014-2019)
      • 2.4 Manufacturers Wafer Level Packaging Production Sites, Area Served, Product Types
      • 2.5 Wafer Level Packaging Market Competitive Situation and Trends
        • 2.5.1 Wafer Level Packaging Market Concentration Rate
        • 2.5.2 Wafer Level Packaging Market Share of Top 3 and Top 5 Manufacturers
        • 2.5.3 Mergers & Acquisitions, Expansion

      3 Global Wafer Level Packaging Production Market Share by Regions

      • 3.1 Global Wafer Level Packaging Production Market Share by Regions
      • 3.2 Global Wafer Level Packaging Revenue Market Share by Regions (2014-2019)
      • 3.3 Global Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.4 North America Wafer Level Packaging Production
        • 3.4.1 North America Wafer Level Packaging Production Growth Rate (2014-2019)
        • 3.4.2 North America Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.5 Europe Wafer Level Packaging Production
        • 3.5.1 Europe Wafer Level Packaging Production Growth Rate (2014-2019)
        • 3.5.2 Europe Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.6 China Wafer Level Packaging Production (2014-2019)
        • 3.6.1 China Wafer Level Packaging Production Growth Rate (2014-2019)
        • 3.6.2 China Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.7 Japan Wafer Level Packaging Production (2014-2019)
        • 3.7.1 Japan Wafer Level Packaging Production Growth Rate (2014-2019)
        • 3.7.2 Japan Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)

      4 Global Wafer Level Packaging Consumption by Regions

      • 4.1 Global Wafer Level Packaging Consumption by Regions
      • 4.2 North America Wafer Level Packaging Consumption (2014-2019)
      • 4.3 Europe Wafer Level Packaging Consumption (2014-2019)
      • 4.4 China Wafer Level Packaging Consumption (2014-2019)
      • 4.5 Japan Wafer Level Packaging Consumption (2014-2019)

      5 Global Wafer Level Packaging Production, Revenue, Price Trend by Type

      • 5.1 Global Wafer Level Packaging Production Market Share by Type (2014-2019)
      • 5.2 Global Wafer Level Packaging Revenue Market Share by Type (2014-2019)
      • 5.3 Global Wafer Level Packaging Price by Type (2014-2019)
      • 5.4 Global Wafer Level Packaging Production Growth by Type (2014-2019)

      6 Global Wafer Level Packaging Market Analysis by Applications

      • 6.1 Global Wafer Level Packaging Consumption Market Share by Application (2014-2019)
      • 6.2 Global Wafer Level Packaging Consumption Growth Rate by Application (2014-2019)

      7 Company Profiles and Key Figures in Wafer Level Packaging Business

      • 7.1 Amkor Technology Inc
        • 7.1.1 Amkor Technology Inc Wafer Level Packaging Production Sites and Area Served
        • 7.1.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.1.3 Amkor Technology Inc Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.1.4 Main Business and Markets Served
      • 7.2 Fujitsu Ltd
        • 7.2.1 Fujitsu Ltd Wafer Level Packaging Production Sites and Area Served
        • 7.2.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.2.3 Fujitsu Ltd Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.2.4 Main Business and Markets Served
      • 7.3 Jiangsu Changjiang Electronics
        • 7.3.1 Jiangsu Changjiang Electronics Wafer Level Packaging Production Sites and Area Served
        • 7.3.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.3.3 Jiangsu Changjiang Electronics Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.3.4 Main Business and Markets Served
      • 7.4 Deca Technologies
        • 7.4.1 Deca Technologies Wafer Level Packaging Production Sites and Area Served
        • 7.4.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.4.3 Deca Technologies Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.4.4 Main Business and Markets Served
      • 7.5 Qualcomm Inc
        • 7.5.1 Qualcomm Inc Wafer Level Packaging Production Sites and Area Served
        • 7.5.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.5.3 Qualcomm Inc Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.5.4 Main Business and Markets Served
      • 7.6 Toshiba Corp
        • 7.6.1 Toshiba Corp Wafer Level Packaging Production Sites and Area Served
        • 7.6.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.6.3 Toshiba Corp Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.6.4 Main Business and Markets Served
      • 7.7 Tokyo Electron Ltd
        • 7.7.1 Tokyo Electron Ltd Wafer Level Packaging Production Sites and Area Served
        • 7.7.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.7.3 Tokyo Electron Ltd Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.7.4 Main Business and Markets Served
      • 7.8 Applied Materials, Inc
        • 7.8.1 Applied Materials, Inc Wafer Level Packaging Production Sites and Area Served
        • 7.8.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.8.3 Applied Materials, Inc Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.8.4 Main Business and Markets Served
      • 7.9 ASML Holding NV
        • 7.9.1 ASML Holding NV Wafer Level Packaging Production Sites and Area Served
        • 7.9.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.9.3 ASML Holding NV Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.9.4 Main Business and Markets Served
      • 7.10 Lam Research Corp
        • 7.10.1 Lam Research Corp Wafer Level Packaging Production Sites and Area Served
        • 7.10.2 Wafer Level Packaging Product Introduction, Application and Specification
        • 7.10.3 Lam Research Corp Wafer Level Packaging Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.10.4 Main Business and Markets Served
      • 7.11 KLA-Tencor Corration
      • 7.12 China Wafer Level CSP Co. Ltd
      • 7.13 Marvell Technology Group Ltd
      • 7.14 Siliconware Precision Industries
      • 7.15 Nanium SA
      • 7.16 STATS Chip
      • 7.17 PAC Ltd

      8 Wafer Level Packaging Manufacturing Cost Analysis

      • 8.1 Wafer Level Packaging Key Raw Materials Analysis
        • 8.1.1 Key Raw Materials
        • 8.1.2 Price Trend of Key Raw Materials
        • 8.1.3 Key Suppliers of Raw Materials
      • 8.2 Proportion of Manufacturing Cost Structure
      • 8.3 Manufacturing Process Analysis of Wafer Level Packaging
      • 8.4 Wafer Level Packaging Industrial Chain Analysis

      9 Marketing Channel, Distributors and Customers

      • 9.1 Marketing Channel
        • 9.1.1 Direct Marketing
        • 9.1.2 Indirect Marketing
      • 9.2 Wafer Level Packaging Distributors List
      • 9.3 Wafer Level Packaging Customers

      10 Market Dynamics

      • 10.1 Market Trends
      • 10.2 Opportunities
      • 10.3 Market Drivers
      • 10.4 Challenges
      • 10.5 Influence Factors

      11 Global Wafer Level Packaging Market Forecast

      • 11.1 Global Wafer Level Packaging Production, Revenue Forecast
        • 11.1.1 Global Wafer Level Packaging Production Growth Rate Forecast (2019-2025)
        • 11.1.2 Global Wafer Level Packaging Revenue and Growth Rate Forecast (2019-2025)
        • 11.1.3 Global Wafer Level Packaging Price and Trend Forecast (2019-2025)
      • 11.2 Global Wafer Level Packaging Production Forecast by Regions (2019-2025)
        • 11.2.1 North America Wafer Level Packaging Production, Revenue Forecast (2019-2025)
        • 11.2.2 Europe Wafer Level Packaging Production, Revenue Forecast (2019-2025)
        • 11.2.3 China Wafer Level Packaging Production, Revenue Forecast (2019-2025)
        • 11.2.4 Japan Wafer Level Packaging Production, Revenue Forecast (2019-2025)
      • 11.3 Global Wafer Level Packaging Consumption Forecast by Regions (2019-2025)
        • 11.3.1 North America Wafer Level Packaging Consumption Forecast (2019-2025)
        • 11.3.2 Europe Wafer Level Packaging Consumption Forecast (2019-2025)
        • 11.3.3 China Wafer Level Packaging Consumption Forecast (2019-2025)
        • 11.3.4 Japan Wafer Level Packaging Consumption Forecast (2019-2025)
      • 11.4 Global Wafer Level Packaging Production, Revenue and Price Forecast by Type (2019-2025)
      • 11.5 Global Wafer Level Packaging Consumption Forecast by Application (2019-2025)

      12 Research Findings and Conclusion

        13 Methodology and Data Source

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

        Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

        There is no single industry-standard method of wafer-level packaging at present.

        A major application area of WLPs are smartphones due to the size constraints.

        The global Wafer Level Packaging market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on Wafer Level Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Level Packaging market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
        At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

        The following manufacturers are covered:
        Amkor Technology Inc
        Fujitsu Ltd
        Jiangsu Changjiang Electronics
        Deca Technologies
        Qualcomm Inc
        Toshiba Corp
        Tokyo Electron Ltd
        Applied Materials, Inc
        ASML Holding NV
        Lam Research Corp
        KLA-Tencor Corration
        China Wafer Level CSP Co. Ltd
        Marvell Technology Group Ltd
        Siliconware Precision Industries
        Nanium SA
        STATS Chip
        PAC Ltd

        Segment by Regions
        North America
        Europe
        China
        Japan

        Segment by Type
        3D TSV WLP
        2.5D TSV WLP
        WLCSP
        Nano WLP
        Others ( 2D TSV WLP and Compliant WLP)

        Segment by Application
        Electronics
        IT & Telecommunication
        Industrial
        Automotive
        Aerospace & Defense
        Healthcare
        Others (Media & Entertainment and Non-Conventional Energy Resources)

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