Copyright Reports & Markets. All rights reserved.

Global Wafer Grinding Equipment Market Professional Survey Report 2019

Request for Sample of this report
Buy now

Table of Contents

    Executive Summary

      1 Industry Overview of Wafer Grinding Equipment

      • 1.1 Definition of Wafer Grinding Equipment
      • 1.2 Wafer Grinding Equipment Segment by Type
        • 1.2.1 Global Wafer Grinding Equipment Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 Wafer Edge Grinder
        • 1.2.3 Wafer Surface Grinder
      • 1.3 Wafer Grinding Equipment Segment by Applications
        • 1.3.1 Global Wafer Grinding Equipment Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Semiconductor
        • 1.3.3 Photovoltaic
      • 1.4 Global Wafer Grinding Equipment Overall Market
        • 1.4.1 Global Wafer Grinding Equipment Revenue (2014-2025)
        • 1.4.2 Global Wafer Grinding Equipment Production (2014-2025)
        • 1.4.3 North America Wafer Grinding Equipment Status and Prospect (2014-2025)
        • 1.4.4 Europe Wafer Grinding Equipment Status and Prospect (2014-2025)
        • 1.4.5 China Wafer Grinding Equipment Status and Prospect (2014-2025)
        • 1.4.6 Japan Wafer Grinding Equipment Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia Wafer Grinding Equipment Status and Prospect (2014-2025)
        • 1.4.8 India Wafer Grinding Equipment Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of Wafer Grinding Equipment
      • 2.3 Manufacturing Process Analysis of Wafer Grinding Equipment
      • 2.4 Industry Chain Structure of Wafer Grinding Equipment

      3 Development and Manufacturing Plants Analysis of Wafer Grinding Equipment

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global Wafer Grinding Equipment Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of Wafer Grinding Equipment
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 Wafer Grinding Equipment Production and Capacity Analysis
      • 4.2 Wafer Grinding Equipment Revenue Analysis
      • 4.3 Wafer Grinding Equipment Price Analysis
      • 4.4 Market Concentration Degree

      5 Wafer Grinding Equipment Regional Market Analysis

      • 5.1 Wafer Grinding Equipment Production by Regions
        • 5.1.1 Global Wafer Grinding Equipment Production by Regions
        • 5.1.2 Global Wafer Grinding Equipment Revenue by Regions
      • 5.2 Wafer Grinding Equipment Consumption by Regions
      • 5.3 North America Wafer Grinding Equipment Market Analysis
        • 5.3.1 North America Wafer Grinding Equipment Production
        • 5.3.2 North America Wafer Grinding Equipment Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America Wafer Grinding Equipment Import and Export
      • 5.4 Europe Wafer Grinding Equipment Market Analysis
        • 5.4.1 Europe Wafer Grinding Equipment Production
        • 5.4.2 Europe Wafer Grinding Equipment Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe Wafer Grinding Equipment Import and Export
      • 5.5 China Wafer Grinding Equipment Market Analysis
        • 5.5.1 China Wafer Grinding Equipment Production
        • 5.5.2 China Wafer Grinding Equipment Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China Wafer Grinding Equipment Import and Export
      • 5.6 Japan Wafer Grinding Equipment Market Analysis
        • 5.6.1 Japan Wafer Grinding Equipment Production
        • 5.6.2 Japan Wafer Grinding Equipment Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan Wafer Grinding Equipment Import and Export
      • 5.7 Southeast Asia Wafer Grinding Equipment Market Analysis
        • 5.7.1 Southeast Asia Wafer Grinding Equipment Production
        • 5.7.2 Southeast Asia Wafer Grinding Equipment Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia Wafer Grinding Equipment Import and Export
      • 5.8 India Wafer Grinding Equipment Market Analysis
        • 5.8.1 India Wafer Grinding Equipment Production
        • 5.8.2 India Wafer Grinding Equipment Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India Wafer Grinding Equipment Import and Export

      6 Wafer Grinding Equipment Segment Market Analysis (by Type)

      • 6.1 Global Wafer Grinding Equipment Production by Type
      • 6.2 Global Wafer Grinding Equipment Revenue by Type
      • 6.3 Wafer Grinding Equipment Price by Type

      7 Wafer Grinding Equipment Segment Market Analysis (by Application)

      • 7.1 Global Wafer Grinding Equipment Consumption by Application
      • 7.2 Global Wafer Grinding Equipment Consumption Market Share by Application (2014-2019)

      8 Wafer Grinding Equipment Major Manufacturers Analysis

      • 8.1 Okamoto Semiconductor Equipment Division
        • 8.1.1 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Production Sites and Area Served
        • 8.1.2 Okamoto Semiconductor Equipment Division Product Introduction, Application and Specification
        • 8.1.3 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Strasbaugh
        • 8.2.1 Strasbaugh Wafer Grinding Equipment Production Sites and Area Served
        • 8.2.2 Strasbaugh Product Introduction, Application and Specification
        • 8.2.3 Strasbaugh Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 Disco
        • 8.3.1 Disco Wafer Grinding Equipment Production Sites and Area Served
        • 8.3.2 Disco Product Introduction, Application and Specification
        • 8.3.3 Disco Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH
        • 8.4.1 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding Equipment Production Sites and Area Served
        • 8.4.2 G&N Genauigkeits Maschinenbau Nürnberg GmbH Product Introduction, Application and Specification
        • 8.4.3 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 GigaMat
        • 8.5.1 GigaMat Wafer Grinding Equipment Production Sites and Area Served
        • 8.5.2 GigaMat Product Introduction, Application and Specification
        • 8.5.3 GigaMat Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 Arnold Gruppe
        • 8.6.1 Arnold Gruppe Wafer Grinding Equipment Production Sites and Area Served
        • 8.6.2 Arnold Gruppe Product Introduction, Application and Specification
        • 8.6.3 Arnold Gruppe Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 Hunan Yujing Machine Industrial
        • 8.7.1 Hunan Yujing Machine Industrial Wafer Grinding Equipment Production Sites and Area Served
        • 8.7.2 Hunan Yujing Machine Industrial Product Introduction, Application and Specification
        • 8.7.3 Hunan Yujing Machine Industrial Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 WAIDA MFG
        • 8.8.1 WAIDA MFG Wafer Grinding Equipment Production Sites and Area Served
        • 8.8.2 WAIDA MFG Product Introduction, Application and Specification
        • 8.8.3 WAIDA MFG Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 SpeedFam
        • 8.9.1 SpeedFam Wafer Grinding Equipment Production Sites and Area Served
        • 8.9.2 SpeedFam Product Introduction, Application and Specification
        • 8.9.3 SpeedFam Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 Koyo Machinery
        • 8.10.1 Koyo Machinery Wafer Grinding Equipment Production Sites and Area Served
        • 8.10.2 Koyo Machinery Product Introduction, Application and Specification
        • 8.10.3 Koyo Machinery Wafer Grinding Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served
      • 8.11 ACCRETECH
      • 8.12 Daitron
      • 8.13 MAT Inc.
      • 8.14 Dikema Presicion Machinery
      • 8.15 Dynavest
      • 8.16 Komatsu NTC

      9 Development Trend of Analysis of Wafer Grinding Equipment Market

      • 9.1 Global Wafer Grinding Equipment Market Trend Analysis
        • 9.1.1 Global Wafer Grinding Equipment Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 Wafer Grinding Equipment Regional Market Trend
        • 9.2.1 North America Wafer Grinding Equipment Forecast 2019-2025
        • 9.2.2 Europe Wafer Grinding Equipment Forecast 2019-2025
        • 9.2.3 China Wafer Grinding Equipment Forecast 2019-2025
        • 9.2.4 Japan Wafer Grinding Equipment Forecast 2019-2025
        • 9.2.5 Southeast Asia Wafer Grinding Equipment Forecast 2019-2025
        • 9.2.6 India Wafer Grinding Equipment Forecast 2019-2025
      • 9.3 Wafer Grinding Equipment Market Trend (Product Type)
      • 9.4 Wafer Grinding Equipment Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 Wafer Grinding Equipment Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.

        The global Wafer Grinding Equipment market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on Wafer Grinding Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Grinding Equipment market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of Wafer Grinding Equipment in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their Wafer Grinding Equipment manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        Okamoto Semiconductor Equipment Division
        Strasbaugh
        Disco
        G&N Genauigkeits Maschinenbau Nürnberg GmbH
        GigaMat
        Arnold Gruppe
        Hunan Yujing Machine Industrial
        WAIDA MFG
        SpeedFam
        Koyo Machinery
        ACCRETECH
        Daitron
        MAT Inc.
        Dikema Presicion Machinery
        Dynavest
        Komatsu NTC

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        Wafer Edge Grinder
        Wafer Surface Grinder

        Segment by Application
        Semiconductor
        Photovoltaic

        Buy now