Global Underfills for CSP and BGA Market Report, History and Forecast 2017-2028, Breakdown Data by Manufacturers, Key Regions, Types and Application
1 Underfills for CSP and BGA Market Overview
- 1.1 Underfills for CSP and BGA Product Overview
- 1.2 Underfills for CSP and BGA Market Segment by Type
- 1.2.1 Low Viscosity
2 Global Underfills for CSP and BGA Market Competition by Company
- 2.1 Global Top Players by Underfills for CSP and BGA Sales (2017-2022)
- 2.2 Global Top Players by Underfills for CSP and BGA Revenue (2017-2022)
- 2.3 Global Top Players Underfills for CSP and BGA Price (2017-2022)
- 2.4 Global Top Manufacturers Underfills for CSP and BGA Manufacturing Base Distribution, Sales Area, Product Type
- 2.5 Underfills for CSP and BGA Market Competitive Situation and Trends
- 2.5.1 Underfills for CSP and BGA Market Concentration Rate (2017-2022)
3 Underfills for CSP and BGA Status and Outlook by Region
- 3.1 Global Underfills for CSP and BGA Market Size and CAGR by Region: 2017 VS 2021 VS 2028
- 3.2 Global Underfills for CSP and BGA Historic Market Size by Region
- 3.2.1 Global Underfills for CSP and BGA Sales in Volume by Region (2017-2022)
4 Global Underfills for CSP and BGA by Application
- 4.1 Underfills for CSP and BGA Market Segment by Application
- 4.1.1 CSP
5 North America Underfills for CSP and BGA by Country
- 5.1 North America Underfills for CSP and BGA Historic Market Size by Country
- 5.1.1 North America Underfills for CSP and BGA Sales in Volume by Country (2017-2022)
6 Europe Underfills for CSP and BGA by Country
- 6.1 Europe Underfills for CSP and BGA Historic Market Size by Country
- 6.1.1 Europe Underfills for CSP and BGA Sales in Volume by Country (2017-2022)
7 Asia-Pacific Underfills for CSP and BGA by Region
- 7.1 Asia-Pacific Underfills for CSP and BGA Historic Market Size by Region
- 7.1.1 Asia-Pacific Underfills for CSP and BGA Sales in Volume by Region (2017-2022)
8 Latin America Underfills for CSP and BGA by Country
- 8.1 Latin America Underfills for CSP and BGA Historic Market Size by Country
- 8.1.1 Latin America Underfills for CSP and BGA Sales in Volume by Country (2017-2022)
9 Middle East and Africa Underfills for CSP and BGA by Country
- 9.1 Middle East and Africa Underfills for CSP and BGA Historic Market Size by Country
- 9.1.1 Middle East and Africa Underfills for CSP and BGA Sales in Volume by Country (2017-2022)
10 Company Profiles and Key Figures in Underfills for CSP and BGA Business
- 10.1 Namics
- 10.1.1 Namics Corporation Information
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
- 11.1 Underfills for CSP and BGA Key Raw Materials
- 11.1.1 Key Raw Materials
12 Market Strategy Analysis, Distributors
- 12.1 Sales Channel
- 12.2 Underfills for CSP and BGA Distributors
- 12.3 Underfills for CSP and BGA Downstream Customers
13 Research Findings and Conclusion
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
CSP/BGA Board Level Underfill is used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard. CSP/BGA Board Level Underfill material improves thermal cycle performance and enhances impact resistance (drop-test qualification).
Market Insights
Due to the COVID-19 pandemic, the global Underfills for CSP and BGA market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028.
The global main manufacturers of Underfills for CSP and BGA include Namics, Henkel, ThreeBond, Won Chemical, AIM Solder, Fuji Chemical, Shenzhen Laucal Advanced Material, Dongguan Hanstars and Hengchuang Material. etc. In 2021, the global six largest players have a share approximately % in terms of revenue.
The North America Underfills for CSP and BGA market is estimated at US$ million in 2021, while China is forecast to reach US$ million by 2028. The proportion of the China is % in 2021 and it is predicted that the share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Europe Underfills for CSP and BGA landscape, Germany is projected to reach US$ million by 2028. and in Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.
Low Viscosity accounting for % of the Underfills for CSP and BGA global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While CSP segment is altered to an % CAGR throughout this forecast period and will hold a share about % in 2028.
Segment Scope
An intensive study of key type and application segments has been done in this segmentation section. The authors of the report have provided reliable figures including sales and revenue forecast data by type and application for the period 2017-2028. They have also studied how the segments are gaining or losing growth in various geographies and their respective countries. Thanks to this study, readers can thoroughly grasp the growth pattern and potential of different segments.
Segment by Type
Low Viscosity
High Viscosity
Segment by Application
CSP
BGA
Regional Scope
This segment of the report offers a thorough regional study of the global Underfills for CSP and BGA market. Drivers and restraints for each region are broadly examined in the report. Readers will get familiar with the driving forces and challenges that are specific to the regions. The specialists have identified growth opportunities in key geographical regions and their respective countries to aid players to reinforce their presence. All the regions and their countries in the report are assessed based on the growth rate, revenue, and sales volume according to the consumption for the period 2017-2028. This geographical analysis will help readers to gain in-depth knowledge of the regional growth. The key geographical regions surveyed in this research report involve North America, Europe, Asia Pacific, Central and South America, and Middle East and Africa. The report has specifically covered major countries including United States, Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia, Mexico, Brazil, Turkey, Saudi Arabia, UAE, etc.
Key Players
This section has provided an exhaustive analysis of the strategies that the companies are focusing on to stay ahead of other players. The strategies mainly involve research and development, new product developments, and mergers and acquisitions. The researchers have also provided revenue shares of the key companies, company overview, and the latest company developments so as to help players to sustain the cutthroat competition. In this section, the report offers global revenue and sales data of manufacturers for the period 2017-2022. Following is the list of key manufacturers observed in this research study:
Namics
Henkel
ThreeBond
Won Chemical
AIM Solder
Fuji Chemical
Shenzhen Laucal Advanced Material
Dongguan Hanstars
Hengchuang Material
Frequently Asked Questions
Which application segment captured the leading share in the Underfills for CSP and BGA market?
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