Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 Semiconductor Underfills
    • 1.1.2.2 Board Level Underfills
  • 1.1.3 Market by Application
    • 1.1.3.1 Industrial Electronics
    • 1.1.3.2 Defense & Aerospace Electronics
    • 1.1.3.3 Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
    • 1.1.3.4 Automotive Electronics
    • 1.1.3.5 Medical Electronics
    • 1.1.3.6 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Henkel
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 WON CHEMICAL
• 6.3 NAMICS
• 6.4 SUNSTAR
• 6.5 Hitachi Chemical
• 6.6 Fuji
• 6.7 Shin-Etsu Chemical
• 6.8 Bondline
• 6.9 AIM Solder
• 6.10 Zymet
• 6.11 Panacol-Elosol
• 6.12 Master Bond
• 6.13 DOVER
• 6.14 Darbond
• 6.15 HIGHTITE

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary
Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
Market Segment as follows:
By Type
Semiconductor Underfills
Board Level Underfills
By Application
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
Automotive Electronics
Medical Electronics
Others
By Company
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.