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Global Thin Wafers Temporary Bonding Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Thin Wafers Temporary Bonding Equipment Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 Semi-Automatic Bonding Equipment
    • 1.3.3 Fully Automatic Bonding Equipment
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Thin Wafers Temporary Bonding Equipment Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 MEMS
    • 1.4.3 Advanced Packaging
    • 1.4.4 CMOS
  • 1.5 Global Thin Wafers Temporary Bonding Equipment Market Size & Forecast
    • 1.5.1 Global Thin Wafers Temporary Bonding Equipment Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Thin Wafers Temporary Bonding Equipment Sales Quantity (2019-2030)
    • 1.5.3 Global Thin Wafers Temporary Bonding Equipment Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 EV Group
    • 2.1.1 EV Group Details
    • 2.1.2 EV Group Major Business
    • 2.1.3 EV Group Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.1.4 EV Group Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 EV Group Recent Developments/Updates
  • 2.2 SUSS MicroTec
    • 2.2.1 SUSS MicroTec Details
    • 2.2.2 SUSS MicroTec Major Business
    • 2.2.3 SUSS MicroTec Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.2.4 SUSS MicroTec Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 SUSS MicroTec Recent Developments/Updates
  • 2.3 Tokyo Electron
    • 2.3.1 Tokyo Electron Details
    • 2.3.2 Tokyo Electron Major Business
    • 2.3.3 Tokyo Electron Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.3.4 Tokyo Electron Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 Tokyo Electron Recent Developments/Updates
  • 2.4 AML
    • 2.4.1 AML Details
    • 2.4.2 AML Major Business
    • 2.4.3 AML Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.4.4 AML Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 AML Recent Developments/Updates
  • 2.5 Mitsubishi
    • 2.5.1 Mitsubishi Details
    • 2.5.2 Mitsubishi Major Business
    • 2.5.3 Mitsubishi Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.5.4 Mitsubishi Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Mitsubishi Recent Developments/Updates
  • 2.6 Ayumi Industry
    • 2.6.1 Ayumi Industry Details
    • 2.6.2 Ayumi Industry Major Business
    • 2.6.3 Ayumi Industry Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.6.4 Ayumi Industry Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 Ayumi Industry Recent Developments/Updates
  • 2.7 SMEE
    • 2.7.1 SMEE Details
    • 2.7.2 SMEE Major Business
    • 2.7.3 SMEE Thin Wafers Temporary Bonding Equipment Product and Services
    • 2.7.4 SMEE Thin Wafers Temporary Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 SMEE Recent Developments/Updates

3 Competitive Environment: Thin Wafers Temporary Bonding Equipment by Manufacturer

  • 3.1 Global Thin Wafers Temporary Bonding Equipment Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Thin Wafers Temporary Bonding Equipment Revenue by Manufacturer (2019-2024)
  • 3.3 Global Thin Wafers Temporary Bonding Equipment Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Thin Wafers Temporary Bonding Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Thin Wafers Temporary Bonding Equipment Manufacturer Market Share in 2023
    • 3.4.3 Top 6 Thin Wafers Temporary Bonding Equipment Manufacturer Market Share in 2023
  • 3.5 Thin Wafers Temporary Bonding Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 Thin Wafers Temporary Bonding Equipment Market: Region Footprint
    • 3.5.2 Thin Wafers Temporary Bonding Equipment Market: Company Product Type Footprint
    • 3.5.3 Thin Wafers Temporary Bonding Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Thin Wafers Temporary Bonding Equipment Market Size by Region
    • 4.1.1 Global Thin Wafers Temporary Bonding Equipment Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Thin Wafers Temporary Bonding Equipment Consumption Value by Region (2019-2030)
    • 4.1.3 Global Thin Wafers Temporary Bonding Equipment Average Price by Region (2019-2030)
  • 4.2 North America Thin Wafers Temporary Bonding Equipment Consumption Value (2019-2030)
  • 4.3 Europe Thin Wafers Temporary Bonding Equipment Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Thin Wafers Temporary Bonding Equipment Consumption Value (2019-2030)
  • 4.5 South America Thin Wafers Temporary Bonding Equipment Consumption Value (2019-2030)
  • 4.6 Middle East & Africa Thin Wafers Temporary Bonding Equipment Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Thin Wafers Temporary Bonding Equipment Sales Quantity by Type (2019-2030)
  • 5.2 Global Thin Wafers Temporary Bonding Equipment Consumption Value by Type (2019-2030)
  • 5.3 Global Thin Wafers Temporary Bonding Equipment Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Thin Wafers Temporary Bonding Equipment Sales Quantity by Application (2019-2030)
  • 6.2 Global Thin Wafers Temporary Bonding Equipment Consumption Value by Application (2019-2030)
  • 6.3 Global Thin Wafers Temporary Bonding Equipment Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Thin Wafers Temporary Bonding Equipment Sales Quantity by Type (2019-2030)
  • 7.2 North America Thin Wafers Temporary Bonding Equipment Sales Quantity by Application (2019-2030)
  • 7.3 North America Thin Wafers Temporary Bonding Equipment Market Size by Country
    • 7.3.1 North America Thin Wafers Temporary Bonding Equipment Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Thin Wafers Temporary Bonding Equipment Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Thin Wafers Temporary Bonding Equipment Sales Quantity by Type (2019-2030)
  • 8.2 Europe Thin Wafers Temporary Bonding Equipment Sales Quantity by Application (2019-2030)
  • 8.3 Europe Thin Wafers Temporary Bonding Equipment Market Size by Country
    • 8.3.1 Europe Thin Wafers Temporary Bonding Equipment Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Thin Wafers Temporary Bonding Equipment Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Thin Wafers Temporary Bonding Equipment Market Size by Region
    • 9.3.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 South Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Thin Wafers Temporary Bonding Equipment Sales Quantity by Type (2019-2030)
  • 10.2 South America Thin Wafers Temporary Bonding Equipment Sales Quantity by Application (2019-2030)
  • 10.3 South America Thin Wafers Temporary Bonding Equipment Market Size by Country
    • 10.3.1 South America Thin Wafers Temporary Bonding Equipment Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Thin Wafers Temporary Bonding Equipment Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment Market Size by Country
    • 11.3.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Thin Wafers Temporary Bonding Equipment Market Drivers
  • 12.2 Thin Wafers Temporary Bonding Equipment Market Restraints
  • 12.3 Thin Wafers Temporary Bonding Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Thin Wafers Temporary Bonding Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Thin Wafers Temporary Bonding Equipment
  • 13.3 Thin Wafers Temporary Bonding Equipment Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Thin Wafers Temporary Bonding Equipment Typical Distributors
  • 14.3 Thin Wafers Temporary Bonding Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Thin Wafers Temporary Bonding Equipment is to closely combine two mirror polished homogeneous or heterogeneous wafers through chemical and physical actions. After wafer bonding, atoms at the interface react under the action of external forces to form a covalent bond, and make the bonding interface reach a specific bonding strength.
    According to our (Global Info Research) latest study, the global Thin Wafers Temporary Bonding Equipment market size was valued at US$ 154 million in 2023 and is forecast to a readjusted size of USD 254 million by 2030 with a CAGR of 7.5% during review period.
    The globalThin Wafers Temporary Bonding Equipment consumer market is mainly concentrated in China, Japan, Europe and the United States and other regions. Among them, China"s Thin Wafers Temporary Bonding Equipment sales share is the largest, accounting for about 31% of the global market in 2019. Japan accounts for about 24%, while Europe and the United States account for about 14% and 9%.
    Thin Wafers Temporary Bonding Equipment can be widely used in MEMS, Advanced Packaging, CMOS and others. The MEMS market is the largest consumer market, accounting for about 35% of the market in 2019. Advanced Packaging is the second largest market, about 31%.
    EV group, suss microtec, Tokyo electron, AML, Mitsubishi, Ayumi industry, Smee, etc. EV group is the world"s leading enterprise, accounting for 55% of the global revenue in 2019. Suss microtec is the second largest enterprise in the world, accounting for about 21% of the global market.
    This report is a detailed and comprehensive analysis for global Thin Wafers Temporary Bonding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
    Key Features:
    Global Thin Wafers Temporary Bonding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030
    Global Thin Wafers Temporary Bonding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030
    Global Thin Wafers Temporary Bonding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030
    Global Thin Wafers Temporary Bonding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2019-2024
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Thin Wafers Temporary Bonding Equipment
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Thin Wafers Temporary Bonding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Thin Wafers Temporary Bonding Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Semi-Automatic Bonding Equipment
    Fully Automatic Bonding Equipment
    Market segment by Application
    MEMS
    Advanced Packaging
    CMOS
    Major players covered
    EV Group
    SUSS MicroTec
    Tokyo Electron
    AML
    Mitsubishi
    Ayumi Industry
    SMEE
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Thin Wafers Temporary Bonding Equipment product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Thin Wafers Temporary Bonding Equipment, with price, sales quantity, revenue, and global market share of Thin Wafers Temporary Bonding Equipment from 2019 to 2024.
    Chapter 3, the Thin Wafers Temporary Bonding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Thin Wafers Temporary Bonding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Thin Wafers Temporary Bonding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Thin Wafers Temporary Bonding Equipment.
    Chapter 14 and 15, to describe Thin Wafers Temporary Bonding Equipment sales channel, distributors, customers, research findings and conclusion.

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