Table of Contents

1 Market Overview

• 1.1 Objectives of Research
  • 1.1.1 Definition
  • 1.1.2 Specifications
• 1.2 Market Segment
  • 1.2.1 by Type
    • 1.2.1.1 SMD Type
    • 1.2.1.2 Through Hole Type
  • 1.2.2 by Application
    • 1.2.2.1 Consumer Electronics
    • 1.2.2.2 Telecommunications
    • 1.2.2.3 Automotive/Energy
    • 1.2.2.4 Industrial/Medical
    • 1.2.2.5 Others
  • 1.2.3 by Regions

2 Industry Chain

• 2.1 Industry Chain Structure
• 2.2 Upstream
• 2.3 Market
  • 2.3.1 SWOT
  • 2.3.2 Dynamics

3 Environmental Analysis

• 3.1 Policy
• 3.2 Economic
• 3.3 Technology
• 3.4 Market Entry

4 Market Segmentation by Type

• 4.1 Market Size
  • 4.1.1 SMD Type Market, 2013-2018
  • 4.1.2 Through Hole Type Market, 2013-2018
• 4.2 Market Forecast
  • 4.2.1 SMD Type Market Forecast, 2019-2024
  • 4.2.2 Through Hole Type Market Forecast, 2019-2024

5 Market Segmentation by Application

• 5.1 Market Size
  • 5.1.1 Consumer Electronics Market, 2013-2018
  • 5.1.2 Telecommunications Market, 2013-2018
  • 5.1.3 Automotive/Energy Market, 2013-2018
  • 5.1.4 Industrial/Medical Market, 2013-2018
  • 5.1.5 Others Market, 2013-2018
• 5.2 Market Forecast
  • 5.2.1 Consumer Electronics Market Forecast, 2019-2024
  • 5.2.2 Telecommunications Market Forecast, 2019-2024
  • 5.2.3 Automotive/Energy Market Forecast, 2019-2024
  • 5.2.4 Industrial/Medical Market Forecast, 2019-2024
  • 5.2.5 Others Market Forecast, 2019-2024

6 Market Segmentation by Region

• 6.1 Market Size
  • 6.1.1 Asia-Pacific
    • 6.1.1.1 Asia-Pacific Market, 2012-2018
    • 6.1.1.2 Asia-Pacific Market by Type
    • 6.1.1.3 Asia-Pacific Market by Application
  • 6.1.2 North America
    • 6.1.2.1 North America Market, 2012-2018
    • 6.1.2.2 North America Market by Type
    • 6.1.2.3 North America Market by Application
  • 6.1.3 Europe
    • 6.1.3.1 Europe Market, 2012-2018
    • 6.1.3.2 Europe Market by Type
    • 6.1.3.3 Europe Market by Application
  • 6.1.4 South America
    • 6.1.4.1 South America Market, 2012-2018
    • 6.1.4.2 South America Market by Type
    • 6.1.4.3 South America Market by Application
  • 6.1.5 Middle East & Africa
    • 6.1.5.1 Middle East & Africa Market, 2012-2018
    • 6.1.5.2 Middle East & Africa Market by Type
    • 6.1.5.3 Middle East & Africa Market by Application
• 6.2 Market Forecast
  • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
  • 6.2.2 North America Market Forecast, 2019-2024
  • 6.2.3 Europe Market Forecast, 2019-2024
  • 6.2.4 South America Market Forecast, 2019-2024
  • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

7 Market Competitive

• 7.1 Global Market by Vendors
• 7.2 Market Concentration
• 7.3 Price & Factors
• 7.4 Marketing Channel

8 Major Vendors

• 8.1 Yageo
• 8.2 Ta-I Technology Co., Ltd
• 8.3 KOA
• 8.4 Vishay
• 8.5 Ralec Electronics Corp.
• 8.6 Walsin Technology Corporation
• 8.7 Fenghua Advanced Technology
• 8.8 Samsung Electro-Mechanics
• 8.9 Panasonic
• 8.10 Uni Ohm
• 8.11 Rohm Co., Ltd.
• 8.12 Tateyama Kagaku Industry Co., Ltd.
• 8.13 Elektronische Bauelemente GmbH (EBG)
• 8.14 Ever Ohms Technology Co., Ltd.

9 Conclusion

Summary
Thin and thick film resistors are the most common types in the market. They are characterized by a resistive layer on a ceramic base. Although their appearance might be very similar, their properties and manufacturing process are very different. The naming originates from the different layer thicknesses. Thin film has a thickness in the order of 0.1 micrometer or smaller, while thick film is around thousands time thicker. However, the main difference is method the resistive film is applied onto the substrate. Thin film resistors have a metallic film that is vacuum deposited on an insulating substrate. Thick film resistors are produced by firing a special paste onto the substrate. The paste is a mixture of glass and metal oxides. Thin film is more accurate, has a better temperature coefficient and is more stable. It therefore competes with other technologies that feature high precision, such as wire wound or bulk metal foil. On the other hand, thick film is preferred for applications where these high requirements are not critical since prices are much lower. This report studies the Thick Film Resistors market.
The global Thick Film Resistors market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
SMD Type
Through Hole Type
Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
Yageo
Ta-I Technology Co., Ltd
KOA
Vishay
Ralec Electronics Corp.
Walsin Technology Corporation
Fenghua Advanced Technology
Samsung Electro-Mechanics
Panasonic
Uni Ohm
Rohm Co., Ltd.
Tateyama Kagaku Industry Co., Ltd.
Elektronische Bauelemente GmbH (EBG)
Ever Ohms Technology Co., Ltd.
Based on Application, the report describes major application share of regional market. Application mentioned as follows:
Consumer Electronics 
Telecommunications
Automotive/Energy
Industrial/Medical
Others
Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
Asia-Pacific
North America
Europe
South America
Middle East & Africa