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Global (United States, European Union and China) Thermosetting Moulding Materials for Electronics Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Thermosetting Moulding Materials for Electronics Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Epoxy
      • 1.3.3 Polyester
      • 1.3.4 Polyurethane
      • 1.3.5 Polyimide
      • 1.3.6 Bakelite
      • 1.3.7 Formaldehyde
      • 1.3.8 Others
    • 1.4 Market Segment by Application
      • 1.4.1 Global Thermosetting Moulding Materials for Electronics Market Share by Application (2019-2025)
      • 1.4.2 Automotive
      • 1.4.3 Consumer Electronics
      • 1.4.4 Aerospace
      • 1.4.5 Other
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Thermosetting Moulding Materials for Electronics Production Value 2014-2025
      • 2.1.2 Global Thermosetting Moulding Materials for Electronics Production 2014-2025
      • 2.1.3 Global Thermosetting Moulding Materials for Electronics Capacity 2014-2025
      • 2.1.4 Global Thermosetting Moulding Materials for Electronics Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Thermosetting Moulding Materials for Electronics Market Size CAGR of Key Regions
      • 2.2.2 Global Thermosetting Moulding Materials for Electronics Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Thermosetting Moulding Materials for Electronics Capacity by Manufacturers
      • 3.1.2 Global Thermosetting Moulding Materials for Electronics Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Thermosetting Moulding Materials for Electronics Revenue by Manufacturers (2014-2019)
      • 3.2.2 Thermosetting Moulding Materials for Electronics Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Thermosetting Moulding Materials for Electronics Market Concentration Ratio (CR5 and HHI)
    • 3.3 Thermosetting Moulding Materials for Electronics Price by Manufacturers
    • 3.4 Key Manufacturers Thermosetting Moulding Materials for Electronics Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Thermosetting Moulding Materials for Electronics Market
    • 3.6 Key Manufacturers Thermosetting Moulding Materials for Electronics Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Epoxy Production and Production Value (2014-2019)
      • 4.1.2 Polyester Production and Production Value (2014-2019)
      • 4.1.3 Polyurethane Production and Production Value (2014-2019)
      • 4.1.4 Polyimide Production and Production Value (2014-2019)
      • 4.1.5 Bakelite Production and Production Value (2014-2019)
      • 4.1.6 Formaldehyde Production and Production Value (2014-2019)
      • 4.1.7 Others Production and Production Value (2014-2019)
    • 4.2 Global Thermosetting Moulding Materials for Electronics Production Market Share by Type
    • 4.3 Global Thermosetting Moulding Materials for Electronics Production Value Market Share by Type
    • 4.4 Thermosetting Moulding Materials for Electronics Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Thermosetting Moulding Materials for Electronics Consumption by Application

    6 Production by Regions

    • 6.1 Global Thermosetting Moulding Materials for Electronics Production (History Data) by Regions 2014-2019
    • 6.2 Global Thermosetting Moulding Materials for Electronics Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Thermosetting Moulding Materials for Electronics Production Growth Rate 2014-2019
      • 6.3.2 United States Thermosetting Moulding Materials for Electronics Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Thermosetting Moulding Materials for Electronics Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Thermosetting Moulding Materials for Electronics Production Growth Rate 2014-2019
      • 6.4.2 European Union Thermosetting Moulding Materials for Electronics Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Thermosetting Moulding Materials for Electronics Import & Export
    • 6.5 China
      • 6.5.1 China Thermosetting Moulding Materials for Electronics Production Growth Rate 2014-2019
      • 6.5.2 China Thermosetting Moulding Materials for Electronics Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Thermosetting Moulding Materials for Electronics Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Thermosetting Moulding Materials for Electronics Consumption by Regions

    • 7.1 Global Thermosetting Moulding Materials for Electronics Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Thermosetting Moulding Materials for Electronics Consumption by Type
      • 7.2.2 United States Thermosetting Moulding Materials for Electronics Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Thermosetting Moulding Materials for Electronics Consumption by Type
      • 7.3.2 European Union Thermosetting Moulding Materials for Electronics Consumption by Application
    • 7.4 China
      • 7.4.1 China Thermosetting Moulding Materials for Electronics Consumption by Type
      • 7.4.2 China Thermosetting Moulding Materials for Electronics Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Thermosetting Moulding Materials for Electronics Consumption by Type
      • 7.5.2 Rest of World Thermosetting Moulding Materials for Electronics Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 BASF
      • 8.1.1 BASF Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.1.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.1.5 BASF Recent Development
    • 8.2 Cosmic Plastics
      • 8.2.1 Cosmic Plastics Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.2.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.2.5 Cosmic Plastics Recent Development
    • 8.3 Eastman
      • 8.3.1 Eastman Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.3.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.3.5 Eastman Recent Development
    • 8.4 Hitachi
      • 8.4.1 Hitachi Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.4.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.4.5 Hitachi Recent Development
    • 8.5 Huntsman
      • 8.5.1 Huntsman Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.5.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.5.5 Huntsman Recent Development
    • 8.6 Evonik
      • 8.6.1 Evonik Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.6.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.6.5 Evonik Recent Development
    • 8.7 Momentive
      • 8.7.1 Momentive Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.7.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.7.5 Momentive Recent Development
    • 8.8 Kolon industries
      • 8.8.1 Kolon industries Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.8.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.8.5 Kolon industries Recent Development
    • 8.9 Plastics Engineering Company (Plenco)
      • 8.9.1 Plastics Engineering Company (Plenco) Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.9.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.9.5 Plastics Engineering Company (Plenco) Recent Development
    • 8.10 KYOCERA
      • 8.10.1 KYOCERA Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Thermosetting Moulding Materials for Electronics
      • 8.10.4 Thermosetting Moulding Materials for Electronics Product Introduction
      • 8.10.5 KYOCERA Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Thermosetting Moulding Materials for Electronics Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Thermosetting Moulding Materials for Electronics Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Thermosetting Moulding Materials for Electronics Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Thermosetting Moulding Materials for Electronics Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Thermosetting Moulding Materials for Electronics Production Forecast by Type
      • 9.7.2 Global Thermosetting Moulding Materials for Electronics Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Thermosetting Moulding Materials for Electronics Sales Channels
      • 10.2.2 Thermosetting Moulding Materials for Electronics Distributors
    • 10.3 Thermosetting Moulding Materials for Electronics Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Thermosetting Resin Moulding Materials for Electronics resins are used for the manufacturing of printed circuit boards, prepregs and copper clad laminates, amongst others.
      With rise in demand for lighter, shorter, thermally stable and reliable circuit boards, Thermosetting Resin Moulding Materials for Electronics are gaining prominence in the digital world. Owing to good adhesion, high electrical insulation and mechanical and thermal stability properties of Thermosetting Resin Moulding Materials for Electronics resins, their use has grown significantly over the past decade.
      In 2019, the market size of Thermosetting Moulding Materials for Electronics is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Thermosetting Moulding Materials for Electronics.

      This report studies the global market size of Thermosetting Moulding Materials for Electronics, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Thermosetting Moulding Materials for Electronics production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      BASF
      Cosmic Plastics
      Eastman
      Hitachi
      Huntsman
      Evonik
      Momentive
      Kolon industries
      Plastics Engineering Company (Plenco)
      KYOCERA

      Market Segment by Product Type
      Epoxy
      Polyester
      Polyurethane
      Polyimide
      Bakelite
      Formaldehyde
      Others

      Market Segment by Application
      Automotive
      Consumer Electronics
      Aerospace
      Other

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Thermosetting Moulding Materials for Electronics status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Thermosetting Moulding Materials for Electronics manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Thermosetting Moulding Materials for Electronics are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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