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Global Thermal Interface Materials for Power Electronics Market Research Report 2022

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1 Thermal Interface Materials for Power Electronics Market Overview

  • 1.1 Product Overview and Scope of Thermal Interface Materials for Power Electronics
  • 1.2 Thermal Interface Materials for Power Electronics Segment by Type
  • 1.2.1 Global Thermal Interface Materials for Power Electronics Market Size Growth Rate Analysis by Type 2022 VS 2028
  • 1.2.2 Silicone-based
  • 1.2.3 Non-silicone
  • 1.3 Thermal Interface Materials for Power Electronics Segment by Application
  • 1.3.1 Global Thermal Interface Materials for Power Electronics Consumption Comparison by Application: 2022 VS 2028
  • 1.3.2 CPU
  • 1.3.3 GPU
  • 1.3.4 Memory Module
  • 1.3.5 Others
  • 1.4 Global Market Growth Prospects
  • 1.4.1 Global Thermal Interface Materials for Power Electronics Revenue Estimates and Forecasts (2017-2028)
  • 1.4.2 Global Thermal Interface Materials for Power Electronics Production Capacity Estimates and Forecasts (2017-2028)
  • 1.4.3 Global Thermal Interface Materials for Power Electronics Production Estimates and Forecasts (2017-2028)
  • 1.5 Global Market Size by Region
  • 1.5.1 Global Thermal Interface Materials for Power Electronics Market Size Estimates and Forecasts by Region: 2017 VS 2021 VS 2028
  • 1.5.2 North America Thermal Interface Materials for Power Electronics Estimates and Forecasts (2017-2028)
  • 1.5.3 Europe Thermal Interface Materials for Power Electronics Estimates and Forecasts (2017-2028)
  • 1.5.4 China Thermal Interface Materials for Power Electronics Estimates and Forecasts (2017-2028)
  • 1.5.5 Japan Thermal Interface Materials for Power Electronics Estimates and Forecasts (2017-2028)

    • 2 Market Competition by Manufacturers

    • 2.1 Global Thermal Interface Materials for Power Electronics Production Capacity Market Share by Manufacturers (2017-2022)
    • 2.2 Global Thermal Interface Materials for Power Electronics Revenue Market Share by Manufacturers (2017-2022)
    • 2.3 Thermal Interface Materials for Power Electronics Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
    • 2.4 Global Thermal Interface Materials for Power Electronics Average Price by Manufacturers (2017-2022)
    • 2.5 Manufacturers Thermal Interface Materials for Power Electronics Production Sites, Area Served, Product Types
    • 2.6 Thermal Interface Materials for Power Electronics Market Competitive Situation and Trends
    • 2.6.1 Thermal Interface Materials for Power Electronics Market Concentration Rate
  • 2.6.2 Global 5 and 10 Largest Thermal Interface Materials for Power Electronics Players Market Share by Revenue
  • 2.6.3 Mergers & Acquisitions, Expansion

    • 3 Production Capacity by Region

    • 3.1 Global Production Capacity of Thermal Interface Materials for Power Electronics Market Share by Region (2017-2022)
    • 3.2 Global Thermal Interface Materials for Power Electronics Revenue Market Share by Region (2017-2022)
    • 3.3 Global Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
    • 3.4 North America Thermal Interface Materials for Power Electronics Production
    • 3.4.1 North America Thermal Interface Materials for Power Electronics Production Growth Rate (2017-2022)
  • 3.4.2 North America Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 3.5 Europe Thermal Interface Materials for Power Electronics Production
  • 3.5.1 Europe Thermal Interface Materials for Power Electronics Production Growth Rate (2017-2022)
  • 3.5.2 Europe Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 3.6 China Thermal Interface Materials for Power Electronics Production
  • 3.6.1 China Thermal Interface Materials for Power Electronics Production Growth Rate (2017-2022)
  • 3.6.2 China Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 3.7 Japan Thermal Interface Materials for Power Electronics Production
  • 3.7.1 Japan Thermal Interface Materials for Power Electronics Production Growth Rate (2017-2022)
  • 3.7.2 Japan Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)

    • 4 Global Thermal Interface Materials for Power Electronics Consumption by Region

    • 4.1 Global Thermal Interface Materials for Power Electronics Consumption by Region
    • 4.1.1 Global Thermal Interface Materials for Power Electronics Consumption by Region
  • 4.1.2 Global Thermal Interface Materials for Power Electronics Consumption Market Share by Region
  • 4.2 North America
  • 4.2.1 North America Thermal Interface Materials for Power Electronics Consumption by Country
  • 4.2.2 United States
  • 4.2.3 Canada
  • 4.3 Europe
  • 4.3.1 Europe Thermal Interface Materials for Power Electronics Consumption by Country
  • 4.3.2 Germany
  • 4.3.3 France
  • 4.3.4 U.K.
  • 4.3.5 Italy
  • 4.3.6 Russia
  • 4.4 Asia Pacific
  • 4.4.1 Asia Pacific Thermal Interface Materials for Power Electronics Consumption by Region
  • 4.4.2 China
  • 4.4.3 Japan
  • 4.4.4 South Korea
  • 4.4.5 China Taiwan
  • 4.4.6 Southeast Asia
  • 4.4.7 India
  • 4.4.8 Australia
  • 4.5 Latin America
  • 4.5.1 Latin America Thermal Interface Materials for Power Electronics Consumption by Country
  • 4.5.2 Mexico
  • 4.5.3 Brazil

    • 5 Segment by Type

    • 5.1 Global Thermal Interface Materials for Power Electronics Production Market Share by Type (2017-2022)
    • 5.2 Global Thermal Interface Materials for Power Electronics Revenue Market Share by Type (2017-2022)
    • 5.3 Global Thermal Interface Materials for Power Electronics Price by Type (2017-2022)

    6 Segment by Application

    • 6.1 Global Thermal Interface Materials for Power Electronics Production Market Share by Application (2017-2022)
    • 6.2 Global Thermal Interface Materials for Power Electronics Revenue Market Share by Application (2017-2022)
    • 6.3 Global Thermal Interface Materials for Power Electronics Price by Application (2017-2022)

    7 Key Companies Profiled

    • 7.1 Dupont
    • 7.1.1 Dupont Thermal Interface Materials for Power Electronics Corporation Information
  • 7.1.2 Dupont Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.1.3 Dupont Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.1.4 Dupont Main Business and Markets Served
  • 7.1.5 Dupont Recent Developments/Updates
  • 7.2 Shin-Etsu
  • 7.2.1 Shin-Etsu Thermal Interface Materials for Power Electronics Corporation Information
  • 7.2.2 Shin-Etsu Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.2.3 Shin-Etsu Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.2.4 Shin-Etsu Main Business and Markets Served
  • 7.2.5 Shin-Etsu Recent Developments/Updates
  • 7.3 Panasonic
  • 7.3.1 Panasonic Thermal Interface Materials for Power Electronics Corporation Information
  • 7.3.2 Panasonic Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.3.3 Panasonic Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.3.4 Panasonic Main Business and Markets Served
  • 7.3.5 Panasonic Recent Developments/Updates
  • 7.4 Laird
  • 7.4.1 Laird Thermal Interface Materials for Power Electronics Corporation Information
  • 7.4.2 Laird Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.4.3 Laird Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.4.4 Laird Main Business and Markets Served
  • 7.4.5 Laird Recent Developments/Updates
  • 7.5 Henkel
  • 7.5.1 Henkel Thermal Interface Materials for Power Electronics Corporation Information
  • 7.5.2 Henkel Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.5.3 Henkel Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.5.4 Henkel Main Business and Markets Served
  • 7.5.5 Henkel Recent Developments/Updates
  • 7.6 Honeywell
  • 7.6.1 Honeywell Thermal Interface Materials for Power Electronics Corporation Information
  • 7.6.2 Honeywell Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.6.3 Honeywell Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.6.4 Honeywell Main Business and Markets Served
  • 7.6.5 Honeywell Recent Developments/Updates
  • 7.7 3M
  • 7.7.1 3M Thermal Interface Materials for Power Electronics Corporation Information
  • 7.7.2 3M Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.7.3 3M Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.7.4 3M Main Business and Markets Served
  • 7.7.5 3M Recent Developments/Updates
  • 7.8 Semikron
  • 7.8.1 Semikron Thermal Interface Materials for Power Electronics Corporation Information
  • 7.8.2 Semikron Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.8.3 Semikron Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.8.4 Semikron Main Business and Markets Served
  • 7.7.5 Semikron Recent Developments/Updates
  • 7.9 Momentive
  • 7.9.1 Momentive Thermal Interface Materials for Power Electronics Corporation Information
  • 7.9.2 Momentive Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.9.3 Momentive Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.9.4 Momentive Main Business and Markets Served
  • 7.9.5 Momentive Recent Developments/Updates
  • 7.10 Roger
  • 7.10.1 Roger Thermal Interface Materials for Power Electronics Corporation Information
  • 7.10.2 Roger Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.10.3 Roger Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.10.4 Roger Main Business and Markets Served
  • 7.10.5 Roger Recent Developments/Updates
  • 7.11 AI Technology
  • 7.11.1 AI Technology Thermal Interface Materials for Power Electronics Corporation Information
  • 7.11.2 AI Technology Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.11.3 AI Technology Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.11.4 AI Technology Main Business and Markets Served
  • 7.11.5 AI Technology Recent Developments/Updates
  • 7.12 Fujipoly
  • 7.12.1 Fujipoly Thermal Interface Materials for Power Electronics Corporation Information
  • 7.12.2 Fujipoly Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.12.3 Fujipoly Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.12.4 Fujipoly Main Business and Markets Served
  • 7.12.5 Fujipoly Recent Developments/Updates
  • 7.13 Parker
  • 7.13.1 Parker Thermal Interface Materials for Power Electronics Corporation Information
  • 7.13.2 Parker Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.13.3 Parker Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.13.4 Parker Main Business and Markets Served
  • 7.13.5 Parker Recent Developments/Updates
  • 7.14 Shenzhen HFC
  • 7.14.1 Shenzhen HFC Thermal Interface Materials for Power Electronics Corporation Information
  • 7.14.2 Shenzhen HFC Thermal Interface Materials for Power Electronics Product Portfolio
  • 7.14.3 Shenzhen HFC Thermal Interface Materials for Power Electronics Production Capacity, Revenue, Price and Gross Margin (2017-2022)
  • 7.14.4 Shenzhen HFC Main Business and Markets Served
  • 7.14.5 Shenzhen HFC Recent Developments/Updates

    • 8 Thermal Interface Materials for Power Electronics Manufacturing Cost Analysis

    • 8.1 Thermal Interface Materials for Power Electronics Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
  • 8.1.2 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of Thermal Interface Materials for Power Electronics
  • 8.4 Thermal Interface Materials for Power Electronics Industrial Chain Analysis

    • 9 Marketing Channel, Distributors and Customers

    • 9.1 Marketing Channel
    • 9.2 Thermal Interface Materials for Power Electronics Distributors List
    • 9.3 Thermal Interface Materials for Power Electronics Customers

    10 Market Dynamics

    • 10.1 Thermal Interface Materials for Power Electronics Industry Trends
    • 10.2 Thermal Interface Materials for Power Electronics Market Drivers
    • 10.3 Thermal Interface Materials for Power Electronics Market Challenges
    • 10.4 Thermal Interface Materials for Power Electronics Market Restraints

    11 Production and Supply Forecast

    • 11.1 Global Forecasted Production of Thermal Interface Materials for Power Electronics by Region (2023-2028)
    • 11.2 North America Thermal Interface Materials for Power Electronics Production, Revenue Forecast (2023-2028)
    • 11.3 Europe Thermal Interface Materials for Power Electronics Production, Revenue Forecast (2023-2028)
    • 11.4 China Thermal Interface Materials for Power Electronics Production, Revenue Forecast (2023-2028)
    • 11.5 Japan Thermal Interface Materials for Power Electronics Production, Revenue Forecast (2023-2028)

    12 Consumption and Demand Forecast

    • 12.1 Global Forecasted Demand Analysis of Thermal Interface Materials for Power Electronics
    • 12.2 North America Forecasted Consumption of Thermal Interface Materials for Power Electronics by Country
    • 12.3 Europe Market Forecasted Consumption of Thermal Interface Materials for Power Electronics by Country
    • 12.4 Asia Pacific Market Forecasted Consumption of Thermal Interface Materials for Power Electronics by Region
    • 12.5 Latin America Forecasted Consumption of Thermal Interface Materials for Power Electronics by Country

    13 Forecast by Type and by Application (2023-2028)

    • 13.1 Global Production, Revenue and Price Forecast by Type (2023-2028)
    • 13.1.1 Global Forecasted Production of Thermal Interface Materials for Power Electronics by Type (2023-2028)
  • 13.1.2 Global Forecasted Revenue of Thermal Interface Materials for Power Electronics by Type (2023-2028)
  • 13.1.3 Global Forecasted Price of Thermal Interface Materials for Power Electronics by Type (2023-2028)
  • 13.2 Global Forecasted Consumption of Thermal Interface Materials for Power Electronics by Application (2023-2028)
  • 13.2.1 Global Forecasted Production of Thermal Interface Materials for Power Electronics by Application (2023-2028)
  • 13.2.2 Global Forecasted Revenue of Thermal Interface Materials for Power Electronics by Application (2023-2028)
  • 13.2.3 Global Forecasted Price of Thermal Interface Materials for Power Electronics by Application (2023-2028)

    • 14 Research Finding and Conclusion

      15 Methodology and Data Source

      • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
    • 15.1.2 Market Size Estimation
    • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
    • 15.2.1 Secondary Sources
    • 15.2.2 Primary Sources
    • 15.3 Author List

      • In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package.
      Industry Insights

      Due to the COVID-19 pandemic, the global Thermal Interface Materials for Power Electronics market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Silicone-based accounting for % of the Thermal Interface Materials for Power Electronics global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While CPU segment is altered to an % CAGR throughout this forecast period.

      North America Thermal Interface Materials for Power Electronics market is estimated at US$ million in 2021, while Europe is forecast to reach US$ million by 2028. The proportion of the North America is % in 2021, while Europe percentage is %, and it is predicted that Europe share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.

      The global major manufacturers of Thermal Interface Materials for Power Electronics include Dupont, Shin-Etsu, Panasonic, Laird, Henkel, Honeywell, 3M, Semikron and Momentive, etc. In terms of revenue, the global 3 largest players have a % market share of Thermal Interface Materials for Power Electronics in 2021.

      Key Drivers & Barriers

      The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.

      A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

      Post-covid-19 Outlook

      The readers in the section will understand how the Thermal Interface Materials for Power Electronics market scenario changed across the globe during the pandemic and post-pandemic. The study is done keeping in view the changes in aspects such as production, demand, consumption, supply chain. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

      Segmental Outlook

      Key segments including type and application have been elaborated in this report. The consultants at QY Research have studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type and application during the historical period (2017-2022) and forecast period (2023-2028).

      Segment by Type

      Silicone-based

      Non-silicone

      Segment by Application

      CPU

      GPU

      Memory Module

      Others

      Regional Outlook

      This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and production data of each region and country for the period 2017-2028. This information derived through comprehensive research will help the reader to get familiar with the potential value of the investment in a particular region.

      Production by Region

      North America

      Europe

      China

      Japan

      Consumption by Region

      North America

      United States

      Canada

      Europe

      Germany

      France

      U.K.

      Italy

      Russia

      Asia-Pacific

      China

      Japan

      South Korea

      India

      Australia

      China Taiwan

      Indonesia

      Thailand

      Malaysia

      Latin America

      Mexico

      Brazil

      Argentina

      Competitive Scenario

      In this section, the readers will gain an understanding of the key players competing. The experts at QY Research have studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and production by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

      Dupont

      Shin-Etsu

      Panasonic

      Laird

      Henkel

      Honeywell

      3M

      Semikron

      Momentive

      Roger

      AI Technology

      Fujipoly

      Parker

      Shenzhen HFC

      Frequently Asked Questions

      Which product segment grabbed the largest share in the Thermal Interface Materials for Power Electronics market?

      How is the competitive scenario of the Thermal Interface Materials for Power Electronics market?

      Which are the key factors aiding the Thermal Interface Materials for Power Electronics market growth?

      Which are the prominent players in the Thermal Interface Materials for Power Electronics market?

      Which region holds the maximum share in the Thermal Interface Materials for Power Electronics market?

      What will be the CAGR of the Thermal Interface Materials for Power Electronics market during the forecast period?

      Which application segment emerged as the leading segment in the Thermal Interface Materials for Power Electronics market?

      What key trends are likely to emerge in the Thermal Interface Materials for Power Electronics market in the coming years?

      What will be the Thermal Interface Materials for Power Electronics market size by 2028?

      Which company held the largest share in the Thermal Interface Materials for Power Electronics market?
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