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Global Solder Bumps Market Insights and Forecast to 2026

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1 Study Coverage

  • 1.1 Solder Bumps Product Introduction
  • 1.2 Market Segments
  • 1.3 Key Solder Bumps Manufacturers Covered: Ranking by Revenue
  • 1.4 Market by Type
    • 1.4.1 Global Solder Bumps Market Size Growth Rate by Type
    • 1.4.2 Lead Solder Bumps
    • 1.4.3 Lead Free Solder Bumps
  • 1.5 Market by Application
    • 1.5.1 Global Solder Bumps Market Size Growth Rate by Application
    • 1.5.2 BGA
    • 1.5.3 CSP & WLCSP
    • 1.5.4 Flip-Chip & Others
  • 1.6 Study Objectives
  • 1.7 Years Considered

2 Executive Summary

  • 2.1 Global Solder Bumps Market Size, Estimates and Forecasts
    • 2.1.1 Global Solder Bumps Revenue 2015-2026
    • 2.1.2 Global Solder Bumps Sales 2015-2026
  • 2.2 Global Solder Bumps, Market Size by Producing Regions: 2015 VS 2020 VS 2026
    • 2.2.1 Global Solder Bumps Retrospective Market Scenario in Sales by Region: 2015-2020
    • 2.2.2 Global Solder Bumps Retrospective Market Scenario in Revenue by Region: 2015-2020

3 Global Solder Bumps Competitor Landscape by Players

  • 3.1 Solder Bumps Sales by Manufacturers
    • 3.1.1 Solder Bumps Sales by Manufacturers (2015-2020)
    • 3.1.2 Solder Bumps Sales Market Share by Manufacturers (2015-2020)
  • 3.2 Solder Bumps Revenue by Manufacturers
    • 3.2.1 Solder Bumps Revenue by Manufacturers (2015-2020)
    • 3.2.2 Solder Bumps Revenue Share by Manufacturers (2015-2020)
    • 3.2.3 Global Solder Bumps Market Concentration Ratio (CR5 and HHI) (2015-2020)
    • 3.2.4 Global Top 10 and Top 5 Companies by Solder Bumps Revenue in 2019
    • 3.2.5 Global Solder Bumps Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 3.3 Solder Bumps Price by Manufacturers
  • 3.4 Solder Bumps Manufacturing Base Distribution, Product Types
    • 3.4.1 Solder Bumps Manufacturers Manufacturing Base Distribution, Headquarters
    • 3.4.2 Manufacturers Solder Bumps Product Type
    • 3.4.3 Date of International Manufacturers Enter into Solder Bumps Market
  • 3.5 Manufacturers Mergers & Acquisitions, Expansion Plans

4 Market Size by Type (2015-2026)

  • 4.1 Global Solder Bumps Market Size by Type (2015-2020)
    • 4.1.1 Global Solder Bumps Sales by Type (2015-2020)
    • 4.1.2 Global Solder Bumps Revenue by Type (2015-2020)
    • 4.1.3 Solder Bumps Average Selling Price (ASP) by Type (2015-2026)
  • 4.2 Global Solder Bumps Market Size Forecast by Type (2021-2026)
    • 4.2.1 Global Solder Bumps Sales Forecast by Type (2021-2026)
    • 4.2.2 Global Solder Bumps Revenue Forecast by Type (2021-2026)
    • 4.2.3 Solder Bumps Average Selling Price (ASP) Forecast by Type (2021-2026)
  • 4.3 Global Solder Bumps Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End

5 Market Size by Application (2015-2026)

  • 5.1 Global Solder Bumps Market Size by Application (2015-2020)
    • 5.1.1 Global Solder Bumps Sales by Application (2015-2020)
    • 5.1.2 Global Solder Bumps Revenue by Application (2015-2020)
    • 5.1.3 Solder Bumps Price by Application (2015-2020)
  • 5.2 Solder Bumps Market Size Forecast by Application (2021-2026)
    • 5.2.1 Global Solder Bumps Sales Forecast by Application (2021-2026)
    • 5.2.2 Global Solder Bumps Revenue Forecast by Application (2021-2026)
    • 5.2.3 Global Solder Bumps Price Forecast by Application (2021-2026)

6 North America

  • 6.1 North America Solder Bumps by Country
    • 6.1.1 North America Solder Bumps Sales by Country
    • 6.1.2 North America Solder Bumps Revenue by Country
    • 6.1.3 U.S.
    • 6.1.4 Canada
  • 6.2 North America Solder Bumps Market Facts & Figures by Type
  • 6.3 North America Solder Bumps Market Facts & Figures by Application

7 Europe

  • 7.1 Europe Solder Bumps by Country
    • 7.1.1 Europe Solder Bumps Sales by Country
    • 7.1.2 Europe Solder Bumps Revenue by Country
    • 7.1.3 Germany
    • 7.1.4 France
    • 7.1.5 U.K.
    • 7.1.6 Italy
    • 7.1.7 Russia
  • 7.2 Europe Solder Bumps Market Facts & Figures by Type
  • 7.3 Europe Solder Bumps Market Facts & Figures by Application

8 Asia Pacific

  • 8.1 Asia Pacific Solder Bumps by Region
    • 8.1.1 Asia Pacific Solder Bumps Sales by Region
    • 8.1.2 Asia Pacific Solder Bumps Revenue by Region
    • 8.1.3 China
    • 8.1.4 Japan
    • 8.1.5 South Korea
    • 8.1.6 India
    • 8.1.7 Australia
    • 8.1.8 Taiwan
    • 8.1.9 Indonesia
    • 8.1.10 Thailand
    • 8.1.11 Malaysia
    • 8.1.12 Philippines
    • 8.1.13 Vietnam
  • 8.2 Asia Pacific Solder Bumps Market Facts & Figures by Type
  • 8.3 Asia Pacific Solder Bumps Market Facts & Figures by Application

9 Latin America

  • 9.1 Latin America Solder Bumps by Country
    • 9.1.1 Latin America Solder Bumps Sales by Country
    • 9.1.2 Latin America Solder Bumps Revenue by Country
    • 9.1.3 Mexico
    • 9.1.4 Brazil
    • 9.1.5 Argentina
  • 9.2 Central & South America Solder Bumps Market Facts & Figures by Type
  • 9.3 Central & South America Solder Bumps Market Facts & Figures by Application

10 Middle East and Africa

  • 10.1 Middle East and Africa Solder Bumps by Country
    • 10.1.1 Middle East and Africa Solder Bumps Sales by Country
    • 10.1.2 Middle East and Africa Solder Bumps Revenue by Country
    • 10.1.3 Turkey
    • 10.1.4 Saudi Arabia
    • 10.1.5 U.A.E
  • 10.2 Middle East and Africa Solder Bumps Market Facts & Figures by Type
  • 10.3 Middle East and Africa Solder Bumps Market Facts & Figures by Application

11 Company Profiles

  • 11.1 Senju Metal (Japan)
    • 11.1.1 Senju Metal (Japan) Corporation Information
    • 11.1.2 Senju Metal (Japan) Description and Business Overview
    • 11.1.3 Senju Metal (Japan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.1.4 Senju Metal (Japan) Solder Bumps Products Offered
    • 11.1.5 Senju Metal (Japan) Related Developments
  • 11.2 DS HiMetal (Korea)
    • 11.2.1 DS HiMetal (Korea) Corporation Information
    • 11.2.2 DS HiMetal (Korea) Description and Business Overview
    • 11.2.3 DS HiMetal (Korea) Sales, Revenue and Gross Margin (2015-2020)
    • 11.2.4 DS HiMetal (Korea) Solder Bumps Products Offered
    • 11.2.5 DS HiMetal (Korea) Related Developments
  • 11.3 MKE (Korea)
    • 11.3.1 MKE (Korea) Corporation Information
    • 11.3.2 MKE (Korea) Description and Business Overview
    • 11.3.3 MKE (Korea) Sales, Revenue and Gross Margin (2015-2020)
    • 11.3.4 MKE (Korea) Solder Bumps Products Offered
    • 11.3.5 MKE (Korea) Related Developments
  • 11.4 YCTC (Taiwan)
    • 11.4.1 YCTC (Taiwan) Corporation Information
    • 11.4.2 YCTC (Taiwan) Description and Business Overview
    • 11.4.3 YCTC (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.4.4 YCTC (Taiwan) Solder Bumps Products Offered
    • 11.4.5 YCTC (Taiwan) Related Developments
  • 11.5 Nippon Micrometal (Japan)
    • 11.5.1 Nippon Micrometal (Japan) Corporation Information
    • 11.5.2 Nippon Micrometal (Japan) Description and Business Overview
    • 11.5.3 Nippon Micrometal (Japan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.5.4 Nippon Micrometal (Japan) Solder Bumps Products Offered
    • 11.5.5 Nippon Micrometal (Japan) Related Developments
  • 11.6 Accurus (Taiwan)
    • 11.6.1 Accurus (Taiwan) Corporation Information
    • 11.6.2 Accurus (Taiwan) Description and Business Overview
    • 11.6.3 Accurus (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.6.4 Accurus (Taiwan) Solder Bumps Products Offered
    • 11.6.5 Accurus (Taiwan) Related Developments
  • 11.7 PMTC (Taiwan)
    • 11.7.1 PMTC (Taiwan) Corporation Information
    • 11.7.2 PMTC (Taiwan) Description and Business Overview
    • 11.7.3 PMTC (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.7.4 PMTC (Taiwan) Solder Bumps Products Offered
    • 11.7.5 PMTC (Taiwan) Related Developments
  • 11.8 Shanghai hiking solder material (China)
    • 11.8.1 Shanghai hiking solder material (China) Corporation Information
    • 11.8.2 Shanghai hiking solder material (China) Description and Business Overview
    • 11.8.3 Shanghai hiking solder material (China) Sales, Revenue and Gross Margin (2015-2020)
    • 11.8.4 Shanghai hiking solder material (China) Solder Bumps Products Offered
    • 11.8.5 Shanghai hiking solder material (China) Related Developments
  • 11.9 Shenmao Technology (Taiwan)
    • 11.9.1 Shenmao Technology (Taiwan) Corporation Information
    • 11.9.2 Shenmao Technology (Taiwan) Description and Business Overview
    • 11.9.3 Shenmao Technology (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.9.4 Shenmao Technology (Taiwan) Solder Bumps Products Offered
    • 11.9.5 Shenmao Technology (Taiwan) Related Developments
  • 11.1 Senju Metal (Japan)
    • 11.1.1 Senju Metal (Japan) Corporation Information
    • 11.1.2 Senju Metal (Japan) Description and Business Overview
    • 11.1.3 Senju Metal (Japan) Sales, Revenue and Gross Margin (2015-2020)
    • 11.1.4 Senju Metal (Japan) Solder Bumps Products Offered
    • 11.1.5 Senju Metal (Japan) Related Developments

12 Future Forecast by Regions (Countries) (2021-2026)

  • 12.1 Solder Bumps Market Estimates and Projections by Region
    • 12.1.1 Global Solder Bumps Sales Forecast by Regions 2021-2026
    • 12.1.2 Global Solder Bumps Revenue Forecast by Regions 2021-2026
  • 12.2 North America Solder Bumps Market Size Forecast (2021-2026)
    • 12.2.1 North America: Solder Bumps Sales Forecast (2021-2026)
    • 12.2.2 North America: Solder Bumps Revenue Forecast (2021-2026)
    • 12.2.3 North America: Solder Bumps Market Size Forecast by Country (2021-2026)
  • 12.3 Europe Solder Bumps Market Size Forecast (2021-2026)
    • 12.3.1 Europe: Solder Bumps Sales Forecast (2021-2026)
    • 12.3.2 Europe: Solder Bumps Revenue Forecast (2021-2026)
    • 12.3.3 Europe: Solder Bumps Market Size Forecast by Country (2021-2026)
  • 12.4 Asia Pacific Solder Bumps Market Size Forecast (2021-2026)
    • 12.4.1 Asia Pacific: Solder Bumps Sales Forecast (2021-2026)
    • 12.4.2 Asia Pacific: Solder Bumps Revenue Forecast (2021-2026)
    • 12.4.3 Asia Pacific: Solder Bumps Market Size Forecast by Region (2021-2026)
  • 12.5 Latin America Solder Bumps Market Size Forecast (2021-2026)
    • 12.5.1 Latin America: Solder Bumps Sales Forecast (2021-2026)
    • 12.5.2 Latin America: Solder Bumps Revenue Forecast (2021-2026)
    • 12.5.3 Latin America: Solder Bumps Market Size Forecast by Country (2021-2026)
  • 12.6 Middle East and Africa Solder Bumps Market Size Forecast (2021-2026)
    • 12.6.1 Middle East and Africa: Solder Bumps Sales Forecast (2021-2026)
    • 12.6.2 Middle East and Africa: Solder Bumps Revenue Forecast (2021-2026)
    • 12.6.3 Middle East and Africa: Solder Bumps Market Size Forecast by Country (2021-2026)

13 Market Opportunities, Challenges, Risks and Influences Factors Analysis

  • 13.1 Market Opportunities and Drivers
  • 13.2 Market Challenges
  • 13.3 Market Risks/Restraints
  • 13.4 Porter's Five Forces Analysis
  • 13.5 Primary Interviews with Key Solder Bumps Players (Opinion Leaders)

14 Value Chain and Sales Channels Analysis

  • 14.1 Value Chain Analysis
  • 14.2 Solder Bumps Customers
  • 14.3 Sales Channels Analysis
    • 14.3.1 Sales Channels
    • 14.3.2 Distributors

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Research Methodology
      • 16.1.1 Methodology/Research Approach
      • 16.1.2 Data Source
    • 16.2 Author Details

    Solder Bumps market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Solder Bumps market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by Type and by Application for the period 2015-2026.

    Segment by Type, the Solder Bumps market is segmented into
    Lead Solder Bumps
    Lead Free Solder Bumps

    Segment by Application, the Solder Bumps market is segmented into
    BGA
    CSP & WLCSP
    Flip-Chip & Others

    Regional and Country-level Analysis
    The Solder Bumps market is analysed and market size information is provided by regions (countries).
    The key regions covered in the Solder Bumps market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
    The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.
    Competitive Landscape and Solder Bumps Market Share Analysis
    Solder Bumps market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Solder Bumps business, the date to enter into the Solder Bumps market, Solder Bumps product introduction, recent developments, etc.

    The major vendors covered:
    Senju Metal (Japan)
    DS HiMetal (Korea)
    MKE (Korea)
    YCTC (Taiwan)
    Nippon Micrometal (Japan)
    Accurus (Taiwan)
    PMTC (Taiwan)
    Shanghai hiking solder material (China)
    Shenmao Technology (Taiwan)

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