Copyright Reports & Markets. All rights reserved.

Global (United States, European Union and China) Solder Bumping Flip Chip Market Research Report 2019-2025

Request for Sample of this report
Buy now

Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Solder Bumping Flip Chip Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 3D IC
      • 1.3.3 2.5D IC
      • 1.3.4 2D IC
    • 1.4 Market Segment by Application
      • 1.4.1 Global Solder Bumping Flip Chip Market Share by Application (2019-2025)
      • 1.4.2 Electronics
      • 1.4.3 Industrial
      • 1.4.4 Automotive & Transport
      • 1.4.5 Healthcare
      • 1.4.6 IT & Telecommunication
      • 1.4.7 Aerospace and Defense
      • 1.4.8 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Solder Bumping Flip Chip Production Value 2014-2025
      • 2.1.2 Global Solder Bumping Flip Chip Production 2014-2025
      • 2.1.3 Global Solder Bumping Flip Chip Capacity 2014-2025
      • 2.1.4 Global Solder Bumping Flip Chip Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Solder Bumping Flip Chip Market Size CAGR of Key Regions
      • 2.2.2 Global Solder Bumping Flip Chip Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Solder Bumping Flip Chip Capacity by Manufacturers
      • 3.1.2 Global Solder Bumping Flip Chip Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Solder Bumping Flip Chip Revenue by Manufacturers (2014-2019)
      • 3.2.2 Solder Bumping Flip Chip Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Solder Bumping Flip Chip Market Concentration Ratio (CR5 and HHI)
    • 3.3 Solder Bumping Flip Chip Price by Manufacturers
    • 3.4 Key Manufacturers Solder Bumping Flip Chip Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Solder Bumping Flip Chip Market
    • 3.6 Key Manufacturers Solder Bumping Flip Chip Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 3D IC Production and Production Value (2014-2019)
      • 4.1.2 2.5D IC Production and Production Value (2014-2019)
      • 4.1.3 2D IC Production and Production Value (2014-2019)
    • 4.2 Global Solder Bumping Flip Chip Production Market Share by Type
    • 4.3 Global Solder Bumping Flip Chip Production Value Market Share by Type
    • 4.4 Solder Bumping Flip Chip Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Solder Bumping Flip Chip Consumption by Application

    6 Production by Regions

    • 6.1 Global Solder Bumping Flip Chip Production (History Data) by Regions 2014-2019
    • 6.2 Global Solder Bumping Flip Chip Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Solder Bumping Flip Chip Production Growth Rate 2014-2019
      • 6.3.2 United States Solder Bumping Flip Chip Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Solder Bumping Flip Chip Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Solder Bumping Flip Chip Production Growth Rate 2014-2019
      • 6.4.2 European Union Solder Bumping Flip Chip Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Solder Bumping Flip Chip Import & Export
    • 6.5 China
      • 6.5.1 China Solder Bumping Flip Chip Production Growth Rate 2014-2019
      • 6.5.2 China Solder Bumping Flip Chip Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Solder Bumping Flip Chip Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Solder Bumping Flip Chip Consumption by Regions

    • 7.1 Global Solder Bumping Flip Chip Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Solder Bumping Flip Chip Consumption by Type
      • 7.2.2 United States Solder Bumping Flip Chip Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Solder Bumping Flip Chip Consumption by Type
      • 7.3.2 European Union Solder Bumping Flip Chip Consumption by Application
    • 7.4 China
      • 7.4.1 China Solder Bumping Flip Chip Consumption by Type
      • 7.4.2 China Solder Bumping Flip Chip Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Solder Bumping Flip Chip Consumption by Type
      • 7.5.2 Rest of World Solder Bumping Flip Chip Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 TSMC (Taiwan)
      • 8.1.1 TSMC (Taiwan) Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.1.4 Solder Bumping Flip Chip Product Introduction
      • 8.1.5 TSMC (Taiwan) Recent Development
    • 8.2 Samsung (South Korea)
      • 8.2.1 Samsung (South Korea) Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.2.4 Solder Bumping Flip Chip Product Introduction
      • 8.2.5 Samsung (South Korea) Recent Development
    • 8.3 ASE Group (Taiwan)
      • 8.3.1 ASE Group (Taiwan) Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.3.4 Solder Bumping Flip Chip Product Introduction
      • 8.3.5 ASE Group (Taiwan) Recent Development
    • 8.4 Amkor Technology (US)
      • 8.4.1 Amkor Technology (US) Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.4.4 Solder Bumping Flip Chip Product Introduction
      • 8.4.5 Amkor Technology (US) Recent Development
    • 8.5 UMC (Taiwan)
      • 8.5.1 UMC (Taiwan) Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.5.4 Solder Bumping Flip Chip Product Introduction
      • 8.5.5 UMC (Taiwan) Recent Development
    • 8.6 STATS ChipPAC (Singapore)
      • 8.6.1 STATS ChipPAC (Singapore) Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.6.4 Solder Bumping Flip Chip Product Introduction
      • 8.6.5 STATS ChipPAC (Singapore) Recent Development
    • 8.7 Powertech Technology (Taiwan)
      • 8.7.1 Powertech Technology (Taiwan) Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.7.4 Solder Bumping Flip Chip Product Introduction
      • 8.7.5 Powertech Technology (Taiwan) Recent Development
    • 8.8 STMicroelectronics (Switzerland)
      • 8.8.1 STMicroelectronics (Switzerland) Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Solder Bumping Flip Chip
      • 8.8.4 Solder Bumping Flip Chip Product Introduction
      • 8.8.5 STMicroelectronics (Switzerland) Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Solder Bumping Flip Chip Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Solder Bumping Flip Chip Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Solder Bumping Flip Chip Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Solder Bumping Flip Chip Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Solder Bumping Flip Chip Production Forecast by Type
      • 9.7.2 Global Solder Bumping Flip Chip Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Solder Bumping Flip Chip Sales Channels
      • 10.2.2 Solder Bumping Flip Chip Distributors
    • 10.3 Solder Bumping Flip Chip Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
      In 2019, the market size of Solder Bumping Flip Chip is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Solder Bumping Flip Chip.

      This report studies the global market size of Solder Bumping Flip Chip, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Solder Bumping Flip Chip production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      TSMC (Taiwan)
      Samsung (South Korea)
      ASE Group (Taiwan)
      Amkor Technology (US)
      UMC (Taiwan)
      STATS ChipPAC (Singapore)
      Powertech Technology (Taiwan)
      STMicroelectronics (Switzerland)

      Market Segment by Product Type
      3D IC
      2.5D IC
      2D IC

      Market Segment by Application
      Electronics
      Industrial
      Automotive & Transport
      Healthcare
      IT & Telecommunication
      Aerospace and Defense
      Others

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Solder Bumping Flip Chip status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Solder Bumping Flip Chip manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Solder Bumping Flip Chip are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

      Buy now