Global Solder Ball Market Growth 2019-2024
Table of Contents
2019-2024 Global Solder Ball Consumption Market Report
1 Scope of the Report
- 1.1 Market Introduction
- 1.2 Research Objectives
- 1.3 Years Considered
- 1.4 Market Research Methodology
- 1.5 Economic Indicators
- 1.6 Currency Considered
2 Executive Summary
- 2.1 World Market Overview
- 2.1.1 Global Solder Ball Consumption 2014-2024
- 2.1.2 Solder Ball Consumption CAGR by Region
- 2.2 Solder Ball Segment by Type
- 2.2.1 Lead Solder Ball
- 2.2.2 Lead Free Solder Ball
- 2.3 Solder Ball Consumption by Type
- 2.3.1 Global Solder Ball Consumption Market Share by Type (2014-2019)
- 2.3.2 Global Solder Ball Revenue and Market Share by Type (2014-2019)
- 2.3.3 Global Solder Ball Sale Price by Type (2014-2019)
- 2.4 Solder Ball Segment by Application
- 2.4.1 BGA
- 2.4.2 CSP & WLCSP
- 2.4.3 Flip-Chip & Others
- 2.5 Solder Ball Consumption by Application
- 2.5.1 Global Solder Ball Consumption Market Share by Application (2014-2019)
- 2.5.2 Global Solder Ball Value and Market Share by Application (2014-2019)
- 2.5.3 Global Solder Ball Sale Price by Application (2014-2019)
3 Global Solder Ball by Players
- 3.1 Global Solder Ball Sales Market Share by Players
- 3.1.1 Global Solder Ball Sales by Players (2017-2019)
- 3.1.2 Global Solder Ball Sales Market Share by Players (2017-2019)
- 3.2 Global Solder Ball Revenue Market Share by Players
- 3.2.1 Global Solder Ball Revenue by Players (2017-2019)
- 3.2.2 Global Solder Ball Revenue Market Share by Players (2017-2019)
- 3.3 Global Solder Ball Sale Price by Players
- 3.4 Global Solder Ball Manufacturing Base Distribution, Sales Area, Product Types by Players
- 3.4.1 Global Solder Ball Manufacturing Base Distribution and Sales Area by Players
- 3.4.2 Players Solder Ball Products Offered
- 3.5 Market Concentration Rate Analysis
- 3.5.1 Competition Landscape Analysis
- 3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2017-2019)
- 3.6 New Products and Potential Entrants
- 3.7 Mergers & Acquisitions, Expansion
4 Solder Ball by Regions
- 4.1 Solder Ball by Regions
- 4.1.1 Global Solder Ball Consumption by Regions
- 4.1.2 Global Solder Ball Value by Regions
- 4.2 Americas Solder Ball Consumption Growth
- 4.3 APAC Solder Ball Consumption Growth
- 4.4 Europe Solder Ball Consumption Growth
- 4.5 Middle East & Africa Solder Ball Consumption Growth
5 Americas
- 5.1 Americas Solder Ball Consumption by Countries
- 5.1.1 Americas Solder Ball Consumption by Countries (2014-2019)
- 5.1.2 Americas Solder Ball Value by Countries (2014-2019)
- 5.2 Americas Solder Ball Consumption by Type
- 5.3 Americas Solder Ball Consumption by Application
- 5.4 United States
- 5.5 Canada
- 5.6 Mexico
- 5.7 Key Economic Indicators of Few Americas Countries
6 APAC
- 6.1 APAC Solder Ball Consumption by Countries
- 6.1.1 APAC Solder Ball Consumption by Countries (2014-2019)
- 6.1.2 APAC Solder Ball Value by Countries (2014-2019)
- 6.2 APAC Solder Ball Consumption by Type
- 6.3 APAC Solder Ball Consumption by Application
- 6.4 China
- 6.5 Japan
- 6.6 Korea
- 6.7 Southeast Asia
- 6.8 India
- 6.9 Australia
- 6.10 Key Economic Indicators of Few APAC Countries
7 Europe
- 7.1 Europe Solder Ball by Countries
- 7.1.1 Europe Solder Ball Consumption by Countries (2014-2019)
- 7.1.2 Europe Solder Ball Value by Countries (2014-2019)
- 7.2 Europe Solder Ball Consumption by Type
- 7.3 Europe Solder Ball Consumption by Application
- 7.4 Germany
- 7.5 France
- 7.6 UK
- 7.7 Italy
- 7.8 Russia
- 7.9 Spain
- 7.10 Key Economic Indicators of Few Europe Countries
8 Middle East & Africa
- 8.1 Middle East & Africa Solder Ball by Countries
- 8.1.1 Middle East & Africa Solder Ball Consumption by Countries (2014-2019)
- 8.1.2 Middle East & Africa Solder Ball Value by Countries (2014-2019)
- 8.2 Middle East & Africa Solder Ball Consumption by Type
- 8.3 Middle East & Africa Solder Ball Consumption by Application
- 8.4 Egypt
- 8.5 South Africa
- 8.6 Israel
- 8.7 Turkey
- 8.8 GCC Countries
9 Market Drivers, Challenges and Trends
- 9.1 Market Drivers and Impact
- 9.1.1 Growing Demand from Key Regions
- 9.1.2 Growing Demand from Key Applications and Potential Industries
- 9.2 Market Challenges and Impact
- 9.3 Market Trends
10 Marketing, Distributors and Customer
- 10.1 Sales Channel
- 10.1.1 Direct Channels
- 10.1.2 Indirect Channels
- 10.2 Solder Ball Distributors
- 10.3 Solder Ball Customer
11 Global Solder Ball Market Forecast
- 11.1 Global Solder Ball Consumption Forecast (2019-2024)
- 11.2 Global Solder Ball Forecast by Regions
- 11.2.1 Global Solder Ball Forecast by Regions (2019-2024)
- 11.2.2 Global Solder Ball Value Forecast by Regions (2019-2024)
- 11.2.3 Americas Consumption Forecast
- 11.2.4 APAC Consumption Forecast
- 11.2.5 Europe Consumption Forecast
- 11.2.6 Middle East & Africa Consumption Forecast
- 11.3 Americas Forecast by Countries
- 11.3.1 United States Market Forecast
- 11.3.2 Canada Market Forecast
- 11.3.3 Mexico Market Forecast
- 11.3.4 Brazil Market Forecast
- 11.4 APAC Forecast by Countries
- 11.4.1 China Market Forecast
- 11.4.2 Japan Market Forecast
- 11.4.3 Korea Market Forecast
- 11.4.4 Southeast Asia Market Forecast
- 11.4.5 India Market Forecast
- 11.4.6 Australia Market Forecast
- 11.5 Europe Forecast by Countries
- 11.5.1 Germany Market Forecast
- 11.5.2 France Market Forecast
- 11.5.3 UK Market Forecast
- 11.5.4 Italy Market Forecast
- 11.5.5 Russia Market Forecast
- 11.5.6 Spain Market Forecast
- 11.6 Middle East & Africa Forecast by Countries
- 11.6.1 Egypt Market Forecast
- 11.6.2 South Africa Market Forecast
- 11.6.3 Israel Market Forecast
- 11.6.4 Turkey Market Forecast
- 11.6.5 GCC Countries Market Forecast
- 11.7 Global Solder Ball Forecast by Type
- 11.8 Global Solder Ball Forecast by Application
12 Key Players Analysis
- 12.1 Senju Metal
- 12.1.1 Company Details
- 12.1.2 Solder Ball Product Offered
- 12.1.3 Senju Metal Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.1.4 Main Business Overview
- 12.1.5 Senju Metal News
- 12.2 DS HiMetal
- 12.2.1 Company Details
- 12.2.2 Solder Ball Product Offered
- 12.2.3 DS HiMetal Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.2.4 Main Business Overview
- 12.2.5 DS HiMetal News
- 12.3 MKE
- 12.3.1 Company Details
- 12.3.2 Solder Ball Product Offered
- 12.3.3 MKE Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.3.4 Main Business Overview
- 12.3.5 MKE News
- 12.4 YCTC
- 12.4.1 Company Details
- 12.4.2 Solder Ball Product Offered
- 12.4.3 YCTC Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.4.4 Main Business Overview
- 12.4.5 YCTC News
- 12.5 Nippon Micrometal
- 12.5.1 Company Details
- 12.5.2 Solder Ball Product Offered
- 12.5.3 Nippon Micrometal Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.5.4 Main Business Overview
- 12.5.5 Nippon Micrometal News
- 12.6 Accurus
- 12.6.1 Company Details
- 12.6.2 Solder Ball Product Offered
- 12.6.3 Accurus Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.6.4 Main Business Overview
- 12.6.5 Accurus News
- 12.7 PMTC
- 12.7.1 Company Details
- 12.7.2 Solder Ball Product Offered
- 12.7.3 PMTC Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.7.4 Main Business Overview
- 12.7.5 PMTC News
- 12.8 Shanghai hiking solder material
- 12.8.1 Company Details
- 12.8.2 Solder Ball Product Offered
- 12.8.3 Shanghai hiking solder material Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.8.4 Main Business Overview
- 12.8.5 Shanghai hiking solder material News
- 12.9 Shenmao Technology
- 12.9.1 Company Details
- 12.9.2 Solder Ball Product Offered
- 12.9.3 Shenmao Technology Solder Ball Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.9.4 Main Business Overview
- 12.9.5 Shenmao Technology News
13 Research Findings and Conclusion
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.
According to this study, over the next five years the Solder Ball market will register a 6.6% CAGR in terms of revenue, the global market size will reach US$ 310 million by 2024, from US$ 210 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Solder Ball business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Solder Ball market by product type, application, key manufacturers and key regions and countries.
This study considers the Solder Ball value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Lead Solder Ball
Lead Free Solder Ball
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
BGA
CSP & WLCSP
Flip-Chip & Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Solder Ball consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Solder Ball market by identifying its various subsegments.
Focuses on the key global Solder Ball manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Solder Ball with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Solder Ball submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.