Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 2 Inch
    • 1.1.2.2 3 Inch
    • 1.1.2.3 4 Inch
    • 1.1.2.4 6 Inch
  • 1.1.3 Market by Application
    • 1.1.3.1 Power Device
    • 1.1.3.2 Electronics & Optoelectronics
    • 1.1.3.3 Wireless Infrastructure
    • 1.1.3.4 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Cree
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 Dow Corning
• 6.3 SiCrystal
• 6.4 II-VI Advanced Materials
• 6.5 Nippon Steel & Sumitomo Metal
• 6.6 Norstel
• 6.7 Aymont Technology
• 6.8 TankeBlue
• 6.9 SICC
• 6.10 Hebei Synlight Crystal
• 6.11 CETC

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary
SiC single crystal wafers have excellent heat resistance and voltage resistance compared to silicon wafers that are widely used for semiconductors. SiC single crystal wafers can remarkably reduce energy loss during electric power control, significantly contributing to the reduction of energy use and environmental stress. They are highly expected as substrate materials for the next-generation power semiconductor devices.
Market Segment as follows:
By Type
 2 Inch
3 Inch
4 Inch
6 Inch
By Application
Power Device
Electronics & Optoelectronics
Wireless Infrastructure
Others
By Company
Cree
Dow Corning
SiCrystal
II-VI Advanced Materials
Nippon Steel & Sumitomo Metal
Norstel
Aymont Technology
TankeBlue
SICC
Hebei Synlight Crystal
CETC
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.