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Global (United States, European Union and China) Semiconductor Packaging Materials Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Semiconductor Packaging Materials Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Organic Substrates
      • 1.3.3 Lead Frames
      • 1.3.4 Bonding Wires
      • 1.3.5 Other
    • 1.4 Market Segment by Application
      • 1.4.1 Global Semiconductor Packaging Materials Market Share by Application (2019-2025)
      • 1.4.2 IDM (Integrated Device Manufacturers)
      • 1.4.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Semiconductor Packaging Materials Production Value 2014-2025
      • 2.1.2 Global Semiconductor Packaging Materials Production 2014-2025
      • 2.1.3 Global Semiconductor Packaging Materials Capacity 2014-2025
      • 2.1.4 Global Semiconductor Packaging Materials Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Semiconductor Packaging Materials Market Size CAGR of Key Regions
      • 2.2.2 Global Semiconductor Packaging Materials Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Semiconductor Packaging Materials Capacity by Manufacturers
      • 3.1.2 Global Semiconductor Packaging Materials Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Semiconductor Packaging Materials Revenue by Manufacturers (2014-2019)
      • 3.2.2 Semiconductor Packaging Materials Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Semiconductor Packaging Materials Market Concentration Ratio (CR5 and HHI)
    • 3.3 Semiconductor Packaging Materials Price by Manufacturers
    • 3.4 Key Manufacturers Semiconductor Packaging Materials Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Semiconductor Packaging Materials Market
    • 3.6 Key Manufacturers Semiconductor Packaging Materials Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Organic Substrates Production and Production Value (2014-2019)
      • 4.1.2 Lead Frames Production and Production Value (2014-2019)
      • 4.1.3 Bonding Wires Production and Production Value (2014-2019)
      • 4.1.4 Other Production and Production Value (2014-2019)
    • 4.2 Global Semiconductor Packaging Materials Production Market Share by Type
    • 4.3 Global Semiconductor Packaging Materials Production Value Market Share by Type
    • 4.4 Semiconductor Packaging Materials Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Semiconductor Packaging Materials Consumption by Application

    6 Production by Regions

    • 6.1 Global Semiconductor Packaging Materials Production (History Data) by Regions 2014-2019
    • 6.2 Global Semiconductor Packaging Materials Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Semiconductor Packaging Materials Production Growth Rate 2014-2019
      • 6.3.2 United States Semiconductor Packaging Materials Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Semiconductor Packaging Materials Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Semiconductor Packaging Materials Production Growth Rate 2014-2019
      • 6.4.2 European Union Semiconductor Packaging Materials Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Semiconductor Packaging Materials Import & Export
    • 6.5 China
      • 6.5.1 China Semiconductor Packaging Materials Production Growth Rate 2014-2019
      • 6.5.2 China Semiconductor Packaging Materials Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Semiconductor Packaging Materials Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Semiconductor Packaging Materials Consumption by Regions

    • 7.1 Global Semiconductor Packaging Materials Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Semiconductor Packaging Materials Consumption by Type
      • 7.2.2 United States Semiconductor Packaging Materials Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Semiconductor Packaging Materials Consumption by Type
      • 7.3.2 European Union Semiconductor Packaging Materials Consumption by Application
    • 7.4 China
      • 7.4.1 China Semiconductor Packaging Materials Consumption by Type
      • 7.4.2 China Semiconductor Packaging Materials Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Semiconductor Packaging Materials Consumption by Type
      • 7.5.2 Rest of World Semiconductor Packaging Materials Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Amkor Technology
      • 8.1.1 Amkor Technology Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.1.4 Semiconductor Packaging Materials Product Introduction
      • 8.1.5 Amkor Technology Recent Development
    • 8.2 DuPont
      • 8.2.1 DuPont Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.2.4 Semiconductor Packaging Materials Product Introduction
      • 8.2.5 DuPont Recent Development
    • 8.3 BASF
      • 8.3.1 BASF Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.3.4 Semiconductor Packaging Materials Product Introduction
      • 8.3.5 BASF Recent Development
    • 8.4 Henkel
      • 8.4.1 Henkel Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.4.4 Semiconductor Packaging Materials Product Introduction
      • 8.4.5 Henkel Recent Development
    • 8.5 Honeywell
      • 8.5.1 Honeywell Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.5.4 Semiconductor Packaging Materials Product Introduction
      • 8.5.5 Honeywell Recent Development
    • 8.6 Kyocera
      • 8.6.1 Kyocera Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.6.4 Semiconductor Packaging Materials Product Introduction
      • 8.6.5 Kyocera Recent Development
    • 8.7 Toppan Printing
      • 8.7.1 Toppan Printing Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.7.4 Semiconductor Packaging Materials Product Introduction
      • 8.7.5 Toppan Printing Recent Development
    • 8.8 Hitachi Chemical
      • 8.8.1 Hitachi Chemical Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.8.4 Semiconductor Packaging Materials Product Introduction
      • 8.8.5 Hitachi Chemical Recent Development
    • 8.9 ASM Pacific Technology
      • 8.9.1 ASM Pacific Technology Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.9.4 Semiconductor Packaging Materials Product Introduction
      • 8.9.5 ASM Pacific Technology Recent Development
    • 8.10 Beijing Kehua New Chemical Technology
      • 8.10.1 Beijing Kehua New Chemical Technology Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Semiconductor Packaging Materials
      • 8.10.4 Semiconductor Packaging Materials Product Introduction
      • 8.10.5 Beijing Kehua New Chemical Technology Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Semiconductor Packaging Materials Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Semiconductor Packaging Materials Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Semiconductor Packaging Materials Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Semiconductor Packaging Materials Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Semiconductor Packaging Materials Production Forecast by Type
      • 9.7.2 Global Semiconductor Packaging Materials Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Semiconductor Packaging Materials Sales Channels
      • 10.2.2 Semiconductor Packaging Materials Distributors
    • 10.3 Semiconductor Packaging Materials Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties.
      The demand for organic substrates semiconductor packaging materials is increasing because the semiconductor packaging industry is advancing towards leadless and cable-less packaging materials. These substrates are replacing the application of lead frames and bonding wires. These substrates are flexible and can also be used as interconnects. Our research analysts have estimated that the IC packaging materials market will witness considerable growth in the organic substrates segment throughout the projected period.
      Countries such as Taiwan, China, Japan, and South Korea are the major contributors to the growth of the semiconductor packaging materials market in APAC. The adoption of integrated circuit packaging and semiconductor packaging is increasing in this region due to the growing adoption of consumer electronic goods and smart mobile devices. The focus of the international corporations towards expanding their manufacturing operations in countries such as China, due to the availability of cheap labor, raw materials, and favorable factors of production, will also drive the market’s growth prospects in this region.
      In 2019, the market size of Semiconductor Packaging Materials is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Packaging Materials.

      This report studies the global market size of Semiconductor Packaging Materials, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Semiconductor Packaging Materials production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Amkor Technology
      DuPont
      BASF
      Henkel
      Honeywell
      Kyocera
      Toppan Printing
      Hitachi Chemical
      ASM Pacific Technology
      Beijing Kehua New Chemical Technology

      Market Segment by Product Type
      Organic Substrates
      Lead Frames
      Bonding Wires
      Other

      Market Segment by Application
      IDM (Integrated Device Manufacturers)
      OSAT (Outsourced Semiconductor Assembly and Test Companies)

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Semiconductor Packaging Materials status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Semiconductor Packaging Materials manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Semiconductor Packaging Materials are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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