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Global (United States, European Union and China) Semiconductor Packaging Material Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Semiconductor Packaging Material Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Organic Substrates
      • 1.3.3 Bonding Wires
      • 1.3.4 Encapsulation Resins
      • 1.3.5 Ceramic Packages
      • 1.3.6 Solder Balls
      • 1.3.7 Wafer Level Packaging Dielectrics
      • 1.3.8 Others
    • 1.4 Market Segment by Application
      • 1.4.1 Global Semiconductor Packaging Material Market Share by Application (2019-2025)
      • 1.4.2 Semiconductor Packaging
      • 1.4.3 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Semiconductor Packaging Material Production Value 2014-2025
      • 2.1.2 Global Semiconductor Packaging Material Production 2014-2025
      • 2.1.3 Global Semiconductor Packaging Material Capacity 2014-2025
      • 2.1.4 Global Semiconductor Packaging Material Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Semiconductor Packaging Material Market Size CAGR of Key Regions
      • 2.2.2 Global Semiconductor Packaging Material Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Semiconductor Packaging Material Capacity by Manufacturers
      • 3.1.2 Global Semiconductor Packaging Material Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Semiconductor Packaging Material Revenue by Manufacturers (2014-2019)
      • 3.2.2 Semiconductor Packaging Material Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Semiconductor Packaging Material Market Concentration Ratio (CR5 and HHI)
    • 3.3 Semiconductor Packaging Material Price by Manufacturers
    • 3.4 Key Manufacturers Semiconductor Packaging Material Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Semiconductor Packaging Material Market
    • 3.6 Key Manufacturers Semiconductor Packaging Material Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Organic Substrates Production and Production Value (2014-2019)
      • 4.1.2 Bonding Wires Production and Production Value (2014-2019)
      • 4.1.3 Encapsulation Resins Production and Production Value (2014-2019)
      • 4.1.4 Ceramic Packages Production and Production Value (2014-2019)
      • 4.1.5 Solder Balls Production and Production Value (2014-2019)
      • 4.1.6 Wafer Level Packaging Dielectrics Production and Production Value (2014-2019)
      • 4.1.7 Others Production and Production Value (2014-2019)
    • 4.2 Global Semiconductor Packaging Material Production Market Share by Type
    • 4.3 Global Semiconductor Packaging Material Production Value Market Share by Type
    • 4.4 Semiconductor Packaging Material Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Semiconductor Packaging Material Consumption by Application

    6 Production by Regions

    • 6.1 Global Semiconductor Packaging Material Production (History Data) by Regions 2014-2019
    • 6.2 Global Semiconductor Packaging Material Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Semiconductor Packaging Material Production Growth Rate 2014-2019
      • 6.3.2 United States Semiconductor Packaging Material Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Semiconductor Packaging Material Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Semiconductor Packaging Material Production Growth Rate 2014-2019
      • 6.4.2 European Union Semiconductor Packaging Material Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Semiconductor Packaging Material Import & Export
    • 6.5 China
      • 6.5.1 China Semiconductor Packaging Material Production Growth Rate 2014-2019
      • 6.5.2 China Semiconductor Packaging Material Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Semiconductor Packaging Material Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Semiconductor Packaging Material Consumption by Regions

    • 7.1 Global Semiconductor Packaging Material Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Semiconductor Packaging Material Consumption by Type
      • 7.2.2 United States Semiconductor Packaging Material Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Semiconductor Packaging Material Consumption by Type
      • 7.3.2 European Union Semiconductor Packaging Material Consumption by Application
    • 7.4 China
      • 7.4.1 China Semiconductor Packaging Material Consumption by Type
      • 7.4.2 China Semiconductor Packaging Material Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Semiconductor Packaging Material Consumption by Type
      • 7.5.2 Rest of World Semiconductor Packaging Material Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Henkel AG & Company
      • 8.1.1 Henkel AG & Company Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Semiconductor Packaging Material
      • 8.1.4 Semiconductor Packaging Material Product Introduction
      • 8.1.5 Henkel AG & Company Recent Development
    • 8.2 KGaA (Germany)
      • 8.2.1 KGaA (Germany) Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Semiconductor Packaging Material
      • 8.2.4 Semiconductor Packaging Material Product Introduction
      • 8.2.5 KGaA (Germany) Recent Development
    • 8.3 Hitachi Chemical Company, Ltd. (Japan)
      • 8.3.1 Hitachi Chemical Company, Ltd. (Japan) Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Semiconductor Packaging Material
      • 8.3.4 Semiconductor Packaging Material Product Introduction
      • 8.3.5 Hitachi Chemical Company, Ltd. (Japan) Recent Development
    • 8.4 Sumitomo Chemical Co., Ltd. (Japan)
      • 8.4.1 Sumitomo Chemical Co., Ltd. (Japan) Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Semiconductor Packaging Material
      • 8.4.4 Semiconductor Packaging Material Product Introduction
      • 8.4.5 Sumitomo Chemical Co., Ltd. (Japan) Recent Development
    • 8.5 Kyocera Chemical Corporation (Japan)
      • 8.5.1 Kyocera Chemical Corporation (Japan) Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Semiconductor Packaging Material
      • 8.5.4 Semiconductor Packaging Material Product Introduction
      • 8.5.5 Kyocera Chemical Corporation (Japan) Recent Development
    • 8.6 Mitsui High-tec, Inc. (Japan)
      • 8.6.1 Mitsui High-tec, Inc. (Japan) Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Semiconductor Packaging Material
      • 8.6.4 Semiconductor Packaging Material Product Introduction
      • 8.6.5 Mitsui High-tec, Inc. (Japan) Recent Development
    • 8.7 Toray Industries, Inc. (Japan)
      • 8.7.1 Toray Industries, Inc. (Japan) Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Semiconductor Packaging Material
      • 8.7.4 Semiconductor Packaging Material Product Introduction
      • 8.7.5 Toray Industries, Inc. (Japan) Recent Development
    • 8.8 Alent plc (U.K.)
      • 8.8.1 Alent plc (U.K.) Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Semiconductor Packaging Material
      • 8.8.4 Semiconductor Packaging Material Product Introduction
      • 8.8.5 Alent plc (U.K.) Recent Development
    • 8.9 LG Chem (South Korea)
      • 8.9.1 LG Chem (South Korea) Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Semiconductor Packaging Material
      • 8.9.4 Semiconductor Packaging Material Product Introduction
      • 8.9.5 LG Chem (South Korea) Recent Development
    • 8.10 BASF SE (Germany)
      • 8.10.1 BASF SE (Germany) Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Semiconductor Packaging Material
      • 8.10.4 Semiconductor Packaging Material Product Introduction
      • 8.10.5 BASF SE (Germany) Recent Development
    • 8.11 Tanaka Kikinzoku Group (Japan)
    • 8.12 E. I. du Pont de Nemours and Company (U.S.)
    • 8.13 Honeywell International Inc. (U.S.)
    • 8.14 Toppan Printing Co., Ltd. (Japan)
    • 8.15 Nippon Micrometal Corporation (Japan)
    • 8.16 Alpha Advanced Materials (U.S.)

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Semiconductor Packaging Material Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Semiconductor Packaging Material Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Semiconductor Packaging Material Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Semiconductor Packaging Material Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Semiconductor Packaging Material Production Forecast by Type
      • 9.7.2 Global Semiconductor Packaging Material Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Semiconductor Packaging Material Sales Channels
      • 10.2.2 Semiconductor Packaging Material Distributors
    • 10.3 Semiconductor Packaging Material Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Semiconductor packaging materials are used in the final stage of semiconductor device fabrication and are used to safeguard devices from deterioration and external influence.
      The Asia Pacific currently holds the pole position in the semiconductor packaging material market owing to fast technological growths and the developing demand for progressive electronic packaging materials from the end-users. Furthermore, the large investments in electronics applications along with low-cost manufacturing, low workforce cost, and easy convenience of the raw materials are subsidizing to the evolution of the region.
      In 2019, the market size of Semiconductor Packaging Material is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Packaging Material.

      This report studies the global market size of Semiconductor Packaging Material, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Semiconductor Packaging Material production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Henkel AG & Company
      KGaA (Germany)
      Hitachi Chemical Company, Ltd. (Japan)
      Sumitomo Chemical Co., Ltd. (Japan)
      Kyocera Chemical Corporation (Japan)
      Mitsui High-tec, Inc. (Japan)
      Toray Industries, Inc. (Japan)
      Alent plc (U.K.)
      LG Chem (South Korea)
      BASF SE (Germany)
      Tanaka Kikinzoku Group (Japan)
      E. I. du Pont de Nemours and Company (U.S.)
      Honeywell International Inc. (U.S.)
      Toppan Printing Co., Ltd. (Japan)
      Nippon Micrometal Corporation (Japan)
      Alpha Advanced Materials (U.S.)

      Market Segment by Product Type
      Organic Substrates
      Bonding Wires
      Encapsulation Resins
      Ceramic Packages
      Solder Balls
      Wafer Level Packaging Dielectrics
      Others

      Market Segment by Application
      Semiconductor Packaging
      Others

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Semiconductor Packaging Material status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Semiconductor Packaging Material manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Semiconductor Packaging Material are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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