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Global Semiconductor Assembly & Packaging Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

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1 Market Overview

  • 1.1 Product Overview and Scope of Semiconductor Assembly & Packaging Equipment
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Semiconductor Assembly & Packaging Equipment Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 Die Bonders
    • 1.3.3 Wire Bonders
    • 1.3.4 Packaging Equipment
    • 1.3.5 Others
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Semiconductor Assembly & Packaging Equipment Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 IDMs
    • 1.4.3 OSAT
  • 1.5 Global Semiconductor Assembly & Packaging Equipment Market Size & Forecast
    • 1.5.1 Global Semiconductor Assembly & Packaging Equipment Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Semiconductor Assembly & Packaging Equipment Sales Quantity (2019-2030)
    • 1.5.3 Global Semiconductor Assembly & Packaging Equipment Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 ASM Pacific Technology
    • 2.1.1 ASM Pacific Technology Details
    • 2.1.2 ASM Pacific Technology Major Business
    • 2.1.3 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.1.4 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 ASM Pacific Technology Recent Developments/Updates
  • 2.2 Kulicke & Soffa Industries
    • 2.2.1 Kulicke & Soffa Industries Details
    • 2.2.2 Kulicke & Soffa Industries Major Business
    • 2.2.3 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.2.4 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 Kulicke & Soffa Industries Recent Developments/Updates
  • 2.3 Besi
    • 2.3.1 Besi Details
    • 2.3.2 Besi Major Business
    • 2.3.3 Besi Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.3.4 Besi Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 Besi Recent Developments/Updates
  • 2.4 Accrutech
    • 2.4.1 Accrutech Details
    • 2.4.2 Accrutech Major Business
    • 2.4.3 Accrutech Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.4.4 Accrutech Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 Accrutech Recent Developments/Updates
  • 2.5 Shinkawa
    • 2.5.1 Shinkawa Details
    • 2.5.2 Shinkawa Major Business
    • 2.5.3 Shinkawa Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.5.4 Shinkawa Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Shinkawa Recent Developments/Updates
  • 2.6 Palomar Technologies
    • 2.6.1 Palomar Technologies Details
    • 2.6.2 Palomar Technologies Major Business
    • 2.6.3 Palomar Technologies Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.6.4 Palomar Technologies Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 Palomar Technologies Recent Developments/Updates
  • 2.7 Hesse Mechatronics
    • 2.7.1 Hesse Mechatronics Details
    • 2.7.2 Hesse Mechatronics Major Business
    • 2.7.3 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.7.4 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 Hesse Mechatronics Recent Developments/Updates
  • 2.8 Toray Engineering
    • 2.8.1 Toray Engineering Details
    • 2.8.2 Toray Engineering Major Business
    • 2.8.3 Toray Engineering Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.8.4 Toray Engineering Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.8.5 Toray Engineering Recent Developments/Updates
  • 2.9 West Bond
    • 2.9.1 West Bond Details
    • 2.9.2 West Bond Major Business
    • 2.9.3 West Bond Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.9.4 West Bond Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.9.5 West Bond Recent Developments/Updates
  • 2.10 HYBOND
    • 2.10.1 HYBOND Details
    • 2.10.2 HYBOND Major Business
    • 2.10.3 HYBOND Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.10.4 HYBOND Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.10.5 HYBOND Recent Developments/Updates
  • 2.11 DIAS Automation
    • 2.11.1 DIAS Automation Details
    • 2.11.2 DIAS Automation Major Business
    • 2.11.3 DIAS Automation Semiconductor Assembly & Packaging Equipment Product and Services
    • 2.11.4 DIAS Automation Semiconductor Assembly & Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.11.5 DIAS Automation Recent Developments/Updates

3 Competitive Environment: Semiconductor Assembly & Packaging Equipment by Manufacturer

  • 3.1 Global Semiconductor Assembly & Packaging Equipment Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Semiconductor Assembly & Packaging Equipment Revenue by Manufacturer (2019-2024)
  • 3.3 Global Semiconductor Assembly & Packaging Equipment Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Semiconductor Assembly & Packaging Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Semiconductor Assembly & Packaging Equipment Manufacturer Market Share in 2023
    • 3.4.2 Top 6 Semiconductor Assembly & Packaging Equipment Manufacturer Market Share in 2023
  • 3.5 Semiconductor Assembly & Packaging Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 Semiconductor Assembly & Packaging Equipment Market: Region Footprint
    • 3.5.2 Semiconductor Assembly & Packaging Equipment Market: Company Product Type Footprint
    • 3.5.3 Semiconductor Assembly & Packaging Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Semiconductor Assembly & Packaging Equipment Market Size by Region
    • 4.1.1 Global Semiconductor Assembly & Packaging Equipment Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Semiconductor Assembly & Packaging Equipment Consumption Value by Region (2019-2030)
    • 4.1.3 Global Semiconductor Assembly & Packaging Equipment Average Price by Region (2019-2030)
  • 4.2 North America Semiconductor Assembly & Packaging Equipment Consumption Value (2019-2030)
  • 4.3 Europe Semiconductor Assembly & Packaging Equipment Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Semiconductor Assembly & Packaging Equipment Consumption Value (2019-2030)
  • 4.5 South America Semiconductor Assembly & Packaging Equipment Consumption Value (2019-2030)
  • 4.6 Middle East and Africa Semiconductor Assembly & Packaging Equipment Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Semiconductor Assembly & Packaging Equipment Sales Quantity by Type (2019-2030)
  • 5.2 Global Semiconductor Assembly & Packaging Equipment Consumption Value by Type (2019-2030)
  • 5.3 Global Semiconductor Assembly & Packaging Equipment Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Semiconductor Assembly & Packaging Equipment Sales Quantity by Application (2019-2030)
  • 6.2 Global Semiconductor Assembly & Packaging Equipment Consumption Value by Application (2019-2030)
  • 6.3 Global Semiconductor Assembly & Packaging Equipment Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Semiconductor Assembly & Packaging Equipment Sales Quantity by Type (2019-2030)
  • 7.2 North America Semiconductor Assembly & Packaging Equipment Sales Quantity by Application (2019-2030)
  • 7.3 North America Semiconductor Assembly & Packaging Equipment Market Size by Country
    • 7.3.1 North America Semiconductor Assembly & Packaging Equipment Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Semiconductor Assembly & Packaging Equipment Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Semiconductor Assembly & Packaging Equipment Sales Quantity by Type (2019-2030)
  • 8.2 Europe Semiconductor Assembly & Packaging Equipment Sales Quantity by Application (2019-2030)
  • 8.3 Europe Semiconductor Assembly & Packaging Equipment Market Size by Country
    • 8.3.1 Europe Semiconductor Assembly & Packaging Equipment Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Semiconductor Assembly & Packaging Equipment Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Semiconductor Assembly & Packaging Equipment Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Semiconductor Assembly & Packaging Equipment Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Semiconductor Assembly & Packaging Equipment Market Size by Region
    • 9.3.1 Asia-Pacific Semiconductor Assembly & Packaging Equipment Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Semiconductor Assembly & Packaging Equipment Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Semiconductor Assembly & Packaging Equipment Sales Quantity by Type (2019-2030)
  • 10.2 South America Semiconductor Assembly & Packaging Equipment Sales Quantity by Application (2019-2030)
  • 10.3 South America Semiconductor Assembly & Packaging Equipment Market Size by Country
    • 10.3.1 South America Semiconductor Assembly & Packaging Equipment Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Semiconductor Assembly & Packaging Equipment Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Semiconductor Assembly & Packaging Equipment Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Semiconductor Assembly & Packaging Equipment Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Semiconductor Assembly & Packaging Equipment Market Size by Country
    • 11.3.1 Middle East & Africa Semiconductor Assembly & Packaging Equipment Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Semiconductor Assembly & Packaging Equipment Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Semiconductor Assembly & Packaging Equipment Market Drivers
  • 12.2 Semiconductor Assembly & Packaging Equipment Market Restraints
  • 12.3 Semiconductor Assembly & Packaging Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Semiconductor Assembly & Packaging Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Semiconductor Assembly & Packaging Equipment
  • 13.3 Semiconductor Assembly & Packaging Equipment Production Process
  • 13.4 Semiconductor Assembly & Packaging Equipment Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Semiconductor Assembly & Packaging Equipment Typical Distributors
  • 14.3 Semiconductor Assembly & Packaging Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Semiconductor Assembly & Packaging Equipment market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
    Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
    According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
    The Global Info Research report includes an overview of the development of the Semiconductor Assembly & Packaging Equipment industry chain, the market status of IDMs (Die Bonders, Wire Bonders), OSAT (Die Bonders, Wire Bonders), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Semiconductor Assembly & Packaging Equipment.
    Regionally, the report analyzes the Semiconductor Assembly & Packaging Equipment markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Semiconductor Assembly & Packaging Equipment market, with robust domestic demand, supportive policies, and a strong manufacturing base.
    Key Features:
    The report presents comprehensive understanding of the Semiconductor Assembly & Packaging Equipment market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Semiconductor Assembly & Packaging Equipment industry.
    The report involves analyzing the market at a macro level:
    Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Unit), revenue generated, and market share of different by Type (e.g., Die Bonders, Wire Bonders).
    Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Semiconductor Assembly & Packaging Equipment market.
    Regional Analysis: The report involves examining the Semiconductor Assembly & Packaging Equipment market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
    Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Semiconductor Assembly & Packaging Equipment market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
    The report also involves a more granular approach to Semiconductor Assembly & Packaging Equipment:
    Company Analysis: Report covers individual Semiconductor Assembly & Packaging Equipment manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
    Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Semiconductor Assembly & Packaging Equipment This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (IDMs, OSAT).
    Technology Analysis: Report covers specific technologies relevant to Semiconductor Assembly & Packaging Equipment. It assesses the current state, advancements, and potential future developments in Semiconductor Assembly & Packaging Equipment areas.
    Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Semiconductor Assembly & Packaging Equipment market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
    Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
    Market Segmentation
    Semiconductor Assembly & Packaging Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
    Market segment by Type
    Die Bonders
    Wire Bonders
    Packaging Equipment
    Others
    Market segment by Application
    IDMs
    OSAT
    Major players covered
    ASM Pacific Technology
    Kulicke & Soffa Industries
    Besi
    Accrutech
    Shinkawa
    Palomar Technologies
    Hesse Mechatronics
    Toray Engineering
    West Bond
    HYBOND
    DIAS Automation
    Market segment by region, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Semiconductor Assembly & Packaging Equipment product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Semiconductor Assembly & Packaging Equipment, with price, sales, revenue and global market share of Semiconductor Assembly & Packaging Equipment from 2019 to 2024.
    Chapter 3, the Semiconductor Assembly & Packaging Equipment competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Semiconductor Assembly & Packaging Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
    Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Semiconductor Assembly & Packaging Equipment market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
    Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Assembly & Packaging Equipment.
    Chapter 14 and 15, to describe Semiconductor Assembly & Packaging Equipment sales channel, distributors, customers, research findings and conclusion.

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