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Global Rigid IC Package Substrates Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

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1 Market Overview

  • 1.1 Product Overview and Scope of Rigid IC Package Substrates
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Rigid IC Package Substrates Consumption Value by Type: 2018 Versus 2022 Versus 2029
    • 1.3.2 WB CSP
    • 1.3.3 FC BGA
    • 1.3.4 FC CSP
    • 1.3.5 Others
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Rigid IC Package Substrates Consumption Value by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 Smart Phone
    • 1.4.3 PC
    • 1.4.4 Wearable Device
    • 1.4.5 Others
  • 1.5 Global Rigid IC Package Substrates Market Size & Forecast
    • 1.5.1 Global Rigid IC Package Substrates Consumption Value (2018 & 2022 & 2029)
    • 1.5.2 Global Rigid IC Package Substrates Sales Quantity (2018-2029)
    • 1.5.3 Global Rigid IC Package Substrates Average Price (2018-2029)

2 Manufacturers Profiles

  • 2.1 Unimicron
    • 2.1.1 Unimicron Details
    • 2.1.2 Unimicron Major Business
    • 2.1.3 Unimicron Rigid IC Package Substrates Product and Services
    • 2.1.4 Unimicron Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 Unimicron Recent Developments/Updates
  • 2.2 Ibiden
    • 2.2.1 Ibiden Details
    • 2.2.2 Ibiden Major Business
    • 2.2.3 Ibiden Rigid IC Package Substrates Product and Services
    • 2.2.4 Ibiden Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 Ibiden Recent Developments/Updates
  • 2.3 Semco
    • 2.3.1 Semco Details
    • 2.3.2 Semco Major Business
    • 2.3.3 Semco Rigid IC Package Substrates Product and Services
    • 2.3.4 Semco Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 Semco Recent Developments/Updates
  • 2.4 Nan Ya PCB Corporation
    • 2.4.1 Nan Ya PCB Corporation Details
    • 2.4.2 Nan Ya PCB Corporation Major Business
    • 2.4.3 Nan Ya PCB Corporation Rigid IC Package Substrates Product and Services
    • 2.4.4 Nan Ya PCB Corporation Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 Nan Ya PCB Corporation Recent Developments/Updates
  • 2.5 Shinko
    • 2.5.1 Shinko Details
    • 2.5.2 Shinko Major Business
    • 2.5.3 Shinko Rigid IC Package Substrates Product and Services
    • 2.5.4 Shinko Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 Shinko Recent Developments/Updates
  • 2.6 Simmtech
    • 2.6.1 Simmtech Details
    • 2.6.2 Simmtech Major Business
    • 2.6.3 Simmtech Rigid IC Package Substrates Product and Services
    • 2.6.4 Simmtech Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Simmtech Recent Developments/Updates
  • 2.7 Kinsus
    • 2.7.1 Kinsus Details
    • 2.7.2 Kinsus Major Business
    • 2.7.3 Kinsus Rigid IC Package Substrates Product and Services
    • 2.7.4 Kinsus Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 Kinsus Recent Developments/Updates
  • 2.8 Daeduck
    • 2.8.1 Daeduck Details
    • 2.8.2 Daeduck Major Business
    • 2.8.3 Daeduck Rigid IC Package Substrates Product and Services
    • 2.8.4 Daeduck Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 Daeduck Recent Developments/Updates
  • 2.9 LG Innotek
    • 2.9.1 LG Innotek Details
    • 2.9.2 LG Innotek Major Business
    • 2.9.3 LG Innotek Rigid IC Package Substrates Product and Services
    • 2.9.4 LG Innotek Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 LG Innotek Recent Developments/Updates
  • 2.10 Kyocera
    • 2.10.1 Kyocera Details
    • 2.10.2 Kyocera Major Business
    • 2.10.3 Kyocera Rigid IC Package Substrates Product and Services
    • 2.10.4 Kyocera Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.10.5 Kyocera Recent Developments/Updates
  • 2.11 ASE Material
    • 2.11.1 ASE Material Details
    • 2.11.2 ASE Material Major Business
    • 2.11.3 ASE Material Rigid IC Package Substrates Product and Services
    • 2.11.4 ASE Material Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.11.5 ASE Material Recent Developments/Updates
  • 2.12 Shennan Circuit
    • 2.12.1 Shennan Circuit Details
    • 2.12.2 Shennan Circuit Major Business
    • 2.12.3 Shennan Circuit Rigid IC Package Substrates Product and Services
    • 2.12.4 Shennan Circuit Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.12.5 Shennan Circuit Recent Developments/Updates
  • 2.13 AT&S
    • 2.13.1 AT&S Details
    • 2.13.2 AT&S Major Business
    • 2.13.3 AT&S Rigid IC Package Substrates Product and Services
    • 2.13.4 AT&S Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.13.5 AT&S Recent Developments/Updates
  • 2.14 Korea Circuit
    • 2.14.1 Korea Circuit Details
    • 2.14.2 Korea Circuit Major Business
    • 2.14.3 Korea Circuit Rigid IC Package Substrates Product and Services
    • 2.14.4 Korea Circuit Rigid IC Package Substrates Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.14.5 Korea Circuit Recent Developments/Updates

3 Competitive Environment: Rigid IC Package Substrates by Manufacturer

  • 3.1 Global Rigid IC Package Substrates Sales Quantity by Manufacturer (2018-2023)
  • 3.2 Global Rigid IC Package Substrates Revenue by Manufacturer (2018-2023)
  • 3.3 Global Rigid IC Package Substrates Average Price by Manufacturer (2018-2023)
  • 3.4 Market Share Analysis (2022)
    • 3.4.1 Producer Shipments of Rigid IC Package Substrates by Manufacturer Revenue ($MM) and Market Share (%): 2022
    • 3.4.2 Top 3 Rigid IC Package Substrates Manufacturer Market Share in 2022
    • 3.4.2 Top 6 Rigid IC Package Substrates Manufacturer Market Share in 2022
  • 3.5 Rigid IC Package Substrates Market: Overall Company Footprint Analysis
    • 3.5.1 Rigid IC Package Substrates Market: Region Footprint
    • 3.5.2 Rigid IC Package Substrates Market: Company Product Type Footprint
    • 3.5.3 Rigid IC Package Substrates Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Rigid IC Package Substrates Market Size by Region
    • 4.1.1 Global Rigid IC Package Substrates Sales Quantity by Region (2018-2029)
    • 4.1.2 Global Rigid IC Package Substrates Consumption Value by Region (2018-2029)
    • 4.1.3 Global Rigid IC Package Substrates Average Price by Region (2018-2029)
  • 4.2 North America Rigid IC Package Substrates Consumption Value (2018-2029)
  • 4.3 Europe Rigid IC Package Substrates Consumption Value (2018-2029)
  • 4.4 Asia-Pacific Rigid IC Package Substrates Consumption Value (2018-2029)
  • 4.5 South America Rigid IC Package Substrates Consumption Value (2018-2029)
  • 4.6 Middle East and Africa Rigid IC Package Substrates Consumption Value (2018-2029)

5 Market Segment by Type

  • 5.1 Global Rigid IC Package Substrates Sales Quantity by Type (2018-2029)
  • 5.2 Global Rigid IC Package Substrates Consumption Value by Type (2018-2029)
  • 5.3 Global Rigid IC Package Substrates Average Price by Type (2018-2029)

6 Market Segment by Application

  • 6.1 Global Rigid IC Package Substrates Sales Quantity by Application (2018-2029)
  • 6.2 Global Rigid IC Package Substrates Consumption Value by Application (2018-2029)
  • 6.3 Global Rigid IC Package Substrates Average Price by Application (2018-2029)

7 North America

  • 7.1 North America Rigid IC Package Substrates Sales Quantity by Type (2018-2029)
  • 7.2 North America Rigid IC Package Substrates Sales Quantity by Application (2018-2029)
  • 7.3 North America Rigid IC Package Substrates Market Size by Country
    • 7.3.1 North America Rigid IC Package Substrates Sales Quantity by Country (2018-2029)
    • 7.3.2 North America Rigid IC Package Substrates Consumption Value by Country (2018-2029)
    • 7.3.3 United States Market Size and Forecast (2018-2029)
    • 7.3.4 Canada Market Size and Forecast (2018-2029)
    • 7.3.5 Mexico Market Size and Forecast (2018-2029)

8 Europe

  • 8.1 Europe Rigid IC Package Substrates Sales Quantity by Type (2018-2029)
  • 8.2 Europe Rigid IC Package Substrates Sales Quantity by Application (2018-2029)
  • 8.3 Europe Rigid IC Package Substrates Market Size by Country
    • 8.3.1 Europe Rigid IC Package Substrates Sales Quantity by Country (2018-2029)
    • 8.3.2 Europe Rigid IC Package Substrates Consumption Value by Country (2018-2029)
    • 8.3.3 Germany Market Size and Forecast (2018-2029)
    • 8.3.4 France Market Size and Forecast (2018-2029)
    • 8.3.5 United Kingdom Market Size and Forecast (2018-2029)
    • 8.3.6 Russia Market Size and Forecast (2018-2029)
    • 8.3.7 Italy Market Size and Forecast (2018-2029)

9 Asia-Pacific

  • 9.1 Asia-Pacific Rigid IC Package Substrates Sales Quantity by Type (2018-2029)
  • 9.2 Asia-Pacific Rigid IC Package Substrates Sales Quantity by Application (2018-2029)
  • 9.3 Asia-Pacific Rigid IC Package Substrates Market Size by Region
    • 9.3.1 Asia-Pacific Rigid IC Package Substrates Sales Quantity by Region (2018-2029)
    • 9.3.2 Asia-Pacific Rigid IC Package Substrates Consumption Value by Region (2018-2029)
    • 9.3.3 China Market Size and Forecast (2018-2029)
    • 9.3.4 Japan Market Size and Forecast (2018-2029)
    • 9.3.5 Korea Market Size and Forecast (2018-2029)
    • 9.3.6 India Market Size and Forecast (2018-2029)
    • 9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
    • 9.3.8 Australia Market Size and Forecast (2018-2029)

10 South America

  • 10.1 South America Rigid IC Package Substrates Sales Quantity by Type (2018-2029)
  • 10.2 South America Rigid IC Package Substrates Sales Quantity by Application (2018-2029)
  • 10.3 South America Rigid IC Package Substrates Market Size by Country
    • 10.3.1 South America Rigid IC Package Substrates Sales Quantity by Country (2018-2029)
    • 10.3.2 South America Rigid IC Package Substrates Consumption Value by Country (2018-2029)
    • 10.3.3 Brazil Market Size and Forecast (2018-2029)
    • 10.3.4 Argentina Market Size and Forecast (2018-2029)

11 Middle East & Africa

  • 11.1 Middle East & Africa Rigid IC Package Substrates Sales Quantity by Type (2018-2029)
  • 11.2 Middle East & Africa Rigid IC Package Substrates Sales Quantity by Application (2018-2029)
  • 11.3 Middle East & Africa Rigid IC Package Substrates Market Size by Country
    • 11.3.1 Middle East & Africa Rigid IC Package Substrates Sales Quantity by Country (2018-2029)
    • 11.3.2 Middle East & Africa Rigid IC Package Substrates Consumption Value by Country (2018-2029)
    • 11.3.3 Turkey Market Size and Forecast (2018-2029)
    • 11.3.4 Egypt Market Size and Forecast (2018-2029)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
    • 11.3.6 South Africa Market Size and Forecast (2018-2029)

12 Market Dynamics

  • 12.1 Rigid IC Package Substrates Market Drivers
  • 12.2 Rigid IC Package Substrates Market Restraints
  • 12.3 Rigid IC Package Substrates Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry
  • 12.5 Influence of COVID-19 and Russia-Ukraine War
    • 12.5.1 Influence of COVID-19
    • 12.5.2 Influence of Russia-Ukraine War

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Rigid IC Package Substrates and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Rigid IC Package Substrates
  • 13.3 Rigid IC Package Substrates Production Process
  • 13.4 Rigid IC Package Substrates Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Rigid IC Package Substrates Typical Distributors
  • 14.3 Rigid IC Package Substrates Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Rigid IC Package Substrates market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
    This report is a detailed and comprehensive analysis for global Rigid IC Package Substrates market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
    Key Features:
    Global Rigid IC Package Substrates market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
    Global Rigid IC Package Substrates market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
    Global Rigid IC Package Substrates market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
    Global Rigid IC Package Substrates market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Rigid IC Package Substrates
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Rigid IC Package Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Semco, Nan Ya PCB Corporation and Shinko, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
    Market Segmentation
    Rigid IC Package Substrates market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    WB CSP
    FC BGA
    FC CSP
    Others
    Market segment by Application
    Smart Phone
    PC
    Wearable Device
    Others
    Major players covered
    Unimicron
    Ibiden
    Semco
    Nan Ya PCB Corporation
    Shinko
    Simmtech
    Kinsus
    Daeduck
    LG Innotek
    Kyocera
    ASE Material
    Shennan Circuit
    AT&S
    Korea Circuit
    Market segment by region, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Rigid IC Package Substrates product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Rigid IC Package Substrates, with price, sales, revenue and global market share of Rigid IC Package Substrates from 2018 to 2023.
    Chapter 3, the Rigid IC Package Substrates competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Rigid IC Package Substrates breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
    Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Rigid IC Package Substrates market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
    Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Rigid IC Package Substrates.
    Chapter 14 and 15, to describe Rigid IC Package Substrates sales channel, distributors, customers, research findings and conclusion.

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