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Global (United States, European Union and China) Radiation Hardened ICs Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Radiation Hardened ICs Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Memory
      • 1.3.3 Microprocessor
      • 1.3.4 Microcontrollers
      • 1.3.5 Power Management
    • 1.4 Market Segment by Application
      • 1.4.1 Global Radiation Hardened ICs Market Share by Application (2019-2025)
      • 1.4.2 Aerospace
      • 1.4.3 Military
      • 1.4.4 Space
      • 1.4.5 Nuclear
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Radiation Hardened ICs Production Value 2014-2025
      • 2.1.2 Global Radiation Hardened ICs Production 2014-2025
      • 2.1.3 Global Radiation Hardened ICs Capacity 2014-2025
      • 2.1.4 Global Radiation Hardened ICs Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Radiation Hardened ICs Market Size CAGR of Key Regions
      • 2.2.2 Global Radiation Hardened ICs Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Radiation Hardened ICs Capacity by Manufacturers
      • 3.1.2 Global Radiation Hardened ICs Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Radiation Hardened ICs Revenue by Manufacturers (2014-2019)
      • 3.2.2 Radiation Hardened ICs Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Radiation Hardened ICs Market Concentration Ratio (CR5 and HHI)
    • 3.3 Radiation Hardened ICs Price by Manufacturers
    • 3.4 Key Manufacturers Radiation Hardened ICs Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Radiation Hardened ICs Market
    • 3.6 Key Manufacturers Radiation Hardened ICs Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Memory Production and Production Value (2014-2019)
      • 4.1.2 Microprocessor Production and Production Value (2014-2019)
      • 4.1.3 Microcontrollers Production and Production Value (2014-2019)
      • 4.1.4 Power Management Production and Production Value (2014-2019)
    • 4.2 Global Radiation Hardened ICs Production Market Share by Type
    • 4.3 Global Radiation Hardened ICs Production Value Market Share by Type
    • 4.4 Radiation Hardened ICs Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Radiation Hardened ICs Consumption by Application

    6 Production by Regions

    • 6.1 Global Radiation Hardened ICs Production (History Data) by Regions 2014-2019
    • 6.2 Global Radiation Hardened ICs Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Radiation Hardened ICs Production Growth Rate 2014-2019
      • 6.3.2 United States Radiation Hardened ICs Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Radiation Hardened ICs Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Radiation Hardened ICs Production Growth Rate 2014-2019
      • 6.4.2 European Union Radiation Hardened ICs Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Radiation Hardened ICs Import & Export
    • 6.5 China
      • 6.5.1 China Radiation Hardened ICs Production Growth Rate 2014-2019
      • 6.5.2 China Radiation Hardened ICs Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Radiation Hardened ICs Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Radiation Hardened ICs Consumption by Regions

    • 7.1 Global Radiation Hardened ICs Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Radiation Hardened ICs Consumption by Type
      • 7.2.2 United States Radiation Hardened ICs Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Radiation Hardened ICs Consumption by Type
      • 7.3.2 European Union Radiation Hardened ICs Consumption by Application
    • 7.4 China
      • 7.4.1 China Radiation Hardened ICs Consumption by Type
      • 7.4.2 China Radiation Hardened ICs Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Radiation Hardened ICs Consumption by Type
      • 7.5.2 Rest of World Radiation Hardened ICs Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Aeroflex Inc.
      • 8.1.1 Aeroflex Inc. Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Radiation Hardened ICs
      • 8.1.4 Radiation Hardened ICs Product Introduction
      • 8.1.5 Aeroflex Inc. Recent Development
    • 8.2 Atmel Corporation
      • 8.2.1 Atmel Corporation Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Radiation Hardened ICs
      • 8.2.4 Radiation Hardened ICs Product Introduction
      • 8.2.5 Atmel Corporation Recent Development
    • 8.3 Bae Systems Plc
      • 8.3.1 Bae Systems Plc Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Radiation Hardened ICs
      • 8.3.4 Radiation Hardened ICs Product Introduction
      • 8.3.5 Bae Systems Plc Recent Development
    • 8.4 Crane Co.
      • 8.4.1 Crane Co. Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Radiation Hardened ICs
      • 8.4.4 Radiation Hardened ICs Product Introduction
      • 8.4.5 Crane Co. Recent Development
    • 8.5 Honeywell Aerospace
      • 8.5.1 Honeywell Aerospace Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Radiation Hardened ICs
      • 8.5.4 Radiation Hardened ICs Product Introduction
      • 8.5.5 Honeywell Aerospace Recent Development
    • 8.6 International Rectifier Corporation
      • 8.6.1 International Rectifier Corporation Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Radiation Hardened ICs
      • 8.6.4 Radiation Hardened ICs Product Introduction
      • 8.6.5 International Rectifier Corporation Recent Development
    • 8.7 RD Alfa microelectronics
      • 8.7.1 RD Alfa microelectronics Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Radiation Hardened ICs
      • 8.7.4 Radiation Hardened ICs Product Introduction
      • 8.7.5 RD Alfa microelectronics Recent Development
    • 8.8 Intersil Corporation
      • 8.8.1 Intersil Corporation Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Radiation Hardened ICs
      • 8.8.4 Radiation Hardened ICs Product Introduction
      • 8.8.5 Intersil Corporation Recent Development
    • 8.9 Linear Technology Corporation
      • 8.9.1 Linear Technology Corporation Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Radiation Hardened ICs
      • 8.9.4 Radiation Hardened ICs Product Introduction
      • 8.9.5 Linear Technology Corporation Recent Development
    • 8.10 Maxwell Technologies Inc.
      • 8.10.1 Maxwell Technologies Inc. Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Radiation Hardened ICs
      • 8.10.4 Radiation Hardened ICs Product Introduction
      • 8.10.5 Maxwell Technologies Inc. Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Radiation Hardened ICs Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Radiation Hardened ICs Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Radiation Hardened ICs Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Radiation Hardened ICs Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Radiation Hardened ICs Production Forecast by Type
      • 9.7.2 Global Radiation Hardened ICs Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Radiation Hardened ICs Sales Channels
      • 10.2.2 Radiation Hardened ICs Distributors
    • 10.3 Radiation Hardened ICs Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      In 2019, the market size of Radiation Hardened ICs is million US$ and it will reach million US$ in 2025, growing at a CAGR of from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Radiation Hardened ICs.

      This report studies the global market size of Radiation Hardened ICs, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Radiation Hardened ICs production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Aeroflex Inc.
      Atmel Corporation
      Bae Systems Plc
      Crane Co.
      Honeywell Aerospace
      International Rectifier Corporation
      RD Alfa microelectronics
      Intersil Corporation
      Linear Technology Corporation
      Maxwell Technologies Inc.

      Market Segment by Product Type
      Memory
      Microprocessor
      Microcontrollers
      Power Management

      Market Segment by Application
      Aerospace
      Military
      Space
      Nuclear

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Radiation Hardened ICs status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Radiation Hardened ICs manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Radiation Hardened ICs are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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