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Global (United States, European Union and China) Radiation-Hardened Electronic Components Market Research Report 2019-2025

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1 Study Coverage

  • 1.1 Radiation-Hardened Electronic Components Product Introduction
  • 1.2 Key Market Segments in This Study
  • 1.3 Key Manufacturers Covered: Ranking of Global Top Radiation-Hardened Electronic Components Manufacturers by Revenue in 2019
  • 1.4 Market by Type
    • 1.4.1 Global Radiation-Hardened Electronic Components Market Size Growth Rate by Type
    • 1.4.2 Silicon
    • 1.4.3 Silicon Carbide
    • 1.4.4 Gallium Nitride
    • 1.4.5 Others
  • 1.5 Market by Application
    • 1.5.1 Global Radiation-Hardened Electronic Components Market Size Growth Rate by Application
    • 1.5.2 Aerospace and Defense
    • 1.5.3 Medical
    • 1.5.4 Consumer Electronics
    • 1.5.5 Industrial
    • 1.5.6 Others
  • 1.6 Study Objectives
  • 1.7 Years Considered

2 Executive Summary

  • 2.1 Global Radiation-Hardened Electronic Components Market Size, Estimates and Forecasts
    • 2.1.1 Global Radiation-Hardened Electronic Components Revenue Estimates and Forecasts 2015-2026
    • 2.1.2 Global Radiation-Hardened Electronic Components Production Capacity Estimates and Forecasts 2015-2026
    • 2.1.3 Global Radiation-Hardened Electronic Components Production Estimates and Forecasts 2015-2026
  • 2.2 Global Radiation-Hardened Electronic Components, Market Size by Producing Regions: 2015 VS 2020 VS 2026
  • 2.3 Analysis of Competitive Landscape
    • 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
    • 2.3.2 Global Radiation-Hardened Electronic Components Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
    • 2.3.3 Global Radiation-Hardened Electronic Components Manufacturers Geographical Distribution
  • 2.4 Key Trends for Radiation-Hardened Electronic Components Markets & Products
  • 2.5 Primary Interviews with Key Radiation-Hardened Electronic Components Players (Opinion Leaders)

3 Market Size by Manufacturers

  • 3.1 Global Top Radiation-Hardened Electronic Components Manufacturers by Production Capacity
    • 3.1.1 Global Top Radiation-Hardened Electronic Components Manufacturers by Production Capacity (2015-2020)
    • 3.1.2 Global Top Radiation-Hardened Electronic Components Manufacturers by Production (2015-2020)
    • 3.1.3 Global Top Radiation-Hardened Electronic Components Manufacturers Market Share by Production
  • 3.2 Global Top Radiation-Hardened Electronic Components Manufacturers by Revenue
    • 3.2.1 Global Top Radiation-Hardened Electronic Components Manufacturers by Revenue (2015-2020)
    • 3.2.2 Global Top Radiation-Hardened Electronic Components Manufacturers Market Share by Revenue (2015-2020)
    • 3.2.3 Global Top 10 and Top 5 Companies by Radiation-Hardened Electronic Components Revenue in 2019
  • 3.3 Global Radiation-Hardened Electronic Components Price by Manufacturers
  • 3.4 Mergers & Acquisitions, Expansion Plans

4 Radiation-Hardened Electronic Components Production by Regions

  • 4.1 Global Radiation-Hardened Electronic Components Historic Market Facts & Figures by Regions
    • 4.1.1 Global Top Radiation-Hardened Electronic Components Regions by Production (2015-2020)
    • 4.1.2 Global Top Radiation-Hardened Electronic Components Regions by Revenue (2015-2020)
  • 4.2 North America
    • 4.2.1 North America Radiation-Hardened Electronic Components Production (2015-2020)
    • 4.2.2 North America Radiation-Hardened Electronic Components Revenue (2015-2020)
    • 4.2.3 Key Players in North America
    • 4.2.4 North America Radiation-Hardened Electronic Components Import & Export (2015-2020)
  • 4.3 Europe
    • 4.3.1 Europe Radiation-Hardened Electronic Components Production (2015-2020)
    • 4.3.2 Europe Radiation-Hardened Electronic Components Revenue (2015-2020)
    • 4.3.3 Key Players in Europe
    • 4.3.4 Europe Radiation-Hardened Electronic Components Import & Export (2015-2020)
  • 4.4 China
    • 4.4.1 China Radiation-Hardened Electronic Components Production (2015-2020)
    • 4.4.2 China Radiation-Hardened Electronic Components Revenue (2015-2020)
    • 4.4.3 Key Players in China
    • 4.4.4 China Radiation-Hardened Electronic Components Import & Export (2015-2020)
  • 4.5 Japan
    • 4.5.1 Japan Radiation-Hardened Electronic Components Production (2015-2020)
    • 4.5.2 Japan Radiation-Hardened Electronic Components Revenue (2015-2020)
    • 4.5.3 Key Players in Japan
    • 4.5.4 Japan Radiation-Hardened Electronic Components Import & Export (2015-2020)
  • 4.6 South Korea
    • 4.6.1 South Korea Radiation-Hardened Electronic Components Production (2015-2020)
    • 4.6.2 South Korea Radiation-Hardened Electronic Components Revenue (2015-2020)
    • 4.6.3 Key Players in South Korea
    • 4.6.4 South Korea Radiation-Hardened Electronic Components Import & Export (2015-2020)

5 Radiation-Hardened Electronic Components Consumption by Region

  • 5.1 Global Top Radiation-Hardened Electronic Components Regions by Consumption
    • 5.1.1 Global Top Radiation-Hardened Electronic Components Regions by Consumption (2015-2020)
    • 5.1.2 Global Top Radiation-Hardened Electronic Components Regions Market Share by Consumption (2015-2020)
  • 5.2 North America
    • 5.2.1 North America Radiation-Hardened Electronic Components Consumption by Application
    • 5.2.2 North America Radiation-Hardened Electronic Components Consumption by Countries
    • 5.2.3 U.S.
    • 5.2.4 Canada
  • 5.3 Europe
    • 5.3.1 Europe Radiation-Hardened Electronic Components Consumption by Application
    • 5.3.2 Europe Radiation-Hardened Electronic Components Consumption by Countries
    • 5.3.3 Germany
    • 5.3.4 France
    • 5.3.5 U.K.
    • 5.3.6 Italy
    • 5.3.7 Russia
  • 5.4 Asia Pacific
    • 5.4.1 Asia Pacific Radiation-Hardened Electronic Components Consumption by Application
    • 5.4.2 Asia Pacific Radiation-Hardened Electronic Components Consumption by Regions
    • 5.4.3 China
    • 5.4.4 Japan
    • 5.4.5 South Korea
    • 5.4.6 India
    • 5.4.7 Australia
    • 5.4.8 Taiwan
    • 5.4.9 Indonesia
    • 5.4.10 Thailand
    • 5.4.11 Malaysia
    • 5.4.12 Philippines
    • 5.4.13 Vietnam
  • 5.5 Central & South America
    • 5.5.1 Central & South America Radiation-Hardened Electronic Components Consumption by Application
    • 5.5.2 Central & South America Radiation-Hardened Electronic Components Consumption by Country
    • 5.5.3 Mexico
    • 5.5.3 Brazil
    • 5.5.3 Argentina
  • 5.6 Middle East and Africa
    • 5.6.1 Middle East and Africa Radiation-Hardened Electronic Components Consumption by Application
    • 5.6.2 Middle East and Africa Radiation-Hardened Electronic Components Consumption by Countries
    • 5.6.3 Turkey
    • 5.6.4 Saudi Arabia
    • 5.6.5 U.A.E

6 Market Size by Type (2015-2026)

  • 6.1 Global Radiation-Hardened Electronic Components Market Size by Type (2015-2020)
    • 6.1.1 Global Radiation-Hardened Electronic Components Production by Type (2015-2020)
    • 6.1.2 Global Radiation-Hardened Electronic Components Revenue by Type (2015-2020)
    • 6.1.3 Radiation-Hardened Electronic Components Price by Type (2015-2020)
  • 6.2 Global Radiation-Hardened Electronic Components Market Forecast by Type (2021-2026)
    • 6.2.1 Global Radiation-Hardened Electronic Components Production Forecast by Type (2021-2026)
    • 6.2.2 Global Radiation-Hardened Electronic Components Revenue Forecast by Type (2021-2026)
    • 6.2.3 Global Radiation-Hardened Electronic Components Price Forecast by Type (2021-2026)
  • 6.3 Global Radiation-Hardened Electronic Components Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End

7 Market Size by Application (2015-2026)

  • 7.2.1 Global Radiation-Hardened Electronic Components Consumption Historic Breakdown by Application (2015-2020)
  • 7.2.2 Global Radiation-Hardened Electronic Components Consumption Forecast by Application (2021-2026)

8 Corporate Profiles

  • 8.1 Honeywell International
    • 8.1.1 Honeywell International Corporation Information
    • 8.1.2 Honeywell International Overview
    • 8.1.3 Honeywell International Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.1.4 Honeywell International Product Description
    • 8.1.5 Honeywell International Related Developments
  • 8.2 BAE Systems
    • 8.2.1 BAE Systems Corporation Information
    • 8.2.2 BAE Systems Overview
    • 8.2.3 BAE Systems Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.2.4 BAE Systems Product Description
    • 8.2.5 BAE Systems Related Developments
  • 8.3 Analog Devices
    • 8.3.1 Analog Devices Corporation Information
    • 8.3.2 Analog Devices Overview
    • 8.3.3 Analog Devices Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.3.4 Analog Devices Product Description
    • 8.3.5 Analog Devices Related Developments
  • 8.4 Texas Instruments
    • 8.4.1 Texas Instruments Corporation Information
    • 8.4.2 Texas Instruments Overview
    • 8.4.3 Texas Instruments Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.4.4 Texas Instruments Product Description
    • 8.4.5 Texas Instruments Related Developments
  • 8.5 Atmel
    • 8.5.1 Atmel Corporation Information
    • 8.5.2 Atmel Overview
    • 8.5.3 Atmel Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.5.4 Atmel Product Description
    • 8.5.5 Atmel Related Developments
  • 8.6 Renesas Electronics
    • 8.6.1 Renesas Electronics Corporation Information
    • 8.6.2 Renesas Electronics Overview
    • 8.6.3 Renesas Electronics Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.6.4 Renesas Electronics Product Description
    • 8.6.5 Renesas Electronics Related Developments
  • 8.7 STMicroelectronics
    • 8.7.1 STMicroelectronics Corporation Information
    • 8.7.2 STMicroelectronics Overview
    • 8.7.3 STMicroelectronics Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.7.4 STMicroelectronics Product Description
    • 8.7.5 STMicroelectronics Related Developments
  • 8.8 Microchip Technology
    • 8.8.1 Microchip Technology Corporation Information
    • 8.8.2 Microchip Technology Overview
    • 8.8.3 Microchip Technology Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.8.4 Microchip Technology Product Description
    • 8.8.5 Microchip Technology Related Developments
  • 8.9 Xilinx
    • 8.9.1 Xilinx Corporation Information
    • 8.9.2 Xilinx Overview
    • 8.9.3 Xilinx Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.9.4 Xilinx Product Description
    • 8.9.5 Xilinx Related Developments
  • 8.10 Cobham
    • 8.10.1 Cobham Corporation Information
    • 8.10.2 Cobham Overview
    • 8.10.3 Cobham Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.10.4 Cobham Product Description
    • 8.10.5 Cobham Related Developments
  • 8.11 VPT
    • 8.11.1 VPT Corporation Information
    • 8.11.2 VPT Overview
    • 8.11.3 VPT Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.11.4 VPT Product Description
    • 8.11.5 VPT Related Developments
  • 8.12 Data Device Corporation (DDC)
    • 8.12.1 Data Device Corporation (DDC) Corporation Information
    • 8.12.2 Data Device Corporation (DDC) Overview
    • 8.12.3 Data Device Corporation (DDC) Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.12.4 Data Device Corporation (DDC) Product Description
    • 8.12.5 Data Device Corporation (DDC) Related Developments
  • 8.13 Intersil
    • 8.13.1 Intersil Corporation Information
    • 8.13.2 Intersil Overview
    • 8.13.3 Intersil Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.13.4 Intersil Product Description
    • 8.13.5 Intersil Related Developments
  • 8.14 Maxwell Technologies
    • 8.14.1 Maxwell Technologies Corporation Information
    • 8.14.2 Maxwell Technologies Overview
    • 8.14.3 Maxwell Technologies Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
    • 8.14.4 Maxwell Technologies Product Description
    • 8.14.5 Maxwell Technologies Related Developments

9 Radiation-Hardened Electronic Components Production Forecast by Regions

  • 9.1 Global Top Radiation-Hardened Electronic Components Regions Forecast by Revenue (2021-2026)
  • 9.2 Global Top Radiation-Hardened Electronic Components Regions Forecast by Production (2021-2026)
  • 9.3 Key Radiation-Hardened Electronic Components Production Regions Forecast
    • 9.3.1 North America
    • 9.3.2 Europe
    • 9.3.3 China
    • 9.3.4 Japan
    • 9.3.5 South Korea

10 Radiation-Hardened Electronic Components Consumption Forecast by Region

  • 10.1 Global Radiation-Hardened Electronic Components Consumption Forecast by Region (2021-2026)
  • 10.2 North America Radiation-Hardened Electronic Components Consumption Forecast by Region (2021-2026)
  • 10.3 Europe Radiation-Hardened Electronic Components Consumption Forecast by Region (2021-2026)
  • 10.4 Asia Pacific Radiation-Hardened Electronic Components Consumption Forecast by Region (2021-2026)
  • 10.5 Latin America Radiation-Hardened Electronic Components Consumption Forecast by Region (2021-2026)
  • 10.6 Middle East and Africa Radiation-Hardened Electronic Components Consumption Forecast by Region (2021-2026)

11 Value Chain and Sales Channels Analysis

  • 11.1 Value Chain Analysis
  • 11.2 Sales Channels Analysis
    • 11.2.1 Radiation-Hardened Electronic Components Sales Channels
    • 11.2.2 Radiation-Hardened Electronic Components Distributors
  • 11.3 Radiation-Hardened Electronic Components Customers

12 Market Opportunities & Challenges, Risks and Influences Factors Analysis

  • 12.1 Radiation-Hardened Electronic Components Industry
  • 12.2 Market Trends
  • 12.3 Market Opportunities and Drivers
  • 12.4 Market Challenges
  • 12.5 Radiation-Hardened Electronic Components Market Risks/Restraints
  • 12.6 Porter's Five Forces Analysis

13 Key Finding in The Global Radiation-Hardened Electronic Components Study

    14 Appendix

    • 14.1 Research Methodology
      • 14.1.1 Methodology/Research Approach
      • 14.1.2 Data Source
    • 14.2 Author Details

    Radiation-Hardened Electronic Components market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Radiation-Hardened Electronic Components market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2015-2026.

    Segment by Type, the Radiation-Hardened Electronic Components market is segmented into
    Silicon
    Silicon Carbide
    Gallium Nitride
    Others

    Segment by Application, the Radiation-Hardened Electronic Components market is segmented into
    Aerospace and Defense
    Medical
    Consumer Electronics
    Industrial
    Others

    Regional and Country-level Analysis
    The Radiation-Hardened Electronic Components market is analysed and market size information is provided by regions (countries).
    The key regions covered in the Radiation-Hardened Electronic Components market report are North America, Europe, China, Japan and South Korea. It also covers key regions (countries), viz, the U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
    The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of production capacity, price and revenue for the period 2015-2026.
    Competitive Landscape and Radiation-Hardened Electronic Components Market Share Analysis

    Radiation-Hardened Electronic Components market competitive landscape provides details and data information by manufacturers. The report offers comprehensive analysis and accurate statistics on production capacity, price, revenue of Radiation-Hardened Electronic Components by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on production, revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue, and the production capacity, price, revenue generated in Radiation-Hardened Electronic Components business, the date to enter into the Radiation-Hardened Electronic Components market, Radiation-Hardened Electronic Components product introduction, recent developments, etc.
    The major vendors covered:
    Honeywell International
    BAE Systems
    Analog Devices
    Texas Instruments
    Atmel
    Renesas Electronics
    STMicroelectronics
    Microchip Technology
    Xilinx
    Cobham
    VPT
    Data Device Corporation (DDC)
    Intersil
    Maxwell Technologies

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