Copyright Reports & Markets. All rights reserved.

Global Printed Circuit Board (PCB) Market Research Report 2012-2024

Buy now

Table of Contents

    1 Market Overview

    • 1.1 Objectives of Research
      • 1.1.1 Definition
      • 1.1.2 Specifications
    • 1.2 Market Segment
      • 1.2.1 by Type
        • 1.2.1.1 Flex
        • 1.2.1.2 Mirovia (HDI)
        • 1.2.1.3 Rigid-flex
        • 1.2.1.4 Substrates
      • 1.2.2 by Application
        • 1.2.2.1 Aerospace and Defense
        • 1.2.2.2 Automotive
        • 1.2.2.3 Cellular Phone
        • 1.2.2.4 Computing, Storage, and Peripherals
        • 1.2.2.5 Medical, Industrial, and Instrumentation
        • 1.2.2.6 Networking and Communications
        • 1.2.2.7 Others
      • 1.2.3 by Regions

    2 Industry Chain

    • 2.1 Industry Chain Structure
    • 2.2 Upstream
    • 2.3 Market
      • 2.3.1 SWOT
      • 2.3.2 Dynamics

    3 Environmental Analysis

    • 3.1 Policy
    • 3.2 Economic
    • 3.3 Technology
    • 3.4 Market Entry

    4 Market Segmentation by Type

    • 4.1 Market Size
      • 4.1.1 Flex Market, 2013-2018
      • 4.1.2 Mirovia (HDI) Market, 2013-2018
      • 4.1.3 Rigid-flex Market, 2013-2018
      • 4.1.4 Substrates Market, 2013-2018
    • 4.2 Market Forecast
      • 4.2.1 Flex Market Forecast, 2019-2024
      • 4.2.2 Mirovia (HDI) Market Forecast, 2019-2024
      • 4.2.3 Rigid-flex Market Forecast, 2019-2024
      • 4.2.4 Substrates Market Forecast, 2019-2024

    5 Market Segmentation by Application

    • 5.1 Market Size
      • 5.1.1 Aerospace and Defense Market, 2013-2018
      • 5.1.2 Automotive Market, 2013-2018
      • 5.1.3 Cellular Phone Market, 2013-2018
      • 5.1.4 Computing, Storage, and Peripherals Market, 2013-2018
      • 5.1.5 Medical, Industrial, and Instrumentation Market, 2013-2018
      • 5.1.6 Networking and Communications Market, 2013-2018
      • 5.1.7 Others Market, 2013-2018
    • 5.2 Market Forecast
      • 5.2.1 Aerospace and Defense Market Forecast, 2019-2024
      • 5.2.2 Automotive Market Forecast, 2019-2024
      • 5.2.3 Cellular Phone Market Forecast, 2019-2024
      • 5.2.4 Computing, Storage, and Peripherals Market Forecast, 2019-2024
      • 5.2.5 Medical, Industrial, and Instrumentation Market Forecast, 2019-2024
      • 5.2.6 Networking and Communications Market Forecast, 2019-2024
      • 5.2.7 Others Market Forecast, 2019-2024

    6 Market Segmentation by Region

    • 6.1 Market Size
      • 6.1.1 Asia-Pacific
        • 6.1.1.1 Asia-Pacific Market, 2012-2018
        • 6.1.1.2 Asia-Pacific Market by Type
        • 6.1.1.3 Asia-Pacific Market by Application
      • 6.1.2 North America
        • 6.1.2.1 North America Market, 2012-2018
        • 6.1.2.2 North America Market by Type
        • 6.1.2.3 North America Market by Application
      • 6.1.3 Europe
        • 6.1.3.1 Europe Market, 2012-2018
        • 6.1.3.2 Europe Market by Type
        • 6.1.3.3 Europe Market by Application
      • 6.1.4 South America
        • 6.1.4.1 South America Market, 2012-2018
        • 6.1.4.2 South America Market by Type
        • 6.1.4.3 South America Market by Application
      • 6.1.5 Middle East & Africa
        • 6.1.5.1 Middle East & Africa Market, 2012-2018
        • 6.1.5.2 Middle East & Africa Market by Type
        • 6.1.5.3 Middle East & Africa Market by Application
    • 6.2 Market Forecast
      • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
      • 6.2.2 North America Market Forecast, 2019-2024
      • 6.2.3 Europe Market Forecast, 2019-2024
      • 6.2.4 South America Market Forecast, 2019-2024
      • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

    7 Market Competitive

    • 7.1 Global Market by Vendors
    • 7.2 Market Concentration
    • 7.3 Price & Factors
    • 7.4 Marketing Channel

    8 Major Vendors

    • 8.1 Nippon Mektron
    • 8.2 Zhen Ding Technology
    • 8.3 Unimicron
    • 8.4 Young Poong Group
    • 8.5 Samsung Electro-Mechanics
    • 8.6 Ibiden Group
    • 8.7 Tripod Technology Corporation
    • 8.8 TTM Technologies
    • 8.9 Sumitomo Electric SEI
    • 8.10 Daeduck Group
    • 8.11 Nan Ya PCB Corporation
    • 8.12 Compeq
    • 8.13 Viasystems
    • 8.14 HannStar Board (GBM)
    • 8.15 LG Innotek
    • 8.16 AT&S
    • 8.17 Meiko
    • 8.18 Kinsus
    • 8.19 TPT
    • 8.20 Fujikura
    • 8.21 Chin Poon
    • 8.22 Career
    • 8.23 Flexium

    9 Conclusion

    Summary
    The global Printed Circuit Board (PCB) market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
    Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
    Flex
    Mirovia (HDI)
    Rigid-flex
    Substrates
    Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
    Nippon Mektron
    Zhen Ding Technology
    Unimicron
    Young Poong Group
    Samsung Electro-Mechanics
    Ibiden Group
    Tripod Technology Corporation
    TTM Technologies
    Sumitomo Electric SEI
    Daeduck Group
    Nan Ya PCB Corporation
    Compeq
    Viasystems
    HannStar Board (GBM)
    LG Innotek
    AT&S
    Meiko
    Kinsus
    TPT
    Fujikura
    Chin Poon
    Career
    Flexium
    Based on Application, the report describes major application share of regional market. Application mentioned as follows:
    Aerospace and Defense
    Automotive
    Cellular Phone
    Computing, Storage, and Peripherals
    Medical, Industrial, and Instrumentation
    Networking and Communications
    Others
    Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
    Asia-Pacific
    North America
    Europe
    South America
    Middle East & Africa

    Buy now