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Global and Japan Power Module Packaging Market Insights, Forecast to 2026

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1 Study Coverage

  • 1.1 Power Module Packaging Product Introduction
  • 1.2 Market Segments
  • 1.3 Key Power Module Packaging Manufacturers Covered: Ranking by Revenue
  • 1.4 Market by Type
    • 1.4.1 Global Power Module Packaging Market Size Growth Rate by Type
    • 1.4.2 GaN Module
    • 1.4.3 SiC Module
    • 1.4.4 FET Module
    • 1.4.5 IGBT Module
    • 1.4.6 Thyristors
  • 1.5 Market by Application
    • 1.5.1 Global Power Module Packaging Market Size Growth Rate by Application
    • 1.5.2 Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
    • 1.5.3 Motors
    • 1.5.4 Rail Tractions
    • 1.5.5 Wind Turbines
    • 1.5.6 Photovoltaic Equipment
  • 1.6 Study Objectives
  • 1.7 Years Considered

2 Executive Summary

  • 2.1 Global Power Module Packaging Market Size, Estimates and Forecasts
    • 2.1.1 Global Power Module Packaging Revenue 2015-2026
    • 2.1.2 Global Power Module Packaging Sales 2015-2026
  • 2.2 Global Power Module Packaging, Market Size by Producing Regions: 2015 VS 2020 VS 2026
  • 2.3 Power Module Packaging Historical Market Size by Region (2015-2020)
    • 2.3.1 Global Power Module Packaging Retrospective Market Scenario in Sales by Region: 2015-2020
    • 2.3.2 Global Power Module Packaging Retrospective Market Scenario in Revenue by Region: 2015-2020
  • 2.4 Power Module Packaging Market Estimates and Projections by Region (2021-2026)
    • 2.4.1 Global Power Module Packaging Sales Forecast by Region (2021-2026)
    • 2.4.2 Global Power Module Packaging Revenue Forecast by Region (2021-2026)

3 Global Power Module Packaging Competitor Landscape by Players

  • 3.1 Global Top Power Module Packaging Sales by Manufacturers
    • 3.1.1 Global Power Module Packaging Sales by Manufacturers (2015-2020)
    • 3.1.2 Global Power Module Packaging Sales Market Share by Manufacturers (2015-2020)
  • 3.2 Global Power Module Packaging Manufacturers by Revenue
    • 3.2.1 Global Power Module Packaging Revenue by Manufacturers (2015-2020)
    • 3.2.2 Global Power Module Packaging Revenue Share by Manufacturers (2015-2020)
    • 3.2.3 Global Power Module Packaging Market Concentration Ratio (CR5 and HHI) (2015-2020)
    • 3.2.4 Global Top 10 and Top 5 Companies by Power Module Packaging Revenue in 2019
    • 3.2.5 Global Power Module Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 3.3 Global Power Module Packaging Price by Manufacturers
  • 3.4 Global Power Module Packaging Manufacturing Base Distribution, Product Types
    • 3.4.1 Power Module Packaging Manufacturers Manufacturing Base Distribution, Headquarters
    • 3.4.2 Manufacturers Power Module Packaging Product Type
    • 3.4.3 Date of International Manufacturers Enter into Power Module Packaging Market
  • 3.5 Manufacturers Mergers & Acquisitions, Expansion Plans

4 Market Size by Type (2015-2026)

  • 4.1 Global Power Module Packaging Market Size by Type (2015-2020)
    • 4.1.1 Global Power Module Packaging Sales by Type (2015-2020)
    • 4.1.2 Global Power Module Packaging Revenue by Type (2015-2020)
    • 4.1.3 Power Module Packaging Average Selling Price (ASP) by Type (2015-2026)
  • 4.2 Global Power Module Packaging Market Size Forecast by Type (2021-2026)
    • 4.2.1 Global Power Module Packaging Sales Forecast by Type (2021-2026)
    • 4.2.2 Global Power Module Packaging Revenue Forecast by Type (2021-2026)
    • 4.2.3 Power Module Packaging Average Selling Price (ASP) Forecast by Type (2021-2026)
  • 4.3 Global Power Module Packaging Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End

5 Market Size by Application (2015-2026)

  • 5.1 Global Power Module Packaging Market Size by Application (2015-2020)
    • 5.1.1 Global Power Module Packaging Sales by Application (2015-2020)
    • 5.1.2 Global Power Module Packaging Revenue by Application (2015-2020)
    • 5.1.3 Power Module Packaging Price by Application (2015-2020)
  • 5.2 Power Module Packaging Market Size Forecast by Application (2021-2026)
    • 5.2.1 Global Power Module Packaging Sales Forecast by Application (2021-2026)
    • 5.2.2 Global Power Module Packaging Revenue Forecast by Application (2021-2026)
    • 5.2.3 Global Power Module Packaging Price Forecast by Application (2021-2026)

6 Japan by Players, Type and Application

  • 6.1 Japan Power Module Packaging Market Size YoY Growth 2015-2026
    • 6.1.1 Japan Power Module Packaging Sales YoY Growth 2015-2026
    • 6.1.2 Japan Power Module Packaging Revenue YoY Growth 2015-2026
    • 6.1.3 Japan Power Module Packaging Market Share in Global Market 2015-2026
  • 6.2 Japan Power Module Packaging Market Size by Players (International and Local Players)
    • 6.2.1 Japan Top Power Module Packaging Players by Sales (2015-2020)
    • 6.2.2 Japan Top Power Module Packaging Players by Revenue (2015-2020)
  • 6.3 Japan Power Module Packaging Historic Market Review by Type (2015-2020)
    • 6.3.1 Japan Power Module Packaging Sales Market Share by Type (2015-2020)
    • 6.3.2 Japan Power Module Packaging Revenue Market Share by Type (2015-2020)
    • 6.3.3 Japan Power Module Packaging Price by Type (2015-2020)
  • 6.4 Japan Power Module Packaging Market Estimates and Forecasts by Type (2021-2026)
    • 6.4.1 Japan Power Module Packaging Sales Forecast by Type (2021-2026)
    • 6.4.2 Japan Power Module Packaging Revenue Forecast by Type (2021-2026)
    • 6.4.3 Japan Power Module Packaging Price Forecast by Type (2021-2026)
  • 6.5 Japan Power Module Packaging Historic Market Review by Application (2015-2020)
    • 6.5.1 Japan Power Module Packaging Sales Market Share by Application (2015-2020)
    • 6.5.2 Japan Power Module Packaging Revenue Market Share by Application (2015-2020)
    • 6.5.3 Japan Power Module Packaging Price by Application (2015-2020)
  • 6.6 Japan Power Module Packaging Market Estimates and Forecasts by Application (2021-2026)
    • 6.6.1 Japan Power Module Packaging Sales Forecast by Application (2021-2026)
    • 6.6.2 Japan Power Module Packaging Revenue Forecast by Application (2021-2026)
    • 6.6.3 Japan Power Module Packaging Price Forecast by Application (2021-2026)

7 North America

  • 7.1 North America Power Module Packaging Market Size YoY Growth 2015-2026
  • 7.2 North America Power Module Packaging Market Facts & Figures by Country
    • 7.2.1 North America Power Module Packaging Sales by Country (2015-2020)
    • 7.2.2 North America Power Module Packaging Revenue by Country (2015-2020)
    • 7.2.3 U.S.
    • 7.2.4 Canada

8 Europe

  • 8.1 Europe Power Module Packaging Market Size YoY Growth 2015-2026
  • 8.2 Europe Power Module Packaging Market Facts & Figures by Country
    • 8.2.1 Europe Power Module Packaging Sales by Country
    • 8.2.2 Europe Power Module Packaging Revenue by Country
    • 8.2.3 Germany
    • 8.2.4 France
    • 8.2.5 U.K.
    • 8.2.6 Italy
    • 8.2.7 Russia

9 Asia Pacific

  • 9.1 Asia Pacific Power Module Packaging Market Size YoY Growth 2015-2026
  • 9.2 Asia Pacific Power Module Packaging Market Facts & Figures by Country
    • 9.2.1 Asia Pacific Power Module Packaging Sales by Region (2015-2020)
    • 9.2.2 Asia Pacific Power Module Packaging Revenue by Region
    • 9.2.3 China
    • 9.2.4 Japan
    • 9.2.5 South Korea
    • 9.2.6 India
    • 9.2.7 Australia
    • 9.2.8 Taiwan
    • 9.2.9 Indonesia
    • 9.2.10 Thailand
    • 9.2.11 Malaysia
    • 9.2.12 Philippines
    • 9.2.13 Vietnam

10 Latin America

  • 10.1 Latin America Power Module Packaging Market Size YoY Growth 2015-2026
  • 10.2 Latin America Power Module Packaging Market Facts & Figures by Country
    • 10.2.1 Latin America Power Module Packaging Sales by Country
    • 10.2.2 Latin America Power Module Packaging Revenue by Country
    • 10.2.3 Mexico
    • 10.2.4 Brazil
    • 10.2.5 Argentina

11 Middle East and Africa

  • 11.1 Middle East and Africa Power Module Packaging Market Size YoY Growth 2015-2026
  • 11.2 Middle East and Africa Power Module Packaging Market Facts & Figures by Country
    • 11.2.1 Middle East and Africa Power Module Packaging Sales by Country
    • 11.2.2 Middle East and Africa Power Module Packaging Revenue by Country
    • 11.2.3 Turkey
    • 11.2.4 Saudi Arabia
    • 11.2.5 U.A.E

12 Company Profiles

  • 12.1 Texas Instruments Incorporated
    • 12.1.1 Texas Instruments Incorporated Corporation Information
    • 12.1.2 Texas Instruments Incorporated Description and Business Overview
    • 12.1.3 Texas Instruments Incorporated Sales, Revenue and Gross Margin (2015-2020)
    • 12.1.4 Texas Instruments Incorporated Power Module Packaging Products Offered
    • 12.1.5 Texas Instruments Incorporated Recent Development
  • 12.2 Star Automations
    • 12.2.1 Star Automations Corporation Information
    • 12.2.2 Star Automations Description and Business Overview
    • 12.2.3 Star Automations Sales, Revenue and Gross Margin (2015-2020)
    • 12.2.4 Star Automations Power Module Packaging Products Offered
    • 12.2.5 Star Automations Recent Development
  • 12.3 DyDac Controls
    • 12.3.1 DyDac Controls Corporation Information
    • 12.3.2 DyDac Controls Description and Business Overview
    • 12.3.3 DyDac Controls Sales, Revenue and Gross Margin (2015-2020)
    • 12.3.4 DyDac Controls Power Module Packaging Products Offered
    • 12.3.5 DyDac Controls Recent Development
  • 12.4 SEMIKRON
    • 12.4.1 SEMIKRON Corporation Information
    • 12.4.2 SEMIKRON Description and Business Overview
    • 12.4.3 SEMIKRON Sales, Revenue and Gross Margin (2015-2020)
    • 12.4.4 SEMIKRON Power Module Packaging Products Offered
    • 12.4.5 SEMIKRON Recent Development
  • 12.5 IXYS Corporation
    • 12.5.1 IXYS Corporation Corporation Information
    • 12.5.2 IXYS Corporation Description and Business Overview
    • 12.5.3 IXYS Corporation Sales, Revenue and Gross Margin (2015-2020)
    • 12.5.4 IXYS Corporation Power Module Packaging Products Offered
    • 12.5.5 IXYS Corporation Recent Development
  • 12.6 Infineon Technologies AG
    • 12.6.1 Infineon Technologies AG Corporation Information
    • 12.6.2 Infineon Technologies AG Description and Business Overview
    • 12.6.3 Infineon Technologies AG Sales, Revenue and Gross Margin (2015-2020)
    • 12.6.4 Infineon Technologies AG Power Module Packaging Products Offered
    • 12.6.5 Infineon Technologies AG Recent Development
  • 12.7 Mitsubishi Electric Corporation
    • 12.7.1 Mitsubishi Electric Corporation Corporation Information
    • 12.7.2 Mitsubishi Electric Corporation Description and Business Overview
    • 12.7.3 Mitsubishi Electric Corporation Sales, Revenue and Gross Margin (2015-2020)
    • 12.7.4 Mitsubishi Electric Corporation Power Module Packaging Products Offered
    • 12.7.5 Mitsubishi Electric Corporation Recent Development
  • 12.8 Fuji Electric Co. Ltd.
    • 12.8.1 Fuji Electric Co. Ltd. Corporation Information
    • 12.8.2 Fuji Electric Co. Ltd. Description and Business Overview
    • 12.8.3 Fuji Electric Co. Ltd. Sales, Revenue and Gross Margin (2015-2020)
    • 12.8.4 Fuji Electric Co. Ltd. Power Module Packaging Products Offered
    • 12.8.5 Fuji Electric Co. Ltd. Recent Development
  • 12.9 Sanken Electric Co., Ltd.
    • 12.9.1 Sanken Electric Co., Ltd. Corporation Information
    • 12.9.2 Sanken Electric Co., Ltd. Description and Business Overview
    • 12.9.3 Sanken Electric Co., Ltd. Sales, Revenue and Gross Margin (2015-2020)
    • 12.9.4 Sanken Electric Co., Ltd. Power Module Packaging Products Offered
    • 12.9.5 Sanken Electric Co., Ltd. Recent Development
  • 12.10 SanRex Corporation
    • 12.10.1 SanRex Corporation Corporation Information
    • 12.10.2 SanRex Corporation Description and Business Overview
    • 12.10.3 SanRex Corporation Sales, Revenue and Gross Margin (2015-2020)
    • 12.10.4 SanRex Corporation Power Module Packaging Products Offered
    • 12.10.5 SanRex Corporation Recent Development
  • 12.11 Texas Instruments Incorporated
    • 12.11.1 Texas Instruments Incorporated Corporation Information
    • 12.11.2 Texas Instruments Incorporated Description and Business Overview
    • 12.11.3 Texas Instruments Incorporated Sales, Revenue and Gross Margin (2015-2020)
    • 12.11.4 Texas Instruments Incorporated Power Module Packaging Products Offered
    • 12.11.5 Texas Instruments Incorporated Recent Development
  • 12.12 STMicroelectronics
    • 12.12.1 STMicroelectronics Corporation Information
    • 12.12.2 STMicroelectronics Description and Business Overview
    • 12.12.3 STMicroelectronics Sales, Revenue and Gross Margin (2015-2020)
    • 12.12.4 STMicroelectronics Products Offered
    • 12.12.5 STMicroelectronics Recent Development
  • 12.13 Hitachi Power Semiconductor Device
    • 12.13.1 Hitachi Power Semiconductor Device Corporation Information
    • 12.13.2 Hitachi Power Semiconductor Device Description and Business Overview
    • 12.13.3 Hitachi Power Semiconductor Device Sales, Revenue and Gross Margin (2015-2020)
    • 12.13.4 Hitachi Power Semiconductor Device Products Offered
    • 12.13.5 Hitachi Power Semiconductor Device Recent Development
  • 12.14 ROHM
    • 12.14.1 ROHM Corporation Information
    • 12.14.2 ROHM Description and Business Overview
    • 12.14.3 ROHM Sales, Revenue and Gross Margin (2015-2020)
    • 12.14.4 ROHM Products Offered
    • 12.14.5 ROHM Recent Development
  • 12.15 Danfoss
    • 12.15.1 Danfoss Corporation Information
    • 12.15.2 Danfoss Description and Business Overview
    • 12.15.3 Danfoss Sales, Revenue and Gross Margin (2015-2020)
    • 12.15.4 Danfoss Products Offered
    • 12.15.5 Danfoss Recent Development

13 Market Opportunities, Challenges, Risks and Influences Factors Analysis

  • 13.1 Market Opportunities and Drivers
  • 13.2 Market Challenges
  • 13.3 Market Risks/Restraints
  • 13.4 Porter’s Five Forces Analysis
  • 13.5 Primary Interviews with Key Power Module Packaging Players (Opinion Leaders)

14 Value Chain and Sales Channels Analysis

  • 14.1 Value Chain Analysis
  • 14.2 Power Module Packaging Customers
  • 14.3 Sales Channels Analysis
    • 14.3.1 Sales Channels
    • 14.3.2 Distributors

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Research Methodology
      • 16.1.1 Methodology/Research Approach
      • 16.1.2 Data Source
    • 16.2 Author Details

    Power Module Packaging market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Power Module Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2015-2026.

    Segment by Type, the Power Module Packaging market is segmented into
    GaN Module
    SiC Module
    FET Module
    IGBT Module
    Thyristors

    Segment by Application, the Power Module Packaging market is segmented into
    Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
    Motors
    Rail Tractions
    Wind Turbines
    Photovoltaic Equipment

    Regional and Country-level Analysis
    The Power Module Packaging market is analysed and market size information is provided by regions (countries).
    The key regions covered in the Power Module Packaging market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
    The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.

    Competitive Landscape and Power Module Packaging Market Share Analysis
    Power Module Packaging market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Power Module Packaging business, the date to enter into the Power Module Packaging market, Power Module Packaging product introduction, recent developments, etc.
    The major vendors covered:
    Texas Instruments Incorporated
    Star Automations
    DyDac Controls
    SEMIKRON
    IXYS Corporation
    Infineon Technologies AG
    Mitsubishi Electric Corporation
    Fuji Electric Co. Ltd.
    Sanken Electric Co., Ltd.
    SanRex Corporation
    ON Semiconductor
    STMicroelectronics
    Hitachi Power Semiconductor Device
    ROHM
    Danfoss

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