Table of Contents

1 Global Market Overview

• 1.1 Scope of Statistics
  • 1.1.1 Scope of Products
  • 1.1.2 Scope of Manufacturers
  • 1.1.3 Scope of Application
  • 1.1.4 Scope of Type
  • 1.1.5 Scope of Regions/Countries
• 1.2 Global Market Size

2 Regional Market

• 2.1 Regional Production
• 2.2 Regional Demand
• 2.3 Regional Trade

3 Key Manufacturers

• 3.1 Dow Corning
  • 3.1.1 Company Information
  • 3.1.2 Product & Services
  • 3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.1.4 Recent Development
• 3.2 Henkel AG & Co. KGAA
  • 3.2.1 Company Information
  • 3.2.2 Product & Services
  • 3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.2.4 Recent Development
• 3.3 ACC Silicones Ltd.
  • 3.3.1 Company Information
  • 3.3.2 Product & Services
  • 3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.3.4 Recent Development
• 3.4 Elantas Beck Southeast Asia Ltd.
  • 3.4.1 Company Information
  • 3.4.2 Product & Services
  • 3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.4.4 Recent Development
• 3.5 Master Bond Inc.
  • 3.5.1 Company Information
  • 3.5.2 Product & Services
  • 3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.5.4 Recent Development
• 3.6 H.B.Fuller
  • 3.6.1 Company Information
  • 3.6.2 Product & Services
  • 3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.6.4 Recent Development
• 3.7 Dymax Corporation
  • 3.7.1 Company Information
  • 3.7.2 Product & Services
  • 3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.7.4 Recent Development
• 3.8 Electrolube
  • 3.8.1 Company Information
  • 3.8.2 Product & Services
  • 3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.8.4 Recent Development
• 3.9 Wevo-Chemie
  • 3.9.1 Company Information
  • 3.9.2 Product & Services
  • 3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.9.4 Recent Development
• 3.10 Mitsubishi Chemical
  • 3.10.1 Company Information
  • 3.10.2 Product & Services
  • 3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.10.4 Recent Development
• 3.11 MG Chemicals
  • 3.11.1 Company Information
  • 3.11.2 Product & Services
  • 3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.11.4 Recent Development
• 3.12 Threebond
  • 3.12.1 Company Information
  • 3.12.2 Product & Services
  • 3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.12.4 Recent Development
• 3.13 EFI Polymers
  • 3.13.1 Company Information
  • 3.13.2 Product & Services
  • 3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.13.4 Recent Development
• 3.14 Huitian New Materials
  • 3.14.1 Company Information
  • 3.14.2 Product & Services
  • 3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 3.15 Kangda New Materials
  • 3.15.1 Company Information
  • 3.15.2 Product & Services
  • 3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)

4 Major Application

• 4.1 Consumer Electronics
  • 4.1.1 Overview
  • 4.1.2 Consumer Electronics Market Size and Forecast
• 4.2 Transportation
  • 4.2.1 Overview
  • 4.2.2 Transportation Market Size and Forecast
• 4.3 Energy & Power
  • 4.3.1 Overview
  • 4.3.2 Energy & Power Market Size and Forecast
• 4.4 Automotive
  • 4.4.1 Overview
  • 4.4.2 Automotive Market Size and Forecast
• 4.5 Electrical
  • 4.5.1 Overview
  • 4.5.2 Electrical Market Size and Forecast
• 4.6 Others
  • 4.6.1 Overview
  • 4.6.2 Others Market Size and Forecast

5 Market by Type

5.By Epoxy Resin

• 5.1 Epoxy Resin
  • 5.1.1 Overview
  • 5.1.2 Epoxy Resin Market Size and Forecast
• 5.2 Polyurethane Resin
  • 5.2.1 Overview
  • 5.2.2 Polyurethane Resin Market Size and Forecast
• 5.3 Silicone Resin
  • 5.3.1 Overview
  • 5.3.2 Silicone Resin Market Size and Forecast

6 Price Overview

• 6.1 Price by Manufacturers
• 6.2 Price by Application
• 6.3 Price by Type

7 Conclusion

Summary
Potting compound, also known as electronic glue, is a widely called. For electronic components bonding, sealing, potting and coating protection. Potting is liquid before not curing, with liquidity, glue viscosity according to product quality, performance, different production processes vary. Potting completely cured before it can achieve its using value, after curing can play the effects of waterproof, dustproof, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature, shock.
The global Potting Compound market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export & import
Key manufacturers profile, products & services, sales data of business
Global market size by Major Application
Global market size by Major Type
Key manufacturers are included based on company profile, sales data and product specifications etc.:
Dow Corning
Henkel AG & Co. KGAA
ACC Silicones Ltd.
Elantas Beck Southeast Asia Ltd.
Master Bond Inc.
H.B.Fuller
Dymax Corporation
Electrolube
Wevo-Chemie
Mitsubishi Chemical
MG Chemicals
Threebond
EFI Polymers
Huitian New Materials
Kangda New Materials
Major applications as follows:
Consumer Electronics
Transportation
Energy & Power
Automotive
Electrical
Others
Major Type as follows:
Epoxy Resin
Polyurethane Resin
Silicone Resin
Regional market size, production data and export & import:
Asia-Pacific
North America
Europe
South America
Middle East & Africa