Summary

The Polyurethane Based Thermal Conductive Adhesives market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:

market size and forecast

Regional market size, production data and export & import

Key manufacturers profile, products & services, sales data of business

market size by Major Application

market size by Major Type

Key manufacturers are included based on company profile, sales data and product specifications etc.:

Henkel AG & Co. KGaA

H.B. Fuller

3M Company

Permabond Engineering Adhesives

Masterbond

Creative Materials Inc.

Panacol-Elosol GmbH

DOW Corning

Polytec PT GmbH

Lord Corporation

MG Chemicals

Protavic America, Inc.

Aremco

Cast-Coat, Inc.

Nagase America Corporation

Major applications as follows:

Battery Thermal

Heat Sink

IC Packaging Heat Conduction

LED Lighting Thermal

Thermal Material Potting

Major Type as follows:

Isotropic

Anisotropic

Regional market size, production data and export & import:

Asia-Pacific

North America

Europe

South America

Middle East & Africa

Table of Contents
1 Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 Henkel AG & Co. KGaA
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 H.B. Fuller
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 3M Company
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 Permabond Engineering Adhesives
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Masterbond
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 Creative Materials Inc.
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Panacol-Elosol GmbH
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 DOW Corning
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 Polytec PT GmbH
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 Lord Corporation
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 MG Chemicals
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Protavic America, Inc.
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 Aremco
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.13.4 Recent Development
3.14 Cast-Coat, Inc.
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.15 Nagase America Corporation
3.15.1 Company Information
3.15.2 Product & Services
3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Battery Thermal
4.1.1 Overview
4.1.2 Battery Thermal Market Size and Forecast
4.2 Heat Sink
4.2.1 Overview
4.2.2 Heat Sink Market Size and Forecast
4.3 IC Packaging Heat Conduction
4.3.1 Overview
4.3.2 IC Packaging Heat Conduction Market Size and Forecast
4.4 LED Lighting Thermal
4.4.1 Overview
4.4.2 LED Lighting Thermal Market Size and Forecast
4.5 Thermal Material Potting
4.5.1 Overview
4.5.2 Thermal Material Potting Market Size and Forecast
5 Market by Type
5.By Isotropic
5.1 Isotropic
5.1.1 Overview
5.1.2 Isotropic Market Size and Forecast
5.2 Anisotropic
5.2.1 Overview
5.2.2 Anisotropic Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion