Summary

The Photosensitive Dry Film market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:

market size and forecast

Regional market size, production data and export & import

Key manufacturers profile, products & services, sales data of business

market size by Major Application

market size by Major Type

Key manufacturers are included based on company profile, sales data and product specifications etc.:

Hitachi Chemical (JP)

Asahi Kasei (JP)

Eternal (TW)

KOLON Industries (KR)

DuPont (US)

Changchun Group (TW)

Mitsubishi (JP)

Elga Japan (IT)

FIRST (CN)

EMS (US)

Major applications as follows:

PCB

Semiconductor Packaging

Others

Major Type as follows:

Thickness ≤20 m

Thickness: 21-29 m

Thickness: 30-39 m

Thickness ≥40 m

Regional market size, production data and export & import:

Asia-Pacific

North America

Europe

South America

Middle East & Africa

Table of Contents
1 Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 Hitachi Chemical (JP)
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 Asahi Kasei (JP)
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 Eternal (TW)
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 KOLON Industries (KR)
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 DuPont (US)
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 Changchun Group (TW)
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Mitsubishi (JP)
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 Elga Japan (IT)
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 FIRST (CN)
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10 EMS (US)
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 PCB
4.1.1 Overview
4.1.2 PCB Market Size and Forecast
4.2 Semiconductor Packaging
4.2.1 Overview
4.2.2 Semiconductor Packaging Market Size and Forecast
4.3 Others
4.3.1 Overview
4.3.2 Others Market Size and Forecast
5 Market by Type
5.By Thickness ≤20 m
5.1 Thickness ≤20 m
5.1.1 Overview
5.1.2 Thickness ≤20 m Market Size and Forecast
5.2 Thickness: 21-29 m
5.2.1 Overview
5.2.2 Thickness: 21-29 m Market Size and Forecast
5.3 Thickness: 30-39 m
5.3.1 Overview
5.3.2 Thickness: 30-39 m Market Size and Forecast
5.4 Thickness ≥40 m
5.4.1 Overview
5.4.2 Thickness ≥40 m Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion