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Global Multilayer Printed-wiring Board Market Professional Survey Report 2019

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Table of Contents

    Executive Summary

      1 Industry Overview of Multilayer Printed-wiring Board

      • 1.1 Definition of Multilayer Printed-wiring Board
      • 1.2 Multilayer Printed-wiring Board Segment by Type
        • 1.2.1 Global Multilayer Printed-wiring Board Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 Layer 4-6
        • 1.2.3 Layer 8-10
        • 1.2.4 Layer 10+
      • 1.3 Multilayer Printed-wiring Board Segment by Applications
        • 1.3.1 Global Multilayer Printed-wiring Board Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Consumer Electronics
        • 1.3.3 Communications
        • 1.3.4 Computer Related Industry
        • 1.3.5 Automotive Industry
        • 1.3.6 Others
      • 1.4 Global Multilayer Printed-wiring Board Overall Market
        • 1.4.1 Global Multilayer Printed-wiring Board Revenue (2014-2025)
        • 1.4.2 Global Multilayer Printed-wiring Board Production (2014-2025)
        • 1.4.3 North America Multilayer Printed-wiring Board Status and Prospect (2014-2025)
        • 1.4.4 Europe Multilayer Printed-wiring Board Status and Prospect (2014-2025)
        • 1.4.5 China Multilayer Printed-wiring Board Status and Prospect (2014-2025)
        • 1.4.6 Japan Multilayer Printed-wiring Board Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia Multilayer Printed-wiring Board Status and Prospect (2014-2025)
        • 1.4.8 India Multilayer Printed-wiring Board Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of Multilayer Printed-wiring Board
      • 2.3 Manufacturing Process Analysis of Multilayer Printed-wiring Board
      • 2.4 Industry Chain Structure of Multilayer Printed-wiring Board

      3 Development and Manufacturing Plants Analysis of Multilayer Printed-wiring Board

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global Multilayer Printed-wiring Board Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of Multilayer Printed-wiring Board
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 Multilayer Printed-wiring Board Production and Capacity Analysis
      • 4.2 Multilayer Printed-wiring Board Revenue Analysis
      • 4.3 Multilayer Printed-wiring Board Price Analysis
      • 4.4 Market Concentration Degree

      5 Multilayer Printed-wiring Board Regional Market Analysis

      • 5.1 Multilayer Printed-wiring Board Production by Regions
        • 5.1.1 Global Multilayer Printed-wiring Board Production by Regions
        • 5.1.2 Global Multilayer Printed-wiring Board Revenue by Regions
      • 5.2 Multilayer Printed-wiring Board Consumption by Regions
      • 5.3 North America Multilayer Printed-wiring Board Market Analysis
        • 5.3.1 North America Multilayer Printed-wiring Board Production
        • 5.3.2 North America Multilayer Printed-wiring Board Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America Multilayer Printed-wiring Board Import and Export
      • 5.4 Europe Multilayer Printed-wiring Board Market Analysis
        • 5.4.1 Europe Multilayer Printed-wiring Board Production
        • 5.4.2 Europe Multilayer Printed-wiring Board Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe Multilayer Printed-wiring Board Import and Export
      • 5.5 China Multilayer Printed-wiring Board Market Analysis
        • 5.5.1 China Multilayer Printed-wiring Board Production
        • 5.5.2 China Multilayer Printed-wiring Board Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China Multilayer Printed-wiring Board Import and Export
      • 5.6 Japan Multilayer Printed-wiring Board Market Analysis
        • 5.6.1 Japan Multilayer Printed-wiring Board Production
        • 5.6.2 Japan Multilayer Printed-wiring Board Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan Multilayer Printed-wiring Board Import and Export
      • 5.7 Southeast Asia Multilayer Printed-wiring Board Market Analysis
        • 5.7.1 Southeast Asia Multilayer Printed-wiring Board Production
        • 5.7.2 Southeast Asia Multilayer Printed-wiring Board Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia Multilayer Printed-wiring Board Import and Export
      • 5.8 India Multilayer Printed-wiring Board Market Analysis
        • 5.8.1 India Multilayer Printed-wiring Board Production
        • 5.8.2 India Multilayer Printed-wiring Board Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India Multilayer Printed-wiring Board Import and Export

      6 Multilayer Printed-wiring Board Segment Market Analysis (by Type)

      • 6.1 Global Multilayer Printed-wiring Board Production by Type
      • 6.2 Global Multilayer Printed-wiring Board Revenue by Type
      • 6.3 Multilayer Printed-wiring Board Price by Type

      7 Multilayer Printed-wiring Board Segment Market Analysis (by Application)

      • 7.1 Global Multilayer Printed-wiring Board Consumption by Application
      • 7.2 Global Multilayer Printed-wiring Board Consumption Market Share by Application (2014-2019)

      8 Multilayer Printed-wiring Board Major Manufacturers Analysis

      • 8.1 Nippon Mektron
        • 8.1.1 Nippon Mektron Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.1.2 Nippon Mektron Product Introduction, Application and Specification
        • 8.1.3 Nippon Mektron Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Zhen Ding Technology
        • 8.2.1 Zhen Ding Technology Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.2.2 Zhen Ding Technology Product Introduction, Application and Specification
        • 8.2.3 Zhen Ding Technology Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 Unimicron
        • 8.3.1 Unimicron Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.3.2 Unimicron Product Introduction, Application and Specification
        • 8.3.3 Unimicron Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 ELNA
        • 8.4.1 ELNA Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.4.2 ELNA Product Introduction, Application and Specification
        • 8.4.3 ELNA Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 Young Poong Group
        • 8.5.1 Young Poong Group Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.5.2 Young Poong Group Product Introduction, Application and Specification
        • 8.5.3 Young Poong Group Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 Samsung Electro-Mechanics
        • 8.6.1 Samsung Electro-Mechanics Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.6.2 Samsung Electro-Mechanics Product Introduction, Application and Specification
        • 8.6.3 Samsung Electro-Mechanics Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 Ibiden
        • 8.7.1 Ibiden Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.7.2 Ibiden Product Introduction, Application and Specification
        • 8.7.3 Ibiden Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 Tripod
        • 8.8.1 Tripod Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.8.2 Tripod Product Introduction, Application and Specification
        • 8.8.3 Tripod Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 TTM Technologies
        • 8.9.1 TTM Technologies Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.9.2 TTM Technologies Product Introduction, Application and Specification
        • 8.9.3 TTM Technologies Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 Sumitomo Electric SEI
        • 8.10.1 Sumitomo Electric SEI Multilayer Printed-wiring Board Production Sites and Area Served
        • 8.10.2 Sumitomo Electric SEI Product Introduction, Application and Specification
        • 8.10.3 Sumitomo Electric SEI Multilayer Printed-wiring Board Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served
      • 8.11 Daeduck Group
      • 8.12 Nanya PCB
      • 8.13 Compeq
      • 8.14 HannStar Board
      • 8.15 LG Innotek
      • 8.16 AT&S
      • 8.17 Meiko
      • 8.18 Chin-Poon
      • 8.19 Shennan
      • 8.20 WUS

      9 Development Trend of Analysis of Multilayer Printed-wiring Board Market

      • 9.1 Global Multilayer Printed-wiring Board Market Trend Analysis
        • 9.1.1 Global Multilayer Printed-wiring Board Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 Multilayer Printed-wiring Board Regional Market Trend
        • 9.2.1 North America Multilayer Printed-wiring Board Forecast 2019-2025
        • 9.2.2 Europe Multilayer Printed-wiring Board Forecast 2019-2025
        • 9.2.3 China Multilayer Printed-wiring Board Forecast 2019-2025
        • 9.2.4 Japan Multilayer Printed-wiring Board Forecast 2019-2025
        • 9.2.5 Southeast Asia Multilayer Printed-wiring Board Forecast 2019-2025
        • 9.2.6 India Multilayer Printed-wiring Board Forecast 2019-2025
      • 9.3 Multilayer Printed-wiring Board Market Trend (Product Type)
      • 9.4 Multilayer Printed-wiring Board Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 Multilayer Printed-wiring Board Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        The global Multilayer Printed-wiring Board market was valued at million US$ in 2018 and will reach million US$ by the end of 2025, growing at a CAGR of during 2019-2025.
        This report focuses on Multilayer Printed-wiring Board volume and value at global level, regional level and company level. From a global perspective, this report represents overall Multilayer Printed-wiring Board market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of Multilayer Printed-wiring Board in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their Multilayer Printed-wiring Board manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        Nippon Mektron
        Zhen Ding Technology
        Unimicron
        ELNA
        Young Poong Group
        Samsung Electro-Mechanics
        Ibiden
        Tripod
        TTM Technologies
        Sumitomo Electric SEI
        Daeduck Group
        Nanya PCB
        Compeq
        HannStar Board
        LG Innotek
        AT&S
        Meiko
        Chin-Poon
        Shennan
        WUS

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        Layer 4-6
        Layer 8-10
        Layer 10+

        Segment by Application
        Consumer Electronics
        Communications
        Computer Related Industry
        Automotive Industry
        Others

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