1 Study Coverage

• 1.1 Microelectronic Packaging Materials Product Introduction
• 1.2 Global Microelectronic Packaging Materials Outlook 2017 VS 2022 VS 2028
• 1.2.1 Global Microelectronic Packaging Materials Sales in US$ Million for the Year 2017-2028

1.2.2 Global Microelectronic Packaging Materials Sales in Volume for the Year 2017-2028

1.3 United States Microelectronic Packaging Materials Outlook 2017 VS 2022 VS 2028

1.3.1 United States Microelectronic Packaging Materials Sales in US$ Million for the Year 2017-2028

1.3.2 United States Microelectronic Packaging Materials Sales in Volume for the Year 2017-2028

1.4 Microelectronic Packaging Materials Market Size, United States VS Global, 2017 VS 2022 VS 2028

1.4.1 The Market Share of United States Microelectronic Packaging Materials in Global, 2017 VS 2022 VS 2028

1.4.2 The Growth Rate of Microelectronic Packaging Materials Market Size, United States VS Global, 2017 VS 2022 VS 2028

1.5 Microelectronic Packaging Materials Market Dynamics

1.5.1 Microelectronic Packaging Materials Industry Trends

1.5.2 Microelectronic Packaging Materials Market Drivers

1.5.3 Microelectronic Packaging Materials Market Challenges

1.5.4 Microelectronic Packaging Materials Market Restraints

1.6 Study Objectives

1.7 Years Considered

2 Market by Type

• 2.1 Microelectronic Packaging Materials Market Segment by Type
• 2.1.1 Silicone

2.1.2 Epoxies

2.1.3 Metals

2.1.4 Alloys

2.1.5 Others

2.2 Global Microelectronic Packaging Materials Market Size by Type

2.2.1 Global Microelectronic Packaging Materials Sales in Value, by Type (2017, 2022 & 2028)

2.2.2 Global Microelectronic Packaging Materials Sales in Volume, by Type (2017, 2022 & 2028)

2.2.3 Global Microelectronic Packaging Materials Average Selling Price (ASP) by Type (2017, 2022 & 2028)

2.3 United States Microelectronic Packaging Materials Market Size by Type

2.3.1 United States Microelectronic Packaging Materials Sales in Value, by Type (2017, 2022 & 2028)

2.3.2 United States Microelectronic Packaging Materials Sales in Volume, by Type (2017, 2022 & 2028)

2.3.3 United States Microelectronic Packaging Materials Average Selling Price (ASP) by Type (2017, 2022 & 2028)

3 Market by Application

• 3.1 Microelectronic Packaging Materials Market Segment by Application
• 3.1.1 Medical

3.1.2 Aerospace

3.1.3 Others

3.2 Global Microelectronic Packaging Materials Market Size by Application

3.2.1 Global Microelectronic Packaging Materials Sales in Value, by Application (2017, 2022 & 2028)

3.2.2 Global Microelectronic Packaging Materials Sales in Volume, by Application (2017, 2022 & 2028)

3.3.3 Global Microelectronic Packaging Materials Average Selling Price (ASP) by Application (2017, 2022 & 2028)

3.3 United States Microelectronic Packaging Materials Market Size by Application

3.3.1 United States Microelectronic Packaging Materials Sales in Value, by Application (2017, 2022 & 2028)

3.3.2 United States Microelectronic Packaging Materials Sales in Volume, by Application (2017, 2022 & 2028)

3.3.3 United States Microelectronic Packaging Materials Average Selling Price (ASP) by Application (2017, 2022 & 2028)

4 Global Microelectronic Packaging Materials Competitor Landscape by Company

• 4.1 Global Microelectronic Packaging Materials Market Size by Company
• 4.1.1 Top Global Microelectronic Packaging Materials Manufacturers Ranked by Revenue (2021)

4.1.2 Global Microelectronic Packaging Materials Revenue by Manufacturer (2017-2022)

4.1.3 Global Microelectronic Packaging Materials Sales by Manufacturer (2017-2022)

4.1.4 Global Microelectronic Packaging Materials Price by Manufacturer (2017-2022)

4.2 Global Microelectronic Packaging Materials Concentration Ratio (CR)

4.2.1 Microelectronic Packaging Materials Market Concentration Ratio (CR) (2017-2022)

4.2.2 Global Top 5 and Top 10 Largest Manufacturers of Microelectronic Packaging Materials in 2021

4.2.3 Global Microelectronic Packaging Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

4.3 Global Microelectronic Packaging Materials Manufacturing Base Distribution, Product Type

4.3.1 Global Microelectronic Packaging Materials Manufacturers, Headquarters and Distribution of Producing Region

4.3.2 Manufacturers Microelectronic Packaging Materials Product Type

4.3.3 Date of International Manufacturers Enter into Microelectronic Packaging Materials Market

4.4 Manufacturers Mergers & Acquisitions, Expansion Plans

4.5 United States Microelectronic Packaging Materials Market Size by Company

4.5.1 Top Microelectronic Packaging Materials Players in United States, Ranked by Revenue (2021)

4.5.2 United States Microelectronic Packaging Materials Revenue by Players (2020, 2021 & 2022)

4.5.3 United States Microelectronic Packaging Materials Sales by Players (2020, 2021 & 2022)

5 Global Microelectronic Packaging Materials Market Size by Region

• 5.1 Global Microelectronic Packaging Materials Market Size by Region: 2017 VS 2022 VS 2028
• 5.2 Global Microelectronic Packaging Materials Market Size in Volume by Region (2017-2028)
• 5.2.1 Global Microelectronic Packaging Materials Sales in Volume by Region: 2017-2022

5.2.2 Global Microelectronic Packaging Materials Sales in Volume Forecast by Region (2023-2028)

5.3 Global Microelectronic Packaging Materials Market Size in Value by Region (2017-2028)

5.3.1 Global Microelectronic Packaging Materials Sales in Value by Region: 2017-2022

5.3.2 Global Microelectronic Packaging Materials Sales in Value by Region: 2023-2028

6 Segment in Region Level & Country Level

• 6.1 North America
• 6.1.1 North America Microelectronic Packaging Materials Market Size YoY Growth 2017-2028

6.1.2 North America Microelectronic Packaging Materials Market Facts & Figures by Country (2017, 2022 & 2028)

6.1.3 United States

6.1.4 Canada

6.2 Asia-Pacific

6.2.1 Asia-Pacific Microelectronic Packaging Materials Market Size YoY Growth 2017-2028

6.2.2 Asia-Pacific Microelectronic Packaging Materials Market Facts & Figures by Region (2017, 2022 & 2028)

6.2.3 China

6.2.4 Japan

6.2.5 South Korea

6.2.6 India

6.2.7 Australia

6.2.8 China Taiwan

6.2.9 Indonesia

6.2.10 Thailand

6.2.11 Malaysia

6.3 Europe

6.3.1 Europe Microelectronic Packaging Materials Market Size YoY Growth 2017-2028

6.3.2 Europe Microelectronic Packaging Materials Market Facts & Figures by Country (2017, 2022 & 2028)

6.3.3 Germany

6.3.4 France

6.3.5 U.K.

6.3.6 Italy

6.3.7 Russia

6.4 Latin America

6.4.1 Latin America Microelectronic Packaging Materials Market Size YoY Growth 2017-2028

6.4.2 Latin America Microelectronic Packaging Materials Market Facts & Figures by Country (2017, 2022 & 2028)

6.4.3 Mexico

6.4.4 Brazil

6.4.5 Argentina

6.4.6 Colombia

6.5 Middle East and Africa

6.5.1 Middle East and Africa Microelectronic Packaging Materials Market Size YoY Growth 2017-2028

6.5.2 Middle East and Africa Microelectronic Packaging Materials Market Facts & Figures by Country (2017, 2022 & 2028)

6.5.3 Turkey

6.5.4 Saudi Arabia

6.5.5 UAE

7 Company Profiles

• 7.1 Materion
• 7.1.1 Materion Corporation Information

7.1.2 Materion Description and Business Overview

7.1.3 Materion Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.1.4 Materion Microelectronic Packaging Materials Products Offered

7.1.5 Materion Recent Development

7.2 STI

7.2.1 STI Corporation Information

7.2.2 STI Description and Business Overview

7.2.3 STI Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.2.4 STI Microelectronic Packaging Materials Products Offered

7.2.5 STI Recent Development

7.3 SHING HONG TAI COMPANY

7.3.1 SHING HONG TAI COMPANY Corporation Information

7.3.2 SHING HONG TAI COMPANY Description and Business Overview

7.3.3 SHING HONG TAI COMPANY Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.3.4 SHING HONG TAI COMPANY Microelectronic Packaging Materials Products Offered

7.3.5 SHING HONG TAI COMPANY Recent Development

7.4 DuPont Electronics & Industrial

7.4.1 DuPont Electronics & Industrial Corporation Information

7.4.2 DuPont Electronics & Industrial Description and Business Overview

7.4.3 DuPont Electronics & Industrial Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.4.4 DuPont Electronics & Industrial Microelectronic Packaging Materials Products Offered

7.4.5 DuPont Electronics & Industrial Recent Development

7.5 Panasonic

7.5.1 Panasonic Corporation Information

7.5.2 Panasonic Description and Business Overview

7.5.3 Panasonic Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.5.4 Panasonic Microelectronic Packaging Materials Products Offered

7.5.5 Panasonic Recent Development

7.6 Polymer Systems Technology

7.6.1 Polymer Systems Technology Corporation Information

7.6.2 Polymer Systems Technology Description and Business Overview

7.6.3 Polymer Systems Technology Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.6.4 Polymer Systems Technology Microelectronic Packaging Materials Products Offered

7.6.5 Polymer Systems Technology Recent Development

7.7 SCHOTT Company

7.7.1 SCHOTT Company Corporation Information

7.7.2 SCHOTT Company Description and Business Overview

7.7.3 SCHOTT Company Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.7.4 SCHOTT Company Microelectronic Packaging Materials Products Offered

7.7.5 SCHOTT Company Recent Development

7.8 Silicon Connection

7.8.1 Silicon Connection Corporation Information

7.8.2 Silicon Connection Description and Business Overview

7.8.3 Silicon Connection Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.8.4 Silicon Connection Microelectronic Packaging Materials Products Offered

7.8.5 Silicon Connection Recent Development

7.9 CHIMEI

7.9.1 CHIMEI Corporation Information

7.9.2 CHIMEI Description and Business Overview

7.9.3 CHIMEI Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.9.4 CHIMEI Microelectronic Packaging Materials Products Offered

7.9.5 CHIMEI Recent Development

7.10 Stanford Advanced Materials

7.10.1 Stanford Advanced Materials Corporation Information

7.10.2 Stanford Advanced Materials Description and Business Overview

7.10.3 Stanford Advanced Materials Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.10.4 Stanford Advanced Materials Microelectronic Packaging Materials Products Offered

7.10.5 Stanford Advanced Materials Recent Development

7.11 Ferro

7.11.1 Ferro Corporation Information

7.11.2 Ferro Description and Business Overview

7.11.3 Ferro Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.11.4 Ferro Microelectronic Packaging Materials Products Offered

7.11.5 Ferro Recent Development

7.12 Mosaic Microsystems

7.12.1 Mosaic Microsystems Corporation Information

7.12.2 Mosaic Microsystems Description and Business Overview

7.12.3 Mosaic Microsystems Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.12.4 Mosaic Microsystems Products Offered

7.12.5 Mosaic Microsystems Recent Development

7.13 MBK Tape Solutions

7.13.1 MBK Tape Solutions Corporation Information

7.13.2 MBK Tape Solutions Description and Business Overview

7.13.3 MBK Tape Solutions Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.13.4 MBK Tape Solutions Products Offered

7.13.5 MBK Tape Solutions Recent Development

7.14 Component Surfaces

7.14.1 Component Surfaces Corporation Information

7.14.2 Component Surfaces Description and Business Overview

7.14.3 Component Surfaces Microelectronic Packaging Materials Sales, Revenue and Gross Margin (2017-2022)

7.14.4 Component Surfaces Products Offered

7.14.5 Component Surfaces Recent Development

8 Industry Chain and Sales Channels Analysis

• 8.1 Microelectronic Packaging Materials Industry Chain Analysis
• 8.2 Microelectronic Packaging Materials Key Raw Materials
• 8.2.1 Key Raw Materials

8.2.2 Microelectronic Packaging Materials Distributors

8.3 Microelectronic Packaging Materials Production Mode & Process

8.4 Microelectronic Packaging Materials Sales and Marketing

8.4.1 Microelectronic Packaging Materials Sales Channels

8.4.2 Microelectronic Packaging Materials Distributors

8.5 Microelectronic Packaging Materials Customers

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
• 10.1.1 Methodology/Research Approach

10.1.2 Data Source

10.2 Author Details

Market Analysis and Insights: Global and United States Microelectronic Packaging Materials Market
This report focuses on global and United States Microelectronic Packaging Materials market, also covers the segmentation data of other regions in regional level and county level.

Due to the COVID-19 pandemic, the global Microelectronic Packaging Materials market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, by Type, Silicone accounting for % of the Microelectronic Packaging Materials global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While by Application, Medical was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.

In United States the Microelectronic Packaging Materials market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.

Global Microelectronic Packaging Materials Scope and Market Size

Microelectronic Packaging Materials market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Microelectronic Packaging Materials market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.

For United States market, this report focuses on the Microelectronic Packaging Materials market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.

Segment by Type, the Microelectronic Packaging Materials market is segmented into

Silicone

Epoxies

Metals

Alloys

Others

Segment by Application, the Microelectronic Packaging Materials market is segmented into

Medical

Aerospace

Others

Regional and Country-level Analysis

By Region

North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

India

Australia

China Taiwan

Indonesia

Thailand

Malaysia

Latin America

Mexico

Brazil

Argentina

Colombia

Middle East & Africa

Turkey

Saudi Arabia

UAE

Competitive Landscape and Microelectronic Packaging Materials Market Share Analysis

Microelectronic Packaging Materials market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2017-2022. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2017-2022. Details included are company description, major business, company total revenue and the sales, revenue generated in Microelectronic Packaging Materials business, the date to enter into the Microelectronic Packaging Materials market, Microelectronic Packaging Materials product introduction, recent developments, etc.

The major vendors covered:

Materion

STI

SHING HONG TAI COMPANY

DuPont Electronics & Industrial

Panasonic

Polymer Systems Technology

SCHOTT Company

Silicon Connection

CHIMEI

Stanford Advanced Materials

Ferro

Mosaic Microsystems

MBK Tape Solutions

Component Surfaces