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Global (United States, European Union and China) IC Substrate Packaging Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global IC Substrate Packaging Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Metal
      • 1.3.3 Ceramics
      • 1.3.4 Glass
    • 1.4 Market Segment by Application
      • 1.4.1 Global IC Substrate Packaging Market Share by Application (2019-2025)
      • 1.4.2 Analog Circuits
      • 1.4.3 Digital Circuits
      • 1.4.4 RF Circuit
      • 1.4.5 Sensor
      • 1.4.6 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global IC Substrate Packaging Production Value 2014-2025
      • 2.1.2 Global IC Substrate Packaging Production 2014-2025
      • 2.1.3 Global IC Substrate Packaging Capacity 2014-2025
      • 2.1.4 Global IC Substrate Packaging Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global IC Substrate Packaging Market Size CAGR of Key Regions
      • 2.2.2 Global IC Substrate Packaging Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global IC Substrate Packaging Capacity by Manufacturers
      • 3.1.2 Global IC Substrate Packaging Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 IC Substrate Packaging Revenue by Manufacturers (2014-2019)
      • 3.2.2 IC Substrate Packaging Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global IC Substrate Packaging Market Concentration Ratio (CR5 and HHI)
    • 3.3 IC Substrate Packaging Price by Manufacturers
    • 3.4 Key Manufacturers IC Substrate Packaging Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into IC Substrate Packaging Market
    • 3.6 Key Manufacturers IC Substrate Packaging Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Metal Production and Production Value (2014-2019)
      • 4.1.2 Ceramics Production and Production Value (2014-2019)
      • 4.1.3 Glass Production and Production Value (2014-2019)
    • 4.2 Global IC Substrate Packaging Production Market Share by Type
    • 4.3 Global IC Substrate Packaging Production Value Market Share by Type
    • 4.4 IC Substrate Packaging Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global IC Substrate Packaging Consumption by Application

    6 Production by Regions

    • 6.1 Global IC Substrate Packaging Production (History Data) by Regions 2014-2019
    • 6.2 Global IC Substrate Packaging Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States IC Substrate Packaging Production Growth Rate 2014-2019
      • 6.3.2 United States IC Substrate Packaging Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States IC Substrate Packaging Import & Export
    • 6.4 European Union
      • 6.4.1 European Union IC Substrate Packaging Production Growth Rate 2014-2019
      • 6.4.2 European Union IC Substrate Packaging Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union IC Substrate Packaging Import & Export
    • 6.5 China
      • 6.5.1 China IC Substrate Packaging Production Growth Rate 2014-2019
      • 6.5.2 China IC Substrate Packaging Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China IC Substrate Packaging Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 IC Substrate Packaging Consumption by Regions

    • 7.1 Global IC Substrate Packaging Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States IC Substrate Packaging Consumption by Type
      • 7.2.2 United States IC Substrate Packaging Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union IC Substrate Packaging Consumption by Type
      • 7.3.2 European Union IC Substrate Packaging Consumption by Application
    • 7.4 China
      • 7.4.1 China IC Substrate Packaging Consumption by Type
      • 7.4.2 China IC Substrate Packaging Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World IC Substrate Packaging Consumption by Type
      • 7.5.2 Rest of World IC Substrate Packaging Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Ibiden
      • 8.1.1 Ibiden Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of IC Substrate Packaging
      • 8.1.4 IC Substrate Packaging Product Introduction
      • 8.1.5 Ibiden Recent Development
    • 8.2 STATS ChipPAC
      • 8.2.1 STATS ChipPAC Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of IC Substrate Packaging
      • 8.2.4 IC Substrate Packaging Product Introduction
      • 8.2.5 STATS ChipPAC Recent Development
    • 8.3 Linxens
      • 8.3.1 Linxens Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of IC Substrate Packaging
      • 8.3.4 IC Substrate Packaging Product Introduction
      • 8.3.5 Linxens Recent Development
    • 8.4 Toppan Photomasks
      • 8.4.1 Toppan Photomasks Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of IC Substrate Packaging
      • 8.4.4 IC Substrate Packaging Product Introduction
      • 8.4.5 Toppan Photomasks Recent Development
    • 8.5 AMKOR
      • 8.5.1 AMKOR Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of IC Substrate Packaging
      • 8.5.4 IC Substrate Packaging Product Introduction
      • 8.5.5 AMKOR Recent Development
    • 8.6 ASE
      • 8.6.1 ASE Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of IC Substrate Packaging
      • 8.6.4 IC Substrate Packaging Product Introduction
      • 8.6.5 ASE Recent Development
    • 8.7 Cadence Design Systems
      • 8.7.1 Cadence Design Systems Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of IC Substrate Packaging
      • 8.7.4 IC Substrate Packaging Product Introduction
      • 8.7.5 Cadence Design Systems Recent Development
    • 8.8 Atotech Deutschland GmbH
      • 8.8.1 Atotech Deutschland GmbH Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of IC Substrate Packaging
      • 8.8.4 IC Substrate Packaging Product Introduction
      • 8.8.5 Atotech Deutschland GmbH Recent Development
    • 8.9 SHINKO
      • 8.9.1 SHINKO Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of IC Substrate Packaging
      • 8.9.4 IC Substrate Packaging Product Introduction
      • 8.9.5 SHINKO Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global IC Substrate Packaging Capacity, Production Forecast 2019-2025
      • 9.1.2 Global IC Substrate Packaging Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global IC Substrate Packaging Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global IC Substrate Packaging Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global IC Substrate Packaging Production Forecast by Type
      • 9.7.2 Global IC Substrate Packaging Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 IC Substrate Packaging Sales Channels
      • 10.2.2 IC Substrate Packaging Distributors
    • 10.3 IC Substrate Packaging Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      In 2019, the market size of IC Substrate Packaging is million US$ and it will reach million US$ in 2025, growing at a CAGR of from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for IC Substrate Packaging.

      This report studies the global market size of IC Substrate Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the IC Substrate Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Ibiden
      STATS ChipPAC
      Linxens
      Toppan Photomasks
      AMKOR
      ASE
      Cadence Design Systems
      Atotech Deutschland GmbH
      SHINKO

      Market Segment by Product Type
      Metal
      Ceramics
      Glass

      Market Segment by Application
      Analog Circuits
      Digital Circuits
      RF Circuit
      Sensor
      Others

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the IC Substrate Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key IC Substrate Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of IC Substrate Packaging are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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