Copyright Reports & Markets. All rights reserved.

Global IC Packaging and Testing Market Size, Status and Forecast 2020-2026

Request for Sample of this report
Buy now

Table of Contents

    1 Report Overview

    • 1.1 Study Scope
    • 1.2 Key Market Segments
    • 1.3 Players Covered: Ranking by IC Packaging and Testing Revenue
    • 1.4 Market Analysis by Type
      • 1.4.1 Global IC Packaging and Testing Market Size Growth Rate by Type: 2020 VS 2026
      • 1.4.2 Wire Bonding
      • 1.4.3 Flip Chip
      • 1.4.4 Straight Through Silicon Perforation
      • 1.4.5 Other
    • 1.5 Market by Application
      • 1.5.1 Global IC Packaging and Testing Market Share by Application: 2020 VS 2026
      • 1.5.2 Electronics Industry
      • 1.5.3 Medical
      • 1.5.4 Automobiles
      • 1.5.5 Others
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Global Growth Trends by Regions

    • 2.1 IC Packaging and Testing Market Perspective (2015-2026)
    • 2.2 IC Packaging and Testing Growth Trends by Regions
      • 2.2.1 IC Packaging and Testing Market Size by Regions: 2015 VS 2020 VS 2026
      • 2.2.2 IC Packaging and Testing Historic Market Share by Regions (2015-2020)
      • 2.2.3 IC Packaging and Testing Forecasted Market Size by Regions (2021-2026)
    • 2.3 Industry Trends and Growth Strategy
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers
      • 2.3.3 Market Challenges
      • 2.3.4 Porter’s Five Forces Analysis
      • 2.3.5 IC Packaging and Testing Market Growth Strategy
      • 2.3.6 Primary Interviews with Key IC Packaging and Testing Players (Opinion Leaders)

    3 Competition Landscape by Key Players

    • 3.1 Global Top IC Packaging and Testing Players by Market Size
      • 3.1.1 Global Top IC Packaging and Testing Players by Revenue (2015-2020)
      • 3.1.2 Global IC Packaging and Testing Revenue Market Share by Players (2015-2020)
      • 3.1.3 Global IC Packaging and Testing Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
    • 3.2 Global IC Packaging and Testing Market Concentration Ratio
      • 3.2.1 Global IC Packaging and Testing Market Concentration Ratio (CR5 and HHI)
      • 3.2.2 Global Top 10 and Top 5 Companies by IC Packaging and Testing Revenue in 2019
    • 3.3 IC Packaging and Testing Key Players Head office and Area Served
    • 3.4 Key Players IC Packaging and Testing Product Solution and Service
    • 3.5 Date of Enter into IC Packaging and Testing Market
    • 3.6 Mergers & Acquisitions, Expansion Plans

    4 Breakdown Data by Type (2015-2026)

    • 4.1 Global IC Packaging and Testing Historic Market Size by Type (2015-2020)
    • 4.2 Global IC Packaging and Testing Forecasted Market Size by Type (2021-2026)

    5 IC Packaging and Testing Breakdown Data by Application (2015-2026)

    • 5.1 Global IC Packaging and Testing Market Size by Application (2015-2020)
    • 5.2 Global IC Packaging and Testing Forecasted Market Size by Application (2021-2026)

    6 North America

    • 6.1 North America IC Packaging and Testing Market Size (2015-2020)
    • 6.2 IC Packaging and Testing Key Players in North America (2019-2020)
    • 6.3 North America IC Packaging and Testing Market Size by Type (2015-2020)
    • 6.4 North America IC Packaging and Testing Market Size by Application (2015-2020)

    7 Europe

    • 7.1 Europe IC Packaging and Testing Market Size (2015-2020)
    • 7.2 IC Packaging and Testing Key Players in Europe (2019-2020)
    • 7.3 Europe IC Packaging and Testing Market Size by Type (2015-2020)
    • 7.4 Europe IC Packaging and Testing Market Size by Application (2015-2020)

    8 China

    • 8.1 China IC Packaging and Testing Market Size (2015-2020)
    • 8.2 IC Packaging and Testing Key Players in China (2019-2020)
    • 8.3 China IC Packaging and Testing Market Size by Type (2015-2020)
    • 8.4 China IC Packaging and Testing Market Size by Application (2015-2020)

    9 Japan

    • 9.1 Japan IC Packaging and Testing Market Size (2015-2020)
    • 9.2 IC Packaging and Testing Key Players in Japan (2019-2020)
    • 9.3 Japan IC Packaging and Testing Market Size by Type (2015-2020)
    • 9.4 Japan IC Packaging and Testing Market Size by Application (2015-2020)

    10 Southeast Asia

    • 10.1 Southeast Asia IC Packaging and Testing Market Size (2015-2020)
    • 10.2 IC Packaging and Testing Key Players in Southeast Asia (2019-2020)
    • 10.3 Southeast Asia IC Packaging and Testing Market Size by Type (2015-2020)
    • 10.4 Southeast Asia IC Packaging and Testing Market Size by Application (2015-2020)

    11 India

    • 11.1 India IC Packaging and Testing Market Size (2015-2020)
    • 11.2 IC Packaging and Testing Key Players in India (2019-2020)
    • 11.3 India IC Packaging and Testing Market Size by Type (2015-2020)
    • 11.4 India IC Packaging and Testing Market Size by Application (2015-2020)

    12 Central & South America

    • 12.1 Central & South America IC Packaging and Testing Market Size (2015-2020)
    • 12.2 IC Packaging and Testing Key Players in Central & South America (2019-2020)
    • 12.3 Central & South America IC Packaging and Testing Market Size by Type (2015-2020)
    • 12.4 Central & South America IC Packaging and Testing Market Size by Application (2015-2020)

    13 Key Players Profiles

    • 13.1 Amkor
      • 13.1.1 Amkor Company Details
      • 13.1.2 Amkor Business Overview and Its Total Revenue
      • 13.1.3 Amkor IC Packaging and Testing Introduction
      • 13.1.4 Amkor Revenue in IC Packaging and Testing Business (2015-2020))
      • 13.1.5 Amkor Recent Development
    • 13.2 JCET
      • 13.2.1 JCET Company Details
      • 13.2.2 JCET Business Overview and Its Total Revenue
      • 13.2.3 JCET IC Packaging and Testing Introduction
      • 13.2.4 JCET Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.2.5 JCET Recent Development
    • 13.3 Tianshui Huatian Technology
      • 13.3.1 Tianshui Huatian Technology Company Details
      • 13.3.2 Tianshui Huatian Technology Business Overview and Its Total Revenue
      • 13.3.3 Tianshui Huatian Technology IC Packaging and Testing Introduction
      • 13.3.4 Tianshui Huatian Technology Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.3.5 Tianshui Huatian Technology Recent Development
    • 13.4 Tongfu Microelectronics
      • 13.4.1 Tongfu Microelectronics Company Details
      • 13.4.2 Tongfu Microelectronics Business Overview and Its Total Revenue
      • 13.4.3 Tongfu Microelectronics IC Packaging and Testing Introduction
      • 13.4.4 Tongfu Microelectronics Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.4.5 Tongfu Microelectronics Recent Development
    • 13.5 ASE
      • 13.5.1 ASE Company Details
      • 13.5.2 ASE Business Overview and Its Total Revenue
      • 13.5.3 ASE IC Packaging and Testing Introduction
      • 13.5.4 ASE Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.5.5 ASE Recent Development
    • 13.6 PTI
      • 13.6.1 PTI Company Details
      • 13.6.2 PTI Business Overview and Its Total Revenue
      • 13.6.3 PTI IC Packaging and Testing Introduction
      • 13.6.4 PTI Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.6.5 PTI Recent Development
    • 13.7 CoF
      • 13.7.1 CoF Company Details
      • 13.7.2 CoF Business Overview and Its Total Revenue
      • 13.7.3 CoF IC Packaging and Testing Introduction
      • 13.7.4 CoF Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.7.5 CoF Recent Development
    • 13.8 Chipbond
      • 13.8.1 Chipbond Company Details
      • 13.8.2 Chipbond Business Overview and Its Total Revenue
      • 13.8.3 Chipbond IC Packaging and Testing Introduction
      • 13.8.4 Chipbond Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.8.5 Chipbond Recent Development
    • 13.9 Nanium S.A
      • 13.9.1 Nanium S.A Company Details
      • 13.9.2 Nanium S.A Business Overview and Its Total Revenue
      • 13.9.3 Nanium S.A IC Packaging and Testing Introduction
      • 13.9.4 Nanium S.A Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.9.5 Nanium S.A Recent Development
    • 13.10 Unisem
      • 13.10.1 Unisem Company Details
      • 13.10.2 Unisem Business Overview and Its Total Revenue
      • 13.10.3 Unisem IC Packaging and Testing Introduction
      • 13.10.4 Unisem Revenue in IC Packaging and Testing Business (2015-2020)
      • 13.10.5 Unisem Recent Development
    • 13.11 Asus
      • 10.11.1 Asus Company Details
      • 10.11.2 Asus Business Overview and Its Total Revenue
      • 10.11.3 Asus IC Packaging and Testing Introduction
      • 10.11.4 Asus Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.11.5 Asus Recent Development
    • 13.12 Greatek Electronics
      • 10.12.1 Greatek Electronics Company Details
      • 10.12.2 Greatek Electronics Business Overview and Its Total Revenue
      • 10.12.3 Greatek Electronics IC Packaging and Testing Introduction
      • 10.12.4 Greatek Electronics Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.12.5 Greatek Electronics Recent Development
    • 13.13 Hana Microelectronics
      • 10.13.1 Hana Microelectronics Company Details
      • 10.13.2 Hana Microelectronics Business Overview and Its Total Revenue
      • 10.13.3 Hana Microelectronics IC Packaging and Testing Introduction
      • 10.13.4 Hana Microelectronics Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.13.5 Hana Microelectronics Recent Development
    • 13.14 HANA Micron
      • 10.14.1 HANA Micron Company Details
      • 10.14.2 HANA Micron Business Overview and Its Total Revenue
      • 10.14.3 HANA Micron IC Packaging and Testing Introduction
      • 10.14.4 HANA Micron Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.14.5 HANA Micron Recent Development
    • 13.15 Integra Technologies
      • 10.15.1 Integra Technologies Company Details
      • 10.15.2 Integra Technologies Business Overview and Its Total Revenue
      • 10.15.3 Integra Technologies IC Packaging and Testing Introduction
      • 10.15.4 Integra Technologies Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.15.5 Integra Technologies Recent Development
    • 13.16 Interconnect Systems
      • 10.16.1 Interconnect Systems Company Details
      • 10.16.2 Interconnect Systems Business Overview and Its Total Revenue
      • 10.16.3 Interconnect Systems IC Packaging and Testing Introduction
      • 10.16.4 Interconnect Systems Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.16.5 Interconnect Systems Recent Development
    • 13.17 Palomar Technologies
      • 10.17.1 Palomar Technologies Company Details
      • 10.17.2 Palomar Technologies Business Overview and Its Total Revenue
      • 10.17.3 Palomar Technologies IC Packaging and Testing Introduction
      • 10.17.4 Palomar Technologies Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.17.5 Palomar Technologies Recent Development
    • 13.18 Shinko Electric
      • 10.18.1 Shinko Electric Company Details
      • 10.18.2 Shinko Electric Business Overview and Its Total Revenue
      • 10.18.3 Shinko Electric IC Packaging and Testing Introduction
      • 10.18.4 Shinko Electric Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.18.5 Shinko Electric Recent Development
    • 13.19 Signetics
      • 10.19.1 Signetics Company Details
      • 10.19.2 Signetics Business Overview and Its Total Revenue
      • 10.19.3 Signetics IC Packaging and Testing Introduction
      • 10.19.4 Signetics Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.19.5 Signetics Recent Development
    • 13.20 Sigurd Microelectronics
      • 10.20.1 Sigurd Microelectronics Company Details
      • 10.20.2 Sigurd Microelectronics Business Overview and Its Total Revenue
      • 10.20.3 Sigurd Microelectronics IC Packaging and Testing Introduction
      • 10.20.4 Sigurd Microelectronics Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.20.5 Sigurd Microelectronics Recent Development
    • 13.21 SPiL
      • 10.21.1 SPiL Company Details
      • 10.21.2 SPiL Business Overview and Its Total Revenue
      • 10.21.3 SPiL IC Packaging and Testing Introduction
      • 10.21.4 SPiL Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.21.5 SPiL Recent Development
    • 13.22 SPEL Semiconductor
      • 10.22.1 SPEL Semiconductor Company Details
      • 10.22.2 SPEL Semiconductor Business Overview and Its Total Revenue
      • 10.22.3 SPEL Semiconductor IC Packaging and Testing Introduction
      • 10.22.4 SPEL Semiconductor Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.22.5 SPEL Semiconductor Recent Development
    • 13.23 Tera Probe
      • 10.23.1 Tera Probe Company Details
      • 10.23.2 Tera Probe Business Overview and Its Total Revenue
      • 10.23.3 Tera Probe IC Packaging and Testing Introduction
      • 10.23.4 Tera Probe Revenue in IC Packaging and Testing Business (2015-2020)
      • 10.23.5 Tera Probe Recent Development

    14 Analyst's Viewpoints/Conclusions

      15 Appendix

      • 15.1 Research Methodology
        • 15.1.1 Methodology/Research Approach
        • 15.1.2 Data Source
      • 15.2 Disclaimer

      This report focuses on the global IC Packaging and Testing status, future forecast, growth opportunity, key market and key players. The study objectives are to present the IC Packaging and Testing development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.

      The key players covered in this study
      Amkor
      JCET
      Tianshui Huatian Technology
      Tongfu Microelectronics
      ASE
      PTI
      CoF
      Chipbond
      Nanium S.A
      Unisem
      Asus
      Greatek Electronics
      Hana Microelectronics
      HANA Micron
      Integra Technologies
      Interconnect Systems
      Palomar Technologies
      Shinko Electric
      Signetics
      Sigurd Microelectronics
      SPiL
      SPEL Semiconductor
      Tera Probe

      Market segment by Type, the product can be split into
      Wire Bonding
      Flip Chip
      Straight Through Silicon Perforation
      Other
      Market segment by Application, split into
      Electronics Industry
      Medical
      Automobiles
      Others

      Market segment by Regions/Countries, this report covers
      North America
      Europe
      China
      Japan
      Southeast Asia
      India
      Central & South America

      The study objectives of this report are:
      To analyze global IC Packaging and Testing status, future forecast, growth opportunity, key market and key players.
      To present the IC Packaging and Testing development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
      To strategically profile the key players and comprehensively analyze their development plan and strategies.
      To define, describe and forecast the market by type, market and key regions.

      In this study, the years considered to estimate the market size of IC Packaging and Testing are as follows:
      History Year: 2015-2019
      Base Year: 2019
      Estimated Year: 2020
      Forecast Year 2020 to 2026
      For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
      Buy now