IC Package Substrates Market Report – Research, Industry Analysis Reports and Market Demands

Global IC Package Substrates Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

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Table of Content

1 Market Overview

1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
- 1.3.1 Overview: Global IC Package Substrates Consumption Value by Type: 2019 Versus 2023 Versus 2030
- 1.3.2 FC-BGA
- 1.3.3 FC-CSP
- 1.3.4 WB BGA
- 1.3.5 WB CSP
- 1.3.6 RF Module
- 1.3.7 Others
1.4 Market Analysis by Application
- 1.4.1 Overview: Global IC Package Substrates Consumption Value by Application: 2019 Versus 2023 Versus 2030
- 1.4.2 Smart Phone
- 1.4.3 PC (tablet and Laptop)
- 1.4.4 Wearable Device
- 1.4.5 Others
1.5 Global IC Package Substrates Market Size & Forecast
- 1.5.1 Global IC Package Substrates Consumption Value (2019 & 2023 & 2030)
- 1.5.2 Global IC Package Substrates Sales Quantity (2019-2030)
- 1.5.3 Global IC Package Substrates Average Price (2019-2030)

2 Manufacturers Profiles

3 Competitive Environment: IC Package Substrates by Manufacturer

3.1 Global IC Package Substrates Sales Quantity by Manufacturer (2019-2024)
3.2 Global IC Package Substrates Revenue by Manufacturer (2019-2024)
3.3 Global IC Package Substrates Average Price by Manufacturer (2019-2024)
3.4 Market Share Analysis (2023)
- 3.4.1 Producer Shipments of IC Package Substrates by Manufacturer Revenue ($MM) and Market Share (%): 2023
- 3.4.2 Top 3 IC Package Substrates Manufacturer Market Share in 2023
- 3.4.3 Top 6 IC Package Substrates Manufacturer Market Share in 2023
3.5 IC Package Substrates Market: Overall Company Footprint Analysis
- 3.5.1 IC Package Substrates Market: Region Footprint
- 3.5.2 IC Package Substrates Market: Company Product Type Footprint
- 3.5.3 IC Package Substrates Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

4.1 Global IC Package Substrates Market Size by Region
- 4.1.1 Global IC Package Substrates Sales Quantity by Region (2019-2030)
- 4.1.2 Global IC Package Substrates Consumption Value by Region (2019-2030)
- 4.1.3 Global IC Package Substrates Average Price by Region (2019-2030)
4.2 North America IC Package Substrates Consumption Value (2019-2030)
4.3 Europe IC Package Substrates Consumption Value (2019-2030)
4.4 Asia-Pacific IC Package Substrates Consumption Value (2019-2030)
4.5 South America IC Package Substrates Consumption Value (2019-2030)
4.6 Middle East & Africa IC Package Substrates Consumption Value (2019-2030)

5 Market Segment by Type

5.1 Global IC Package Substrates Sales Quantity by Type (2019-2030)
5.2 Global IC Package Substrates Consumption Value by Type (2019-2030)
5.3 Global IC Package Substrates Average Price by Type (2019-2030)

6 Market Segment by Application

6.1 Global IC Package Substrates Sales Quantity by Application (2019-2030)
6.2 Global IC Package Substrates Consumption Value by Application (2019-2030)
6.3 Global IC Package Substrates Average Price by Application (2019-2030)

7 North America

7.1 North America IC Package Substrates Sales Quantity by Type (2019-2030)
7.2 North America IC Package Substrates Sales Quantity by Application (2019-2030)
7.3 North America IC Package Substrates Market Size by Country
- 7.3.1 North America IC Package Substrates Sales Quantity by Country (2019-2030)
- 7.3.2 North America IC Package Substrates Consumption Value by Country (2019-2030)
- 7.3.3 United States Market Size and Forecast (2019-2030)
- 7.3.4 Canada Market Size and Forecast (2019-2030)
- 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

8.1 Europe IC Package Substrates Sales Quantity by Type (2019-2030)
8.2 Europe IC Package Substrates Sales Quantity by Application (2019-2030)
8.3 Europe IC Package Substrates Market Size by Country
- 8.3.1 Europe IC Package Substrates Sales Quantity by Country (2019-2030)
- 8.3.2 Europe IC Package Substrates Consumption Value by Country (2019-2030)
- 8.3.3 Germany Market Size and Forecast (2019-2030)
- 8.3.4 France Market Size and Forecast (2019-2030)
- 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
- 8.3.6 Russia Market Size and Forecast (2019-2030)
- 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

9.1 Asia-Pacific IC Package Substrates Sales Quantity by Type (2019-2030)
9.2 Asia-Pacific IC Package Substrates Sales Quantity by Application (2019-2030)
9.3 Asia-Pacific IC Package Substrates Market Size by Region
- 9.3.1 Asia-Pacific IC Package Substrates Sales Quantity by Region (2019-2030)
- 9.3.2 Asia-Pacific IC Package Substrates Consumption Value by Region (2019-2030)
- 9.3.3 China Market Size and Forecast (2019-2030)
- 9.3.4 Japan Market Size and Forecast (2019-2030)
- 9.3.5 South Korea Market Size and Forecast (2019-2030)
- 9.3.6 India Market Size and Forecast (2019-2030)
- 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
- 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

10.1 South America IC Package Substrates Sales Quantity by Type (2019-2030)
10.2 South America IC Package Substrates Sales Quantity by Application (2019-2030)
10.3 South America IC Package Substrates Market Size by Country
- 10.3.1 South America IC Package Substrates Sales Quantity by Country (2019-2030)
- 10.3.2 South America IC Package Substrates Consumption Value by Country (2019-2030)
- 10.3.3 Brazil Market Size and Forecast (2019-2030)
- 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

11.1 Middle East & Africa IC Package Substrates Sales Quantity by Type (2019-2030)
11.2 Middle East & Africa IC Package Substrates Sales Quantity by Application (2019-2030)
11.3 Middle East & Africa IC Package Substrates Market Size by Country
- 11.3.1 Middle East & Africa IC Package Substrates Sales Quantity by Country (2019-2030)
- 11.3.2 Middle East & Africa IC Package Substrates Consumption Value by Country (2019-2030)
- 11.3.3 Turkey Market Size and Forecast (2019-2030)
- 11.3.4 Egypt Market Size and Forecast (2019-2030)
- 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
- 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

12.1 IC Package Substrates Market Drivers
12.2 IC Package Substrates Market Restraints
12.3 IC Package Substrates Trends Analysis
12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

13.1 Raw Material of IC Package Substrates and Key Manufacturers
13.2 Manufacturing Costs Percentage of IC Package Substrates
13.3 IC Package Substrates Production Process
13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
14.2 IC Package Substrates Typical Distributors
14.3 IC Package Substrates Typical Customers

15 Research Findings and Conclusion

16 Appendix

16.1 Methodology
16.2 Research Process and Data Source

Description

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
According to our (Global Info Research) latest study, the global IC Package Substrates market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.
The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.
This report is a detailed and comprehensive analysis for global IC Package Substrates market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global IC Package Substrates market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2019-2030
Global IC Package Substrates market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2019-2030
Global IC Package Substrates market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2019-2030
Global IC Package Substrates market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IC Package Substrates
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IC Package Substrates market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
IC Package Substrates market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others
Market segment by Application
Smart Phone
PC (tablet and Laptop)
Wearable Device
Others
Major players covered
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Simmtech
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
Suntak Technology
National Center for Advanced Packaging (NCAP China)
Huizhou China Eagle Electronic Technology
DSBJ
Shenzhen Kinwong Electronic
AKM Meadville
Victory Giant Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC Package Substrates product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IC Package Substrates, with price, sales quantity, revenue, and global market share of IC Package Substrates from 2019 to 2024.
Chapter 3, the IC Package Substrates competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC Package Substrates breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and IC Package Substrates market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IC Package Substrates.
Chapter 14 and 15, to describe IC Package Substrates sales channel, distributors, customers, research findings and conclusion.

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