Summary

FPC, the full name is flexible printed circuit, flexible printed circuits are wiring materials formed into electric circuits mounted on ultrathin insulation film. Their light weight and excellent heat resistance and flexibility enable broader possibilities for electric circuit design, and with the current push to make all kinds of digital devices more compact and functional. FPC is also known as flexible circuit, flex circuits, and flexible PCB.

The global FPC market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:

Global market size and forecast

Regional market size, production data and export & import

Key manufacturers profile, products & services, sales data of business

Global market size by Major Application

Global market size by Major Type

Key manufacturers are included based on company profile, sales data and product specifications etc.:

Nippon Mektron

ZDT

Fujikura

SEI

Flexium

MFLEX

Interflex

CAREER

SIFLEX

Bhflex

Daeduck GDS

Multek

ICHIA

AKM

MFS

Hongxin

Topsun

KINWONG

Soft-Tech

JCD

Major applications as follows:

Consumer Electronics

Automotive

Aerospace & Defense/Military

Medical

Others

Major Type as follows:

Single-sided Circuit

Double-sided Circuit

Multi-layer Circuit

Rigid-Flex Circuit

Regional market size, production data and export & import:

Asia-Pacific

North America

Europe

South America

Middle East & Africa

Table of Contents
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 Nippon Mektron
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 ZDT
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 Fujikura
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 SEI
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Flexium
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 MFLEX
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Interflex
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 CAREER
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 SIFLEX
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 Bhflex
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 Daeduck GDS
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Multek
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 ICHIA
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.13.4 Recent Development
3.14 AKM
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.14.4 Recent Development
3.15 MFS
3.15.1 Company Information
3.15.2 Product & Services
3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.15.4 Recent Development
3.16 Hongxin
3.16.1 Company Information
3.16.2 Product & Services
3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.16.4 Recent Development
3.17 Topsun
3.17.1 Company Information
3.17.2 Product & Services
3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.17.4 Recent Development
3.18 KINWONG
3.18.1 Company Information
3.18.2 Product & Services
3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.18.4 Recent Development
3.19 Soft-Tech
3.19.1 Company Information
3.19.2 Product & Services
3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.20 JCD
3.20.1 Company Information
3.20.2 Product & Services
3.20.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Consumer Electronics
4.1.1 Overview
4.1.2 Consumer Electronics Market Size and Forecast
4.2 Automotive
4.2.1 Overview
4.2.2 Automotive Market Size and Forecast
4.3 Aerospace & Defense/Military
4.3.1 Overview
4.3.2 Aerospace & Defense/Military Market Size and Forecast
4.4 Medical
4.4.1 Overview
4.4.2 Medical Market Size and Forecast
4.5 Others
4.5.1 Overview
4.5.2 Others Market Size and Forecast
5 Market by Type
5.By Single-sided Circuit
5.1 Single-sided Circuit
5.1.1 Overview
5.1.2 Single-sided Circuit Market Size and Forecast
5.2 Double-sided Circuit
5.2.1 Overview
5.2.2 Double-sided Circuit Market Size and Forecast
5.3 Multi-layer Circuit
5.3.1 Overview
5.3.2 Multi-layer Circuit Market Size and Forecast
5.4 Rigid-Flex Circuit
5.4.1 Overview
5.4.2 Rigid-Flex Circuit Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion