Global (United States, European Union and China) Flip-Chip Market Research Report 2019-2025
Table of Contents
1 Report Overview
- 1.1 Research Scope
- 1.2 Major Manufacturers Covered in This Report
- 1.3 Market Segment by Type
- 1.3.1 Global Flip-Chip Market Size Growth Rate by Type (2019-2025)
- 1.3.2 Memory
- 1.3.3 High Brightness, Light-Emitting Diode (LED)
- 1.3.4 RF, Power and Analog ICs
- 1.3.5 Imaging
- 1.4 Market Segment by Application
- 1.4.1 Global Flip-Chip Market Share by Application (2019-2025)
- 1.4.2 Medical Devices
- 1.4.3 Industrial Applications
- 1.4.4 Automotive
- 1.4.5 GPUs and Chipsets
- 1.4.6 Smart Technologies
- 1.5 Study Objectives
- 1.6 Years Considered
2 Global Growth Trends
- 2.1 Production and Capacity Analysis
- 2.1.1 Global Flip-Chip Production Value 2014-2025
- 2.1.2 Global Flip-Chip Production 2014-2025
- 2.1.3 Global Flip-Chip Capacity 2014-2025
- 2.1.4 Global Flip-Chip Marketing Pricing and Trends
- 2.2 Key Producers Growth Rate (CAGR) 2019-2025
- 2.2.1 Global Flip-Chip Market Size CAGR of Key Regions
- 2.2.2 Global Flip-Chip Market Share of Key Regions
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
3 Market Share by Manufacturers
- 3.1 Capacity and Production by Manufacturers
- 3.1.1 Global Flip-Chip Capacity by Manufacturers
- 3.1.2 Global Flip-Chip Production by Manufacturers
- 3.2 Revenue by Manufacturers
- 3.2.1 Flip-Chip Revenue by Manufacturers (2014-2019)
- 3.2.2 Flip-Chip Revenue Share by Manufacturers (2014-2019)
- 3.2.3 Global Flip-Chip Market Concentration Ratio (CR5 and HHI)
- 3.3 Flip-Chip Price by Manufacturers
- 3.4 Key Manufacturers Flip-Chip Plants/Factories Distribution and Area Served
- 3.5 Date of Key Manufacturers Enter into Flip-Chip Market
- 3.6 Key Manufacturers Flip-Chip Product Offered
- 3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
- 4.1 Production and Production Value for Each Type
- 4.1.1 Memory Production and Production Value (2014-2019)
- 4.1.2 High Brightness, Light-Emitting Diode (LED) Production and Production Value (2014-2019)
- 4.1.3 RF, Power and Analog ICs Production and Production Value (2014-2019)
- 4.1.4 Imaging Production and Production Value (2014-2019)
- 4.2 Global Flip-Chip Production Market Share by Type
- 4.3 Global Flip-Chip Production Value Market Share by Type
- 4.4 Flip-Chip Ex-factory Price by Type
5 Market Size by Application
- 5.1 Overview
- 5.2 Global Flip-Chip Consumption by Application
6 Production by Regions
- 6.1 Global Flip-Chip Production (History Data) by Regions 2014-2019
- 6.2 Global Flip-Chip Production Value (History Data) by Regions
- 6.3 United States
- 6.3.1 United States Flip-Chip Production Growth Rate 2014-2019
- 6.3.2 United States Flip-Chip Production Value Growth Rate 2014-2019
- 6.3.3 Key Players in United States
- 6.3.4 United States Flip-Chip Import & Export
- 6.4 European Union
- 6.4.1 European Union Flip-Chip Production Growth Rate 2014-2019
- 6.4.2 European Union Flip-Chip Production Value Growth Rate 2014-2019
- 6.4.3 Key Players in European Union
- 6.4.4 European Union Flip-Chip Import & Export
- 6.5 China
- 6.5.1 China Flip-Chip Production Growth Rate 2014-2019
- 6.5.2 China Flip-Chip Production Value Growth Rate 2014-2019
- 6.5.3 Key Players in China
- 6.5.4 China Flip-Chip Import & Export
- 6.6 Rest of World
- 6.6.1 Japan
- 6.6.2 Korea
- 6.6.3 India
- 6.6.4 Southeast Asia
7 Flip-Chip Consumption by Regions
- 7.1 Global Flip-Chip Consumption (History Data) by Regions
- 7.2 United States
- 7.2.1 United States Flip-Chip Consumption by Type
- 7.2.2 United States Flip-Chip Consumption by Application
- 7.3 European Union
- 7.3.1 European Union Flip-Chip Consumption by Type
- 7.3.2 European Union Flip-Chip Consumption by Application
- 7.4 China
- 7.4.1 China Flip-Chip Consumption by Type
- 7.4.2 China Flip-Chip Consumption by Application
- 7.5 Rest of World
- 7.5.1 Rest of World Flip-Chip Consumption by Type
- 7.5.2 Rest of World Flip-Chip Consumption by Application
- 7.5.1 Japan
- 7.5.2 Korea
- 7.5.3 India
- 7.5.4 Southeast Asia
8 Company Profiles
- 8.1 ASE Group
- 8.1.1 ASE Group Company Details
- 8.1.2 Company Description and Business Overview
- 8.1.3 Production and Revenue of Flip-Chip
- 8.1.4 Flip-Chip Product Introduction
- 8.1.5 ASE Group Recent Development
- 8.2 Amkor
- 8.2.1 Amkor Company Details
- 8.2.2 Company Description and Business Overview
- 8.2.3 Production and Revenue of Flip-Chip
- 8.2.4 Flip-Chip Product Introduction
- 8.2.5 Amkor Recent Development
- 8.3 Intel Corporation
- 8.3.1 Intel Corporation Company Details
- 8.3.2 Company Description and Business Overview
- 8.3.3 Production and Revenue of Flip-Chip
- 8.3.4 Flip-Chip Product Introduction
- 8.3.5 Intel Corporation Recent Development
- 8.4 Powertech Technology
- 8.4.1 Powertech Technology Company Details
- 8.4.2 Company Description and Business Overview
- 8.4.3 Production and Revenue of Flip-Chip
- 8.4.4 Flip-Chip Product Introduction
- 8.4.5 Powertech Technology Recent Development
- 8.5 STATS ChipPAC
- 8.5.1 STATS ChipPAC Company Details
- 8.5.2 Company Description and Business Overview
- 8.5.3 Production and Revenue of Flip-Chip
- 8.5.4 Flip-Chip Product Introduction
- 8.5.5 STATS ChipPAC Recent Development
- 8.6 Samsung Group
- 8.6.1 Samsung Group Company Details
- 8.6.2 Company Description and Business Overview
- 8.6.3 Production and Revenue of Flip-Chip
- 8.6.4 Flip-Chip Product Introduction
- 8.6.5 Samsung Group Recent Development
- 8.7 Taiwan Semiconductor Manufacturing
- 8.7.1 Taiwan Semiconductor Manufacturing Company Details
- 8.7.2 Company Description and Business Overview
- 8.7.3 Production and Revenue of Flip-Chip
- 8.7.4 Flip-Chip Product Introduction
- 8.7.5 Taiwan Semiconductor Manufacturing Recent Development
- 8.8 United Microelectronics
- 8.8.1 United Microelectronics Company Details
- 8.8.2 Company Description and Business Overview
- 8.8.3 Production and Revenue of Flip-Chip
- 8.8.4 Flip-Chip Product Introduction
- 8.8.5 United Microelectronics Recent Development
- 8.9 Global Foundries
- 8.9.1 Global Foundries Company Details
- 8.9.2 Company Description and Business Overview
- 8.9.3 Production and Revenue of Flip-Chip
- 8.9.4 Flip-Chip Product Introduction
- 8.9.5 Global Foundries Recent Development
- 8.10 STMicroelectronics
- 8.10.1 STMicroelectronics Company Details
- 8.10.2 Company Description and Business Overview
- 8.10.3 Production and Revenue of Flip-Chip
- 8.10.4 Flip-Chip Product Introduction
- 8.10.5 STMicroelectronics Recent Development
- 8.11 Flip Chip International
- 8.12 Palomar Technologies
- 8.13 Nepes
- 8.14 Texas Instruments
9 Market Forecast
- 9.1 Global Market Size Forecast
- 9.1.1 Global Flip-Chip Capacity, Production Forecast 2019-2025
- 9.1.2 Global Flip-Chip Production Value Forecast 2019-2025
- 9.2 Market Forecast by Regions
- 9.2.1 Global Flip-Chip Production and Value Forecast by Regions 2019-2025
- 9.2.2 Global Flip-Chip Consumption Forecast by Regions 2019-2025
- 9.3 United States
- 9.3.1 Production and Value Forecast in United States
- 9.3.2 Consumption Forecast in United States
- 9.4 European Union
- 9.4.1 Production and Value Forecast in European Union
- 9.4.2 Consumption Forecast in European Union
- 9.5 China
- 9.5.1 Production and Value Forecast in China
- 9.5.2 Consumption Forecast in China
- 9.6 Rest of World
- 9.6.1 Japan
- 9.6.2 Korea
- 9.6.3 India
- 9.6.4 Southeast Asia
- 9.7 Forecast by Type
- 9.7.1 Global Flip-Chip Production Forecast by Type
- 9.7.2 Global Flip-Chip Production Value Forecast by Type
- 9.8 Consumption Forecast by Application
10 Value Chain and Sales Channels Analysis
- 10.1 Value Chain Analysis
- 10.2 Sales Channels Analysis
- 10.2.1 Flip-Chip Sales Channels
- 10.2.2 Flip-Chip Distributors
- 10.3 Flip-Chip Customers
11 Opportunities & Challenges, Threat and Affecting Factors
- 11.1 Market Opportunities
- 11.2 Market Challenges
- 11.3 Porter's Five Forces Analysis
12 Key Findings
13 Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.1.1 Research Programs/Design
- 13.1.1.2 Market Size Estimation
- 13.1.1.3 Market Breakdown and Data Triangulation
- 13.1.2 Data Source
- 13.1.2.1 Secondary Sources
- 13.1.2.2 Primary Sources
- 13.1.1 Methodology/Research Approach
- 13.2 Author Details
Flip chip, also known as controlled collapse chip connection or its abbreviation.
The APAC held a large share of the overall flip chip technology market in 2017; moreover, the market in APAC is expected to grow at the highest CAGR between 2017 and 2023. Countries in Asia-Pacific are major manufacturing hubs and are expected to provide ample opportunities for the growth of the flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.
In 2019, the market size of Flip-Chip is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Flip-Chip.
This report studies the global market size of Flip-Chip, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Flip-Chip production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
ASE Group
Amkor
Intel Corporation
Powertech Technology
STATS ChipPAC
Samsung Group
Taiwan Semiconductor Manufacturing
United Microelectronics
Global Foundries
STMicroelectronics
Flip Chip International
Palomar Technologies
Nepes
Texas Instruments
Market Segment by Product Type
Memory
High Brightness, Light-Emitting Diode (LED)
RF, Power and Analog ICs
Imaging
Market Segment by Application
Medical Devices
Industrial Applications
Automotive
GPUs and Chipsets
Smart Technologies
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Flip-Chip status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Flip-Chip manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Flip-Chip are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025