Copyright Reports & Markets. All rights reserved.

Global Flip Chip Bonder Growth Potential 2019

Request for Sample of this report
Buy now

Table of Contents

    1 Flip Chip Bonder Market Overview 1

    • 1.1 Product Overview and Scope of Flip Chip Bonder 1
    • 1.2 Flip Chip Bonder Segment by Types 2
      • 1.2.1 Global Flip Chip Bonder Sales Comparison by Types (2014-2025) 2
      • 1.2.2 Fully Automatic 3
      • 1.2.3 Semi-Automatic 4
    • 1.3 Flip Chip Bonder Segment by Applications 4
      • 1.3.1 Global Flip Chip Bonder Sales Comparison by Applications (2014-2025) 5
      • 1.3.2 IDMs 6
      • 1.3.3 OSAT 7
    • 1.4 Global Flip Chip Bonder Market by Regions 7
      • 1.4.1 Global Flip Chip Bonder Market Size by Regions 7
      • 1.4.2 North America Flip Chip Bonder Status and Prospect (2014-2025) 8
      • 1.4.3 Europe Flip Chip Bonder Status and Prospect (2014-2025) 9
      • 1.4.4 China Flip Chip Bonder Status and Prospect (2014-2025) 10
      • 1.4.5 Japan Flip Chip Bonder Status and Prospect (2014-2025) 11
    • 1.5 Global Flip Chip Bonder Market Size 12
      • 1.5.1 Global Flip Chip Bonder Revenue (2014-2025) 12
      • 1.5.2 Global Flip Chip Bonder Sales (2014-2025) 13

    2 Global Flip Chip Bonder Market Competition by Manufacturers/Brand 15

    • 2.1 Global Flip Chip Bonder Sales (Units) and Share by Manufacturers (2014-2019) 15
    • 2.2 Global Flip Chip Bonder Revenue (Million USD) and Share by Manufacturers (2014-2019) 17
    • 2.3 Global Flip Chip Bonder Average Price (K USD/Unit) by Manufacturers (2014-2019) 19
    • 2.4 Manufacturers Flip Chip Bonder Manufacturing Sites, Area Served, Product Types 20
    • 2.5 Flip Chip Bonder Market Competitive Situation and Trends 22
      • 2.5.1 Flip Chip Bonder Market Concentration Rate 22
      • 2.5.2 Flip Chip Bonder Market Share (%) of Top 3 and Top 5 Manufacturers 24
      • 2.5.3 Mergers & Acquisitions, Expansion 25

    3 Global Flip Chip Bonder Sales (Units), Revenue (Million USD) by Regions (2014-2019) 26

    • 3.1 Global Flip Chip Bonder Sales (Units) and Market Share (%) by Regions (2014-2019) 26
    • 3.2 Global Flip Chip Bonder Revenue (Million USD) and Market Share (%) by Regions (2014-2019) 28
    • 3.3 Global Flip Chip Bonder Sales (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2014-2019) 30
    • 3.4 North America Flip Chip Bonder Sales (Units), Revenue (Million USD), Price (K USD/Unit) (2014-2019) 30
    • 3.5 Europe Flip Chip Bonder Sales (Units), Revenue (Million USD), Price (K USD/Unit) (2014-2019) 31
    • 3.6 China Flip Chip Bonder Sales (Units), Revenue (Million USD), Price (K USD/Unit) (2014-2019) 31
    • 3.7 Japan Flip Chip Bonder Sales (Units), Revenue (Million USD), Price (K USD/Unit) (2014-2019) 31

    4 Global Flip Chip Bonder Sales, Revenue, Price Trend by Types 32

    • 4.1 Global Flip Chip Bonder Sales (Units) and Market Share (%) by Types (2014-2019) 32
    • 4.2 Global Flip Chip Bonder Revenue and Market Share (%) by Types (2014-2019) 34
    • 4.3 Global Flip Chip Bonder Price (K USD/Unit) by Type (2014-2019) 36
    • 4.4 Global Flip Chip Bonder Sales Growth by Type (2014-2019) 37

    5 Global Flip Chip Bonder Market Analysis by Applications 38

    • 5.1 Global Flip Chip Bonder Sales (Units) and Market Share (%) by Applications (2014-2019) 38
    • 5.2 Global Flip Chip Bonder Sales Growth Rate (%) by Applications (2014-2019) 41

    6 Company Profiles and Key Figures in Flip Chip Bonder Business 42

    • 6.1 BESI 42
      • 6.1.1 BESI Flip Chip Bonder Business Overview 42
      • 6.1.2 BESI Flip Chip Bonder Product Introduction 44
      • 6.1.3 BESI Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 45
      • 6.1.4 BESI Main Business Overview 46
    • 6.2 ASMPT 47
      • 6.2.1 ASMPT Flip Chip Bonder Business Overview 47
      • 6.2.2 ASMPT Flip Chip Bonder Product Introduction 48
      • 6.2.3 ASMPT Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 49
      • 6.2.4 ASMPT Main Business Overview 49
    • 6.3 Shibaura 50
      • 6.3.1 Shibaura Flip Chip Bonder Business Overview 50
      • 6.3.2 Shibaura Flip Chip Bonder Product Introduction 51
      • 6.3.3 Shibaura Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 52
      • 6.3.4 Shibaura Main Business Overview 52
    • 6.4 Muehlbauer 53
      • 6.4.1 Muehlbauer Flip Chip Bonder Business Overview 53
      • 6.4.2 Muehlbauer Flip Chip Bonder Product Introduction 54
      • 6.4.3 Muehlbauer Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 55
      • 6.4.4 Muehlbauer Main Business Overview 55
    • 6.5 K&S 56
      • 6.5.1 K&S Flip Chip Bonder Business Overview 56
      • 6.5.2 K&S Flip Chip Bonder Product Introduction 57
      • 6.5.3 K&S Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 58
      • 6.5.4 K&S Main Business Overview 59
    • 6.6 Hamni 59
      • 6.6.1 Hamni Flip Chip Bonder Business Overview 59
      • 6.6.2 Hamni Flip Chip Bonder Product Introduction 60
      • 6.6.3 Hamni Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 62
      • 6.6.4 Hamni Main Business Overview 62
    • 6.7 Amicra Germany 63
      • 6.7.1 Amicra Germany Flip Chip Bonder Business Overview 63
      • 6.7.2 Amicra Germany Flip Chip Bonder Product Introduction 64
      • 6.7.3 Amicra Germany Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 65
      • 6.7.4 Amicra Germany Main Business Overview 65
    • 6.8 SET 66
      • 6.8.1 SET Flip Chip Bonder Business Overview 66
      • 6.8.2 SET Flip Chip Bonder Product Introduction 67
      • 6.8.3 SET Flip Chip Bonder Sales, Revenue, Price and Gross Margin (2014-2019) 68
      • 6.8.4 SET Main Business Overview 69

    7 Flip Chip Bonder Manufacturing Cost Analysis 70

    • 7.1 Flip Chip Bonder Key Raw Materials Analysis 70
      • 7.1.1 Key Raw Materials 70
      • 7.1.2 Key Raw Materials Price Trend 70
      • 7.1.3 Key Suppliers of Raw Materials 73
    • 7.2 Proportion of Manufacturing Cost Structure 78
    • 7.3 Manufacturing Process Analysis of Flip Chip Bonder 79
    • 7.4 Flip Chip Bonder Industrial Chain Analysis 80

    8 Marketing Channel, Distributors and Customers 82

    • 8.1 Marketing Channel 82
    • 8.2 Flip Chip Bonder Distributors List 84
    • 8.3 Flip Chip Bonder Customers 86

    9 Market Dynamics 88

    • 9.1 Consumer Needs/Customer Preference Change 88
    • 9.2 Technology Progress/Risk 89
      • 9.2.1 Substitutes Threat 89
      • 9.2.2 Technology Progress in FC Technologies 91
      • 9.2.3 Technology Progress in Related Industry 93
    • 9.3 Economic/Political Environmental Change 93
    • 9.4 Porter's Five Forces Analysis 95

    10 Global Flip Chip Bonder Market Forecast (2019-2025) 96

    • 10.1 Global Flip Chip Bonder Sales (Units), Revenue (Million USD) Forecast (2019-2025) 96
      • 10.1.1 Global Flip Chip Bonder Sales (Units) and Growth Rate (%) Forecast (2019-2025) 96
      • 10.1.2 Global Flip Chip Bonder Revenue (Million USD) and Growth Rate (%) Forecast (2019-2025) 97
      • 10.1.3 Global Flip Chip Bonder Price and Trend Forecast (2019-2025) 98
    • 10.2 Global Flip Chip Bonder Sales (Units) and Revenue (Million USD) Forecast by Regions (2019-2025) 98
      • 10.2.1 North America Flip Chip Bonder Sales (Units) Forecast (2019-2025) 100
      • 10.2.2 Europe Flip Chip Bonder Sales (Units) Forecast (2019-2025) 101
      • 10.2.3 China Flip Chip Bonder Sales (Units) Forecast (2019-2025) 102
      • 10.2.4 Japan Flip Chip Bonder Sales (Units) Forecast (2019-2025) 103
    • 10.3 Global Flip Chip Bonder Sales (Units) Forecast by Type (2019-2025) 103
    • 10.4 Global Flip Chip Bonder Sales (Units) Forecast by Application (2019-2025) 104

    11 Research Findings and Conclusion 106

      12 Methodology and Data Source 108

      • 12.1 Methodology/Research Approach 108
        • 12.1.1 Research Programs/Design 108
        • 12.1.2 Market Size Estimation 109
        • 12.1.3 Market Breakdown and Data Triangulation 110
      • 12.2 Data Source 112
        • 12.2.1 Secondary Sources 112
        • 12.2.2 Primary Sources 113
      • 12.3 Author List 114
      • 12.4 Disclaimer 115

      This report studies the Flip Chip Bonder market. Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method. The Flip Chip Bonder market has witnessed significant growth in the past few years, and is expected to maintain this trend during the forecast period. The global Flip Chip Bonder market is expected to reach $563.57 million by 2025 from $276.18 million in 2019, growing at a CAGR of 12.62% from 2019 to 2025.

      This report focuses on Flip Chip Bonder volume and value at global level, regional level and company level. From a global perspective, this report represents overall Flip Chip Bonder market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

      At company level, this report focuses on the sales, ex-factory price, revenue and market share for each manufacturer covered in this report.

      The following manufacturers are covered:
      BESI
      ASMPT
      Shibaura
      Muehlbauer
      K&S
      Hamni
      Amicra Germany
      SET

      Segment by Regions
      North America
      Europe
      China
      Japan
      Rest of World

      Segment by Type
      Fully Automatic
      Semi-Automatic

      Segment by Application
      IDMs
      OSAT

      Buy now