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Global Electronic Board Level Underfill and Encapsulation Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

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1 Market Overview

  • 1.1 Product Overview and Scope of Electronic Board Level Underfill and Encapsulation Material
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Electronic Board Level Underfill and Encapsulation Material Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 No Flow Underfill
    • 1.3.3 Capillary Underfill
    • 1.3.4 Molded Underfill
    • 1.3.5 Wafer level Underfill
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Electronic Board Level Underfill and Encapsulation Material Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 Semiconductor Electronics Device
    • 1.4.3 Aviation & Aerospace
    • 1.4.4 Medical Devices
    • 1.4.5 Others
  • 1.5 Global Electronic Board Level Underfill and Encapsulation Material Market Size & Forecast
    • 1.5.1 Global Electronic Board Level Underfill and Encapsulation Material Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Electronic Board Level Underfill and Encapsulation Material Sales Quantity (2019-2030)
    • 1.5.3 Global Electronic Board Level Underfill and Encapsulation Material Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 Fuller
    • 2.1.1 Fuller Details
    • 2.1.2 Fuller Major Business
    • 2.1.3 Fuller Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.1.4 Fuller Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 Fuller Recent Developments/Updates
  • 2.2 Masterbond
    • 2.2.1 Masterbond Details
    • 2.2.2 Masterbond Major Business
    • 2.2.3 Masterbond Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.2.4 Masterbond Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 Masterbond Recent Developments/Updates
  • 2.3 Zymet
    • 2.3.1 Zymet Details
    • 2.3.2 Zymet Major Business
    • 2.3.3 Zymet Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.3.4 Zymet Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 Zymet Recent Developments/Updates
  • 2.4 Namics
    • 2.4.1 Namics Details
    • 2.4.2 Namics Major Business
    • 2.4.3 Namics Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.4.4 Namics Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 Namics Recent Developments/Updates
  • 2.5 Epoxy Technology
    • 2.5.1 Epoxy Technology Details
    • 2.5.2 Epoxy Technology Major Business
    • 2.5.3 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.5.4 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Epoxy Technology Recent Developments/Updates
  • 2.6 Yincae Advanced Materials
    • 2.6.1 Yincae Advanced Materials Details
    • 2.6.2 Yincae Advanced Materials Major Business
    • 2.6.3 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.6.4 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 Yincae Advanced Materials Recent Developments/Updates
  • 2.7 Henkel
    • 2.7.1 Henkel Details
    • 2.7.2 Henkel Major Business
    • 2.7.3 Henkel Electronic Board Level Underfill and Encapsulation Material Product and Services
    • 2.7.4 Henkel Electronic Board Level Underfill and Encapsulation Material Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 Henkel Recent Developments/Updates

3 Competitive Environment: Electronic Board Level Underfill and Encapsulation Material by Manufacturer

  • 3.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue by Manufacturer (2019-2024)
  • 3.3 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Electronic Board Level Underfill and Encapsulation Material by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Electronic Board Level Underfill and Encapsulation Material Manufacturer Market Share in 2023
    • 3.4.2 Top 6 Electronic Board Level Underfill and Encapsulation Material Manufacturer Market Share in 2023
  • 3.5 Electronic Board Level Underfill and Encapsulation Material Market: Overall Company Footprint Analysis
    • 3.5.1 Electronic Board Level Underfill and Encapsulation Material Market: Region Footprint
    • 3.5.2 Electronic Board Level Underfill and Encapsulation Material Market: Company Product Type Footprint
    • 3.5.3 Electronic Board Level Underfill and Encapsulation Material Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size by Region
    • 4.1.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Electronic Board Level Underfill and Encapsulation Material Consumption Value by Region (2019-2030)
    • 4.1.3 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Region (2019-2030)
  • 4.2 North America Electronic Board Level Underfill and Encapsulation Material Consumption Value (2019-2030)
  • 4.3 Europe Electronic Board Level Underfill and Encapsulation Material Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Consumption Value (2019-2030)
  • 4.5 South America Electronic Board Level Underfill and Encapsulation Material Consumption Value (2019-2030)
  • 4.6 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Type (2019-2030)
  • 5.2 Global Electronic Board Level Underfill and Encapsulation Material Consumption Value by Type (2019-2030)
  • 5.3 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Application (2019-2030)
  • 6.2 Global Electronic Board Level Underfill and Encapsulation Material Consumption Value by Application (2019-2030)
  • 6.3 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Type (2019-2030)
  • 7.2 North America Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Application (2019-2030)
  • 7.3 North America Electronic Board Level Underfill and Encapsulation Material Market Size by Country
    • 7.3.1 North America Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Electronic Board Level Underfill and Encapsulation Material Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Type (2019-2030)
  • 8.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Application (2019-2030)
  • 8.3 Europe Electronic Board Level Underfill and Encapsulation Material Market Size by Country
    • 8.3.1 Europe Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Electronic Board Level Underfill and Encapsulation Material Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Market Size by Region
    • 9.3.1 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Type (2019-2030)
  • 10.2 South America Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Application (2019-2030)
  • 10.3 South America Electronic Board Level Underfill and Encapsulation Material Market Size by Country
    • 10.3.1 South America Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Electronic Board Level Underfill and Encapsulation Material Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market Size by Country
    • 11.3.1 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Electronic Board Level Underfill and Encapsulation Material Market Drivers
  • 12.2 Electronic Board Level Underfill and Encapsulation Material Market Restraints
  • 12.3 Electronic Board Level Underfill and Encapsulation Material Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Electronic Board Level Underfill and Encapsulation Material and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Electronic Board Level Underfill and Encapsulation Material
  • 13.3 Electronic Board Level Underfill and Encapsulation Material Production Process
  • 13.4 Electronic Board Level Underfill and Encapsulation Material Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Electronic Board Level Underfill and Encapsulation Material Typical Distributors
  • 14.3 Electronic Board Level Underfill and Encapsulation Material Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Electronic Board Level Underfill and Encapsulation Material market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
    Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
    The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
    The Global Info Research report includes an overview of the development of the Electronic Board Level Underfill and Encapsulation Material industry chain, the market status of Semiconductor Electronics Device (No Flow Underfill, Capillary Underfill), Aviation & Aerospace (No Flow Underfill, Capillary Underfill), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Electronic Board Level Underfill and Encapsulation Material.
    Regionally, the report analyzes the Electronic Board Level Underfill and Encapsulation Material markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Electronic Board Level Underfill and Encapsulation Material market, with robust domestic demand, supportive policies, and a strong manufacturing base.
    Key Features:
    The report presents comprehensive understanding of the Electronic Board Level Underfill and Encapsulation Material market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Electronic Board Level Underfill and Encapsulation Material industry.
    The report involves analyzing the market at a macro level:
    Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K MT), revenue generated, and market share of different by Type (e.g., No Flow Underfill, Capillary Underfill).
    Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Electronic Board Level Underfill and Encapsulation Material market.
    Regional Analysis: The report involves examining the Electronic Board Level Underfill and Encapsulation Material market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
    Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Electronic Board Level Underfill and Encapsulation Material market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
    The report also involves a more granular approach to Electronic Board Level Underfill and Encapsulation Material:
    Company Analysis: Report covers individual Electronic Board Level Underfill and Encapsulation Material manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
    Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Electronic Board Level Underfill and Encapsulation Material This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Semiconductor Electronics Device, Aviation & Aerospace).
    Technology Analysis: Report covers specific technologies relevant to Electronic Board Level Underfill and Encapsulation Material. It assesses the current state, advancements, and potential future developments in Electronic Board Level Underfill and Encapsulation Material areas.
    Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Electronic Board Level Underfill and Encapsulation Material market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
    Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
    Market Segmentation
    Electronic Board Level Underfill and Encapsulation Material market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
    Market segment by Type
    No Flow Underfill
    Capillary Underfill
    Molded Underfill
    Wafer level Underfill
    Market segment by Application
    Semiconductor Electronics Device
    Aviation & Aerospace
    Medical Devices
    Others
    Major players covered
    Fuller
    Masterbond
    Zymet
    Namics
    Epoxy Technology
    Yincae Advanced Materials
    Henkel
    Market segment by region, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Electronic Board Level Underfill and Encapsulation Material product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Electronic Board Level Underfill and Encapsulation Material, with price, sales, revenue and global market share of Electronic Board Level Underfill and Encapsulation Material from 2019 to 2024.
    Chapter 3, the Electronic Board Level Underfill and Encapsulation Material competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Electronic Board Level Underfill and Encapsulation Material breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
    Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Electronic Board Level Underfill and Encapsulation Material market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
    Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Electronic Board Level Underfill and Encapsulation Material.
    Chapter 14 and 15, to describe Electronic Board Level Underfill and Encapsulation Material sales channel, distributors, customers, research findings and conclusion.

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