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Global (United States, European Union and China) Electronic Board Level Underfill and Encapsulation Material Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 No Flow Underfill
      • 1.3.3 Capillary Underfill
      • 1.3.4 Molded Underfill
      • 1.3.5 Wafer level Underfill
    • 1.4 Market Segment by Application
      • 1.4.1 Global Electronic Board Level Underfill and Encapsulation Material Market Share by Application (2019-2025)
      • 1.4.2 Semiconductor Electronics Device
      • 1.4.3 Aviation & Aerospace
      • 1.4.4 Medical Devices
      • 1.4.5 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Electronic Board Level Underfill and Encapsulation Material Production Value 2014-2025
      • 2.1.2 Global Electronic Board Level Underfill and Encapsulation Material Production 2014-2025
      • 2.1.3 Global Electronic Board Level Underfill and Encapsulation Material Capacity 2014-2025
      • 2.1.4 Global Electronic Board Level Underfill and Encapsulation Material Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size CAGR of Key Regions
      • 2.2.2 Global Electronic Board Level Underfill and Encapsulation Material Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Electronic Board Level Underfill and Encapsulation Material Capacity by Manufacturers
      • 3.1.2 Global Electronic Board Level Underfill and Encapsulation Material Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Electronic Board Level Underfill and Encapsulation Material Revenue by Manufacturers (2014-2019)
      • 3.2.2 Electronic Board Level Underfill and Encapsulation Material Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Electronic Board Level Underfill and Encapsulation Material Market Concentration Ratio (CR5 and HHI)
    • 3.3 Electronic Board Level Underfill and Encapsulation Material Price by Manufacturers
    • 3.4 Key Manufacturers Electronic Board Level Underfill and Encapsulation Material Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Electronic Board Level Underfill and Encapsulation Material Market
    • 3.6 Key Manufacturers Electronic Board Level Underfill and Encapsulation Material Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 No Flow Underfill Production and Production Value (2014-2019)
      • 4.1.2 Capillary Underfill Production and Production Value (2014-2019)
      • 4.1.3 Molded Underfill Production and Production Value (2014-2019)
      • 4.1.4 Wafer level Underfill Production and Production Value (2014-2019)
    • 4.2 Global Electronic Board Level Underfill and Encapsulation Material Production Market Share by Type
    • 4.3 Global Electronic Board Level Underfill and Encapsulation Material Production Value Market Share by Type
    • 4.4 Electronic Board Level Underfill and Encapsulation Material Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Electronic Board Level Underfill and Encapsulation Material Consumption by Application

    6 Production by Regions

    • 6.1 Global Electronic Board Level Underfill and Encapsulation Material Production (History Data) by Regions 2014-2019
    • 6.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Electronic Board Level Underfill and Encapsulation Material Production Growth Rate 2014-2019
      • 6.3.2 United States Electronic Board Level Underfill and Encapsulation Material Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Electronic Board Level Underfill and Encapsulation Material Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Electronic Board Level Underfill and Encapsulation Material Production Growth Rate 2014-2019
      • 6.4.2 European Union Electronic Board Level Underfill and Encapsulation Material Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Electronic Board Level Underfill and Encapsulation Material Import & Export
    • 6.5 China
      • 6.5.1 China Electronic Board Level Underfill and Encapsulation Material Production Growth Rate 2014-2019
      • 6.5.2 China Electronic Board Level Underfill and Encapsulation Material Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Electronic Board Level Underfill and Encapsulation Material Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Electronic Board Level Underfill and Encapsulation Material Consumption by Regions

    • 7.1 Global Electronic Board Level Underfill and Encapsulation Material Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Electronic Board Level Underfill and Encapsulation Material Consumption by Type
      • 7.2.2 United States Electronic Board Level Underfill and Encapsulation Material Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Electronic Board Level Underfill and Encapsulation Material Consumption by Type
      • 7.3.2 European Union Electronic Board Level Underfill and Encapsulation Material Consumption by Application
    • 7.4 China
      • 7.4.1 China Electronic Board Level Underfill and Encapsulation Material Consumption by Type
      • 7.4.2 China Electronic Board Level Underfill and Encapsulation Material Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Electronic Board Level Underfill and Encapsulation Material Consumption by Type
      • 7.5.2 Rest of World Electronic Board Level Underfill and Encapsulation Material Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Fuller
      • 8.1.1 Fuller Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.1.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.1.5 Fuller Recent Development
    • 8.2 Masterbond
      • 8.2.1 Masterbond Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.2.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.2.5 Masterbond Recent Development
    • 8.3 Zymet
      • 8.3.1 Zymet Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.3.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.3.5 Zymet Recent Development
    • 8.4 Namics
      • 8.4.1 Namics Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.4.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.4.5 Namics Recent Development
    • 8.5 Epoxy Technology
      • 8.5.1 Epoxy Technology Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.5.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.5.5 Epoxy Technology Recent Development
    • 8.6 Yincae Advanced Materials
      • 8.6.1 Yincae Advanced Materials Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.6.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.6.5 Yincae Advanced Materials Recent Development
    • 8.7 Henkel
      • 8.7.1 Henkel Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Electronic Board Level Underfill and Encapsulation Material
      • 8.7.4 Electronic Board Level Underfill and Encapsulation Material Product Introduction
      • 8.7.5 Henkel Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Electronic Board Level Underfill and Encapsulation Material Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Electronic Board Level Underfill and Encapsulation Material Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Electronic Board Level Underfill and Encapsulation Material Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Electronic Board Level Underfill and Encapsulation Material Production Forecast by Type
      • 9.7.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Electronic Board Level Underfill and Encapsulation Material Sales Channels
      • 10.2.2 Electronic Board Level Underfill and Encapsulation Material Distributors
    • 10.3 Electronic Board Level Underfill and Encapsulation Material Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
      Use of Underfill and encapsulation material for Wafer level and flip chip Underfill is increasing due to accelerating demand of tablets and smart phones.
      Chip Underfill is the oldest type of Underfill and encapsulation material thus shares maximum share of the Electronic board level Underfill and encapsulation material market but due to high cost it is expected to be replaced by molded Underfill in future.
      In 2019, the market size of Electronic Board Level Underfill and Encapsulation Material is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Electronic Board Level Underfill and Encapsulation Material.

      This report studies the global market size of Electronic Board Level Underfill and Encapsulation Material, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Electronic Board Level Underfill and Encapsulation Material production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Fuller
      Masterbond
      Zymet
      Namics
      Epoxy Technology
      Yincae Advanced Materials
      Henkel
      ...

      Market Segment by Product Type
      No Flow Underfill
      Capillary Underfill
      Molded Underfill
      Wafer level Underfill

      Market Segment by Application
      Semiconductor Electronics Device
      Aviation & Aerospace
      Medical Devices
      Others

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Electronic Board Level Underfill and Encapsulation Material status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Electronic Board Level Underfill and Encapsulation Material manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Electronic Board Level Underfill and Encapsulation Material are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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