Global E-Chuck for Wafer Market Professional Survey Report 2019
Table of Contents
Executive Summary
1 Industry Overview of E-Chuck for Wafer
- 1.1 Definition of E-Chuck for Wafer
- 1.2 E-Chuck for Wafer Segment by Type
- 1.2.1 Global E-Chuck for Wafer Production Growth Rate Comparison by Types (2014-2025)
- 1.2.2 Coulomb Type E-Chuck for Wafer
- 1.2.3 Johnsen-Rahbek (JR) Type E-Chuck for Wafer
- 1.3 E-Chuck for Wafer Segment by Applications
- 1.3.1 Global E-Chuck for Wafer Consumption Comparison by Applications (2014-2025)
- 1.3.2 300 mm Wafer
- 1.3.3 200 mm Wafer
- 1.3.4 Others
- 1.4 Global E-Chuck for Wafer Overall Market
- 1.4.1 Global E-Chuck for Wafer Revenue (2014-2025)
- 1.4.2 Global E-Chuck for Wafer Production (2014-2025)
- 1.4.3 North America E-Chuck for Wafer Status and Prospect (2014-2025)
- 1.4.4 Europe E-Chuck for Wafer Status and Prospect (2014-2025)
- 1.4.5 China E-Chuck for Wafer Status and Prospect (2014-2025)
- 1.4.6 Japan E-Chuck for Wafer Status and Prospect (2014-2025)
- 1.4.7 Southeast Asia E-Chuck for Wafer Status and Prospect (2014-2025)
- 1.4.8 India E-Chuck for Wafer Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
- 2.1 Raw Material and Suppliers
- 2.2 Manufacturing Cost Structure Analysis of E-Chuck for Wafer
- 2.3 Manufacturing Process Analysis of E-Chuck for Wafer
- 2.4 Industry Chain Structure of E-Chuck for Wafer
3 Development and Manufacturing Plants Analysis of E-Chuck for Wafer
- 3.1 Capacity and Commercial Production Date
- 3.2 Global E-Chuck for Wafer Manufacturing Plants Distribution
- 3.3 Major Manufacturers Technology Source and Market Position of E-Chuck for Wafer
- 3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
- 4.1 E-Chuck for Wafer Production and Capacity Analysis
- 4.2 E-Chuck for Wafer Revenue Analysis
- 4.3 E-Chuck for Wafer Price Analysis
- 4.4 Market Concentration Degree
5 E-Chuck for Wafer Regional Market Analysis
- 5.1 E-Chuck for Wafer Production by Regions
- 5.1.1 Global E-Chuck for Wafer Production by Regions
- 5.1.2 Global E-Chuck for Wafer Revenue by Regions
- 5.2 E-Chuck for Wafer Consumption by Regions
- 5.3 North America E-Chuck for Wafer Market Analysis
- 5.3.1 North America E-Chuck for Wafer Production
- 5.3.2 North America E-Chuck for Wafer Revenue
- 5.3.3 Key Manufacturers in North America
- 5.3.4 North America E-Chuck for Wafer Import and Export
- 5.4 Europe E-Chuck for Wafer Market Analysis
- 5.4.1 Europe E-Chuck for Wafer Production
- 5.4.2 Europe E-Chuck for Wafer Revenue
- 5.4.3 Key Manufacturers in Europe
- 5.4.4 Europe E-Chuck for Wafer Import and Export
- 5.5 China E-Chuck for Wafer Market Analysis
- 5.5.1 China E-Chuck for Wafer Production
- 5.5.2 China E-Chuck for Wafer Revenue
- 5.5.3 Key Manufacturers in China
- 5.5.4 China E-Chuck for Wafer Import and Export
- 5.6 Japan E-Chuck for Wafer Market Analysis
- 5.6.1 Japan E-Chuck for Wafer Production
- 5.6.2 Japan E-Chuck for Wafer Revenue
- 5.6.3 Key Manufacturers in Japan
- 5.6.4 Japan E-Chuck for Wafer Import and Export
- 5.7 Southeast Asia E-Chuck for Wafer Market Analysis
- 5.7.1 Southeast Asia E-Chuck for Wafer Production
- 5.7.2 Southeast Asia E-Chuck for Wafer Revenue
- 5.7.3 Key Manufacturers in Southeast Asia
- 5.7.4 Southeast Asia E-Chuck for Wafer Import and Export
- 5.8 India E-Chuck for Wafer Market Analysis
- 5.8.1 India E-Chuck for Wafer Production
- 5.8.2 India E-Chuck for Wafer Revenue
- 5.8.3 Key Manufacturers in India
- 5.8.4 India E-Chuck for Wafer Import and Export
6 E-Chuck for Wafer Segment Market Analysis (by Type)
- 6.1 Global E-Chuck for Wafer Production by Type
- 6.2 Global E-Chuck for Wafer Revenue by Type
- 6.3 E-Chuck for Wafer Price by Type
7 E-Chuck for Wafer Segment Market Analysis (by Application)
- 7.1 Global E-Chuck for Wafer Consumption by Application
- 7.2 Global E-Chuck for Wafer Consumption Market Share by Application (2014-2019)
8 E-Chuck for Wafer Major Manufacturers Analysis
- 8.1 SHINKO
- 8.1.1 SHINKO E-Chuck for Wafer Production Sites and Area Served
- 8.1.2 SHINKO Product Introduction, Application and Specification
- 8.1.3 SHINKO E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.1.4 Main Business and Markets Served
- 8.2 TOTO
- 8.2.1 TOTO E-Chuck for Wafer Production Sites and Area Served
- 8.2.2 TOTO Product Introduction, Application and Specification
- 8.2.3 TOTO E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.2.4 Main Business and Markets Served
- 8.3 Creative Technology Corporation
- 8.3.1 Creative Technology Corporation E-Chuck for Wafer Production Sites and Area Served
- 8.3.2 Creative Technology Corporation Product Introduction, Application and Specification
- 8.3.3 Creative Technology Corporation E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.3.4 Main Business and Markets Served
- 8.4 Kyocera
- 8.4.1 Kyocera E-Chuck for Wafer Production Sites and Area Served
- 8.4.2 Kyocera Product Introduction, Application and Specification
- 8.4.3 Kyocera E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.4.4 Main Business and Markets Served
- 8.5 FM Industries
- 8.5.1 FM Industries E-Chuck for Wafer Production Sites and Area Served
- 8.5.2 FM Industries Product Introduction, Application and Specification
- 8.5.3 FM Industries E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.5.4 Main Business and Markets Served
- 8.6 NTK CERATEC
- 8.6.1 NTK CERATEC E-Chuck for Wafer Production Sites and Area Served
- 8.6.2 NTK CERATEC Product Introduction, Application and Specification
- 8.6.3 NTK CERATEC E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.6.4 Main Business and Markets Served
- 8.7 Tsukuba Seiko
- 8.7.1 Tsukuba Seiko E-Chuck for Wafer Production Sites and Area Served
- 8.7.2 Tsukuba Seiko Product Introduction, Application and Specification
- 8.7.3 Tsukuba Seiko E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.7.4 Main Business and Markets Served
- 8.8 Applied Materials
- 8.8.1 Applied Materials E-Chuck for Wafer Production Sites and Area Served
- 8.8.2 Applied Materials Product Introduction, Application and Specification
- 8.8.3 Applied Materials E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.8.4 Main Business and Markets Served
- 8.9 II-VI M Cubed
- 8.9.1 II-VI M Cubed E-Chuck for Wafer Production Sites and Area Served
- 8.9.2 II-VI M Cubed Product Introduction, Application and Specification
- 8.9.3 II-VI M Cubed E-Chuck for Wafer Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.9.4 Main Business and Markets Served
9 Development Trend of Analysis of E-Chuck for Wafer Market
- 9.1 Global E-Chuck for Wafer Market Trend Analysis
- 9.1.1 Global E-Chuck for Wafer Market Size (Volume and Value) Forecast 2019-2025
- 9.2 E-Chuck for Wafer Regional Market Trend
- 9.2.1 North America E-Chuck for Wafer Forecast 2019-2025
- 9.2.2 Europe E-Chuck for Wafer Forecast 2019-2025
- 9.2.3 China E-Chuck for Wafer Forecast 2019-2025
- 9.2.4 Japan E-Chuck for Wafer Forecast 2019-2025
- 9.2.5 Southeast Asia E-Chuck for Wafer Forecast 2019-2025
- 9.2.6 India E-Chuck for Wafer Forecast 2019-2025
- 9.3 E-Chuck for Wafer Market Trend (Product Type)
- 9.4 E-Chuck for Wafer Market Trend (Application)
- 10.1 Marketing Channel
- 10.1.1 Direct Marketing
- 10.1.2 Indirect Marketing
- 10.3 E-Chuck for Wafer Customers
11 Market Dynamics
- 11.1 Market Trends
- 11.2 Opportunities
- 11.3 Market Drivers
- 11.4 Challenges
- 11.5 Influence Factors
12 Conclusion
13 Appendix
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
The global E-Chuck for Wafer market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on E-Chuck for Wafer volume and value at global level, regional level and company level. From a global perspective, this report represents overall E-Chuck for Wafer market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of E-Chuck for Wafer in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their E-Chuck for Wafer manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Coulomb Type E-Chuck for Wafer
Johnsen-Rahbek (JR) Type E-Chuck for Wafer
Segment by Application
300 mm Wafer
200 mm Wafer
Others