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Global Die Bonder Equipment Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

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Table of Contents

    1 Market Overview

    • 1.1 Die Bonder Equipment Introduction
    • 1.2 Market Analysis by Type
      • 1.2.1 Fully Automatic
      • 1.2.2 Semi-Automatic
      • 1.2.3 Manual
    • 1.3 Market Analysis by Applications
      • 1.3.1 Integrated Device Manufacturers (IDMs)
      • 1.3.2 Outsourced Semiconductor Assembly and Test (OSAT)
    • 1.4 Market Analysis by Regions
      • 1.4.1 North America (United States, Canada and Mexico)
        • 1.4.1.1 United States Market States and Outlook (2014-2024)
        • 1.4.1.2 Canada Market States and Outlook (2014-2024)
        • 1.4.1.3 Mexico Market States and Outlook (2014-2024)
      • 1.4.2 Europe (Germany, France, UK, Russia and Italy)
        • 1.4.2.1 Germany Market States and Outlook (2014-2024)
        • 1.4.2.2 France Market States and Outlook (2014-2024)
        • 1.4.2.3 UK Market States and Outlook (2014-2024)
        • 1.4.2.4 Russia Market States and Outlook (2014-2024)
        • 1.4.2.5 Italy Market States and Outlook (2014-2024)
      • 1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
        • 1.4.3.1 China Market States and Outlook (2014-2024)
        • 1.4.3.2 Japan Market States and Outlook (2014-2024)
        • 1.4.3.3 Korea Market States and Outlook (2014-2024)
        • 1.4.3.4 India Market States and Outlook (2014-2024)
        • 1.4.3.5 Southeast Asia Market States and Outlook (2014-2024)
      • 1.4.4 South America, Middle East and Africa
        • 1.4.4.1 Brazil Market States and Outlook (2014-2024)
        • 1.4.4.2 Egypt Market States and Outlook (2014-2024)
        • 1.4.4.3 Saudi Arabia Market States and Outlook (2014-2024)
        • 1.4.4.4 South Africa Market States and Outlook (2014-2024)
        • 1.4.4.5 Turkey Market States and Outlook (2014-2024)
    • 1.5 Market Dynamics
      • 1.5.1 Market Opportunities
      • 1.5.2 Market Risk
      • 1.5.3 Market Driving Force

    2 Manufacturers Profiles

    • 2.1 Besi
      • 2.1.1 Business Overview
      • 2.1.2 Die Bonder Equipment Type and Applications
        • 2.1.2.1 Product A
        • 2.1.2.2 Product B
      • 2.1.3 Besi Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.2 ASM Pacific Technology (ASMPT)
      • 2.2.1 Business Overview
      • 2.2.2 Die Bonder Equipment Type and Applications
        • 2.2.2.1 Product A
        • 2.2.2.2 Product B
      • 2.2.3 ASM Pacific Technology (ASMPT) Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.3 Kulicke & Soffa
      • 2.3.1 Business Overview
      • 2.3.2 Die Bonder Equipment Type and Applications
        • 2.3.2.1 Product A
        • 2.3.2.2 Product B
      • 2.3.3 Kulicke & Soffa Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.4 Palomar Technologies
      • 2.4.1 Business Overview
      • 2.4.2 Die Bonder Equipment Type and Applications
        • 2.4.2.1 Product A
        • 2.4.2.2 Product B
      • 2.4.3 Palomar Technologies Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.5 Shinkawa
      • 2.5.1 Business Overview
      • 2.5.2 Die Bonder Equipment Type and Applications
        • 2.5.2.1 Product A
        • 2.5.2.2 Product B
      • 2.5.3 Shinkawa Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.6 DIAS Automation
      • 2.6.1 Business Overview
      • 2.6.2 Die Bonder Equipment Type and Applications
        • 2.6.2.1 Product A
        • 2.6.2.2 Product B
      • 2.6.3 DIAS Automation Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.7 Toray Engineering
      • 2.7.1 Business Overview
      • 2.7.2 Die Bonder Equipment Type and Applications
        • 2.7.2.1 Product A
        • 2.7.2.2 Product B
      • 2.7.3 Toray Engineering Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.8 Panasonic
      • 2.8.1 Business Overview
      • 2.8.2 Die Bonder Equipment Type and Applications
        • 2.8.2.1 Product A
        • 2.8.2.2 Product B
      • 2.8.3 Panasonic Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.9 FASFORD TECHNOLOGY
      • 2.9.1 Business Overview
      • 2.9.2 Die Bonder Equipment Type and Applications
        • 2.9.2.1 Product A
        • 2.9.2.2 Product B
      • 2.9.3 FASFORD TECHNOLOGY Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.10 West-Bond
      • 2.10.1 Business Overview
      • 2.10.2 Die Bonder Equipment Type and Applications
        • 2.10.2.1 Product A
        • 2.10.2.2 Product B
      • 2.10.3 West-Bond Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.11 Hybond
      • 2.11.1 Business Overview
      • 2.11.2 Die Bonder Equipment Type and Applications
        • 2.11.2.1 Product A
        • 2.11.2.2 Product B
      • 2.11.3 Hybond Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)

    3 Global Die Bonder Equipment Sales, Revenue, Market Share and Competition by Manufacturer (2017-2018)

    • 3.1 Global Die Bonder Equipment Sales and Market Share by Manufacturer (2017-2018)
    • 3.2 Global Die Bonder Equipment Revenue and Market Share by Manufacturer (2017-2018)
    • 3.3 Market Concentration Rate
      • 3.3.1 Top 3 Die Bonder Equipment Manufacturer Market Share in 2018
      • 3.3.2 Top 6 Die Bonder Equipment Manufacturer Market Share in 2018
    • 3.4 Market Competition Trend

    4 Global Die Bonder Equipment Market Analysis by Regions

    • 4.1 Global Die Bonder Equipment Sales, Revenue and Market Share by Regions
      • 4.1.1 Global Die Bonder Equipment Sales and Market Share by Regions (2014-2019)
      • 4.1.2 Global Die Bonder Equipment Revenue and Market Share by Regions (2014-2019)
    • 4.2 North America Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 4.3 Europe Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 4.4 Asia-Pacific Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 4.5 South America Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 4.6 Middle East and Africa Die Bonder Equipment Sales and Growth Rate (2014-2019)

    5 North America Die Bonder Equipment by Country

    • 5.1 North America Die Bonder Equipment Sales, Revenue and Market Share by Country
      • 5.1.1 North America Die Bonder Equipment Sales and Market Share by Country (2014-2019)
      • 5.1.2 North America Die Bonder Equipment Revenue and Market Share by Country (2014-2019)
    • 5.2 United States Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 5.3 Canada Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 5.4 Mexico Die Bonder Equipment Sales and Growth Rate (2014-2019)

    6 Europe Die Bonder Equipment by Country

    • 6.1 Europe Die Bonder Equipment Sales, Revenue and Market Share by Country
      • 6.1.1 Europe Die Bonder Equipment Sales and Market Share by Country (2014-2019)
      • 6.1.2 Europe Die Bonder Equipment Revenue and Market Share by Country (2014-2019)
    • 6.2 Germany Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 6.3 UK Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 6.4 France Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 6.5 Russia Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 6.6 Italy Die Bonder Equipment Sales and Growth Rate (2014-2019)

    7 Asia-Pacific Die Bonder Equipment by Country

    • 7.1 Asia-Pacific Die Bonder Equipment Sales, Revenue and Market Share by Country
      • 7.1.1 Asia-Pacific Die Bonder Equipment Sales and Market Share by Country (2014-2019)
      • 7.1.2 Asia-Pacific Die Bonder Equipment Revenue and Market Share by Country (2014-2019)
    • 7.2 China Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 7.3 Japan Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 7.4 Korea Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 7.5 India Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 7.6 Southeast Asia Die Bonder Equipment Sales and Growth Rate (2014-2019)

    8 South America Die Bonder Equipment by Country

    • 8.1 South America Die Bonder Equipment Sales, Revenue and Market Share by Country
      • 8.1.1 South America Die Bonder Equipment Sales and Market Share by Country (2014-2019)
      • 8.1.2 South America Die Bonder Equipment Revenue and Market Share by Country (2014-2019)
    • 8.2 Brazil Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 8.3 Argentina Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 8.4 Colombia Die Bonder Equipment Sales and Growth Rate (2014-2019)

    9 Middle East and Africa Die Bonder Equipment by Countries

    • 9.1 Middle East and Africa Die Bonder Equipment Sales, Revenue and Market Share by Country
      • 9.1.1 Middle East and Africa Die Bonder Equipment Sales and Market Share by Country (2014-2019)
      • 9.1.2 Middle East and Africa Die Bonder Equipment Revenue and Market Share by Country (2014-2019)
    • 9.2 Saudi Arabia Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 9.3 Turkey Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 9.4 Egypt Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 9.5 Nigeria Die Bonder Equipment Sales and Growth Rate (2014-2019)
    • 9.6 South Africa Die Bonder Equipment Sales and Growth Rate (2014-2019)

    10 Global Die Bonder Equipment Market Segment by Type

    • 10.1 Global Die Bonder Equipment Sales, Revenue and Market Share by Type (2014-2019)
      • 10.1.1 Global Die Bonder Equipment Sales and Market Share by Type (2014-2019)
      • 10.1.2 Global Die Bonder Equipment Revenue and Market Share by Type (2014-2019)
    • 10.2 Fully Automatic Sales Growth and Price
      • 10.2.1 Global Fully Automatic Sales Growth (2014-2019)
      • 10.2.2 Global Fully Automatic Price (2014-2019)
    • 10.3 Semi-Automatic Sales Growth and Price
      • 10.3.1 Global Semi-Automatic Sales Growth (2014-2019)
      • 10.3.2 Global Semi-Automatic Price (2014-2019)
    • 10.4 Manual Sales Growth and Price
      • 10.4.1 Global Manual Sales Growth (2014-2019)
      • 10.4.2 Global Manual Price (2014-2019)

    11 Global Die Bonder Equipment Market Segment by Application

    • 11.1 Global Die Bonder Equipment Sales Market Share by Application (2014-2019)
    • 11.2 Integrated Device Manufacturers (IDMs) Sales Growth (2014-2019)
    • 11.3 Outsourced Semiconductor Assembly and Test (OSAT) Sales Growth (2014-2019)

    12 Die Bonder Equipment Market Forecast (2019-2024)

    • 12.1 Global Die Bonder Equipment Sales, Revenue and Growth Rate (2019-2024)
    • 12.2 Die Bonder Equipment Market Forecast by Regions (2019-2024)
      • 12.2.1 North America Die Bonder Equipment Market Forecast (2019-2024)
      • 12.2.2 Europe Die Bonder Equipment Market Forecast (2019-2024)
      • 12.2.3 Asia-Pacific Die Bonder Equipment Market Forecast (2019-2024)
      • 12.2.4 South America Die Bonder Equipment Market Forecast (2019-2024)
      • 12.2.5 Middle East and Africa Die Bonder Equipment Market Forecast (2019-2024)
    • 12.3 Die Bonder Equipment Market Forecast by Type (2019-2024)
      • 12.3.1 Global Die Bonder Equipment Sales Forecast by Type (2019-2024)
      • 12.3.2 Global Die Bonder Equipment Market Share Forecast by Type (2019-2024)
    • 12.4 Die Bonder Equipment Market Forecast by Application (2019-2024)
      • 12.4.1 Global Die Bonder Equipment Sales Forecast by Application (2019-2024)
      • 12.4.2 Global Die Bonder Equipment Market Share Forecast by Application (2019-2024)

    13 Sales Channel, Distributors, Traders and Dealers

    • 13.1 Sales Channel
      • 13.1.1 Direct Marketing
      • 13.1.2 Indirect Marketing
      • 13.1.3 Marketing Channel Future Trend
    • 13.2 Distributors, Traders and Dealers

    14 Research Findings and Conclusion

      15 Appendix

      • 15.1 Methodology

      Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

      Scope of the Report:
      Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.
      With the increasing in production capacity, expected that the Die Bonder Equipment raw material price will be stable in the short term. However, the improvement of energy, transportation costs, and labor costs, will play a significant role in promoting the cost of Die Bonder Equipment.
      The average price of Die Bonder Equipment will fall further. The product average price trend in the past few years was not stable, however, due to the mature manufacturing technology, cost of raw materials, as well as the substitute threat, the average price will decrease in the few future years.
      The worldwide market for Die Bonder Equipment is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new GIR (Global Info Research) study.
      This report focuses on the Die Bonder Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

      Market Segment by Manufacturers, this report covers
      Besi
      ASM Pacific Technology (ASMPT)
      Kulicke & Soffa
      Palomar Technologies
      Shinkawa
      DIAS Automation
      Toray Engineering
      Panasonic
      FASFORD TECHNOLOGY
      West-Bond
      Hybond

      Market Segment by Regions, regional analysis covers
      North America (United States, Canada and Mexico)
      Europe (Germany, France, UK, Russia and Italy)
      Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
      South America (Brazil, Argentina, Colombia etc.)
      Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

      Market Segment by Type, covers
      Fully Automatic
      Semi-Automatic
      Manual

      Market Segment by Applications, can be divided into
      Integrated Device Manufacturers (IDMs)
      Outsourced Semiconductor Assembly and Test (OSAT)

      The content of the study subjects, includes a total of 15 chapters:
      Chapter 1, to describe Die Bonder Equipment product scope, market overview, market opportunities, market driving force and market risks.
      Chapter 2, to profile the top manufacturers of Die Bonder Equipment, with price, sales, revenue and global market share of Die Bonder Equipment in 2017 and 2018.
      Chapter 3, the Die Bonder Equipment competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
      Chapter 4, the Die Bonder Equipment breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
      Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
      Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
      Chapter 12, Die Bonder Equipment market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
      Chapter 13, 14 and 15, to describe Die Bonder Equipment sales channel, distributors, customers, research findings and conclusion, appendix and data source.

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