COVID-19 Impact on Global Package Substrates Market Insights, Forecast to 2026
1 Study Coverage
- 1.1 Package Substrates Product Introduction
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered: Ranking of Global Top Package Substrates Manufacturers by Revenue in 2019
- 1.4 Market by Type
- 1.4.1 Global Package Substrates Market Size Growth Rate by Type
- 1.4.2 FCCSP
- 1.4.3 WBCSP
- 1.4.4 SiP
- 1.4.5 BOC
- 1.4.6 FCBGA
- 1.5 Market by Application
- 1.5.1 Global Package Substrates Market Size Growth Rate by Application
- 1.5.2 Mobile Devices
- 1.5.3 Automotive Industry
- 1.5.4 Others
- 1.6 Coronavirus Disease 2019 (Covid-19): Package Substrates Industry Impact
- 1.6.1 How the Covid-19 is Affecting the Package Substrates Industry
- 1.6.1.1 Package Substrates Business Impact Assessment - Covid-19
- 1.6.1.2 Supply Chain Challenges
- 1.6.1.3 COVID-19’s Impact On Crude Oil and Refined Products
- 1.6.2 Market Trends and Package Substrates Potential Opportunities in the COVID-19 Landscape
- 1.6.3 Measures / Proposal against Covid-19
- 1.6.3.1 Government Measures to Combat Covid-19 Impact
- 1.6.3.2 Proposal for Package Substrates Players to Combat Covid-19 Impact
- 1.6.1 How the Covid-19 is Affecting the Package Substrates Industry
- 1.7 Study Objectives
- 1.8 Years Considered
2 Executive Summary
- 2.1 Global Package Substrates Market Size Estimates and Forecasts
- 2.1.1 Global Package Substrates Revenue Estimates and Forecasts 2015-2026
- 2.1.2 Global Package Substrates Production Capacity Estimates and Forecasts 2015-2026
- 2.1.3 Global Package Substrates Production Estimates and Forecasts 2015-2026
- 2.2 Global Package Substrates Market Size by Producing Regions: 2015 VS 2020 VS 2026
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Global Package Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
- 2.3.3 Global Package Substrates Manufacturers Geographical Distribution
- 2.4 Key Trends for Package Substrates Markets & Products
- 2.5 Primary Interviews with Key Package Substrates Players (Opinion Leaders)
3 Market Size by Manufacturers
- 3.1 Global Top Package Substrates Manufacturers by Production Capacity
- 3.1.1 Global Top Package Substrates Manufacturers by Production Capacity (2015-2020)
- 3.1.2 Global Top Package Substrates Manufacturers by Production (2015-2020)
- 3.1.3 Global Top Package Substrates Manufacturers Market Share by Production
- 3.2 Global Top Package Substrates Manufacturers by Revenue
- 3.2.1 Global Top Package Substrates Manufacturers by Revenue (2015-2020)
- 3.2.2 Global Top Package Substrates Manufacturers Market Share by Revenue (2015-2020)
- 3.2.3 Global Top 10 and Top 5 Companies by Package Substrates Revenue in 2019
- 3.3 Global Package Substrates Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 Package Substrates Production by Regions
- 4.1 Global Package Substrates Historic Market Facts & Figures by Regions
- 4.1.1 Global Top Package Substrates Regions by Production (2015-2020)
- 4.1.2 Global Top Package Substrates Regions by Revenue (2015-2020)
- 4.2 North America
- 4.2.1 North America Package Substrates Production (2015-2020)
- 4.2.2 North America Package Substrates Revenue (2015-2020)
- 4.2.3 Key Players in North America
- 4.2.4 North America Package Substrates Import & Export (2015-2020)
- 4.3 Europe
- 4.3.1 Europe Package Substrates Production (2015-2020)
- 4.3.2 Europe Package Substrates Revenue (2015-2020)
- 4.3.3 Key Players in Europe
- 4.3.4 Europe Package Substrates Import & Export (2015-2020)
- 4.4 China
- 4.4.1 China Package Substrates Production (2015-2020)
- 4.4.2 China Package Substrates Revenue (2015-2020)
- 4.4.3 Key Players in China
- 4.4.4 China Package Substrates Import & Export (2015-2020)
- 4.5 Japan
- 4.5.1 Japan Package Substrates Production (2015-2020)
- 4.5.2 Japan Package Substrates Revenue (2015-2020)
- 4.5.3 Key Players in Japan
- 4.5.4 Japan Package Substrates Import & Export (2015-2020)
- 4.6 South Korea
- 4.6.1 South Korea Package Substrates Production (2015-2020)
- 4.6.2 South Korea Package Substrates Revenue (2015-2020)
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea Package Substrates Import & Export (2015-2020)
5 Package Substrates Consumption by Region
- 5.1 Global Top Package Substrates Regions by Consumption
- 5.1.1 Global Top Package Substrates Regions by Consumption (2015-2020)
- 5.1.2 Global Top Package Substrates Regions Market Share by Consumption (2015-2020)
- 5.2 North America
- 5.2.1 North America Package Substrates Consumption by Application
- 5.2.2 North America Package Substrates Consumption by Countries
- 5.2.3 U.S.
- 5.2.4 Canada
- 5.3 Europe
- 5.3.1 Europe Package Substrates Consumption by Application
- 5.3.2 Europe Package Substrates Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 U.K.
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific Package Substrates Consumption by Application
- 5.4.2 Asia Pacific Package Substrates Consumption by Regions
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Taiwan
- 5.4.9 Indonesia
- 5.4.10 Thailand
- 5.4.11 Malaysia
- 5.4.12 Philippines
- 5.4.13 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America Package Substrates Consumption by Application
- 5.5.2 Central & South America Package Substrates Consumption by Country
- 5.5.3 Mexico
- 5.5.3 Brazil
- 5.5.3 Argentina
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa Package Substrates Consumption by Application
- 5.6.2 Middle East and Africa Package Substrates Consumption by Countries
- 5.6.3 Turkey
- 5.6.4 Saudi Arabia
- 5.6.5 U.A.E
6 Market Size by Type (2015-2026)
- 6.1 Global Package Substrates Market Size by Type (2015-2020)
- 6.1.1 Global Package Substrates Production by Type (2015-2020)
- 6.1.2 Global Package Substrates Revenue by Type (2015-2020)
- 6.1.3 Package Substrates Price by Type (2015-2020)
- 6.2 Global Package Substrates Market Forecast by Type (2021-2026)
- 6.2.1 Global Package Substrates Production Forecast by Type (2021-2026)
- 6.2.2 Global Package Substrates Revenue Forecast by Type (2021-2026)
- 6.2.3 Global Package Substrates Price Forecast by Type (2021-2026)
- 6.3 Global Package Substrates Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End
7 Market Size by Application (2015-2026)
- 7.2.1 Global Package Substrates Consumption Historic Breakdown by Application (2015-2020)
- 7.2.2 Global Package Substrates Consumption Forecast by Application (2021-2026)
8 Corporate Profiles
- 8.1 Ibiden
- 8.1.1 Ibiden Corporation Information
- 8.1.2 Ibiden Overview and Its Total Revenue
- 8.1.3 Ibiden Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.1.4 Ibiden Product Description
- 8.1.5 Ibiden Recent Development
- 8.2 Shinko Electric Industries
- 8.2.1 Shinko Electric Industries Corporation Information
- 8.2.2 Shinko Electric Industries Overview and Its Total Revenue
- 8.2.3 Shinko Electric Industries Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.2.4 Shinko Electric Industries Product Description
- 8.2.5 Shinko Electric Industries Recent Development
- 8.3 Kyocera
- 8.3.1 Kyocera Corporation Information
- 8.3.2 Kyocera Overview and Its Total Revenue
- 8.3.3 Kyocera Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.3.4 Kyocera Product Description
- 8.3.5 Kyocera Recent Development
- 8.4 Samsung Electro-Mechanics
- 8.4.1 Samsung Electro-Mechanics Corporation Information
- 8.4.2 Samsung Electro-Mechanics Overview and Its Total Revenue
- 8.4.3 Samsung Electro-Mechanics Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.4.4 Samsung Electro-Mechanics Product Description
- 8.4.5 Samsung Electro-Mechanics Recent Development
- 8.5 Fujitsu
- 8.5.1 Fujitsu Corporation Information
- 8.5.2 Fujitsu Overview and Its Total Revenue
- 8.5.3 Fujitsu Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.5.4 Fujitsu Product Description
- 8.5.5 Fujitsu Recent Development
- 8.6 Hitachi
- 8.6.1 Hitachi Corporation Information
- 8.6.2 Hitachi Overview and Its Total Revenue
- 8.6.3 Hitachi Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.6.4 Hitachi Product Description
- 8.6.5 Hitachi Recent Development
- 8.7 Eastern
- 8.7.1 Eastern Corporation Information
- 8.7.2 Eastern Overview and Its Total Revenue
- 8.7.3 Eastern Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.7.4 Eastern Product Description
- 8.7.5 Eastern Recent Development
- 8.8 LG Innotek
- 8.8.1 LG Innotek Corporation Information
- 8.8.2 LG Innotek Overview and Its Total Revenue
- 8.8.3 LG Innotek Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.8.4 LG Innotek Product Description
- 8.8.5 LG Innotek Recent Development
- 8.9 Simmtech
- 8.9.1 Simmtech Corporation Information
- 8.9.2 Simmtech Overview and Its Total Revenue
- 8.9.3 Simmtech Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.9.4 Simmtech Product Description
- 8.9.5 Simmtech Recent Development
- 8.10 Daeduck
- 8.10.1 Daeduck Corporation Information
- 8.10.2 Daeduck Overview and Its Total Revenue
- 8.10.3 Daeduck Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.10.4 Daeduck Product Description
- 8.10.5 Daeduck Recent Development
- 8.11 AT&S
- 8.11.1 AT&S Corporation Information
- 8.11.2 AT&S Overview and Its Total Revenue
- 8.11.3 AT&S Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.11.4 AT&S Product Description
- 8.11.5 AT&S Recent Development
- 8.12 Unimicron
- 8.12.1 Unimicron Corporation Information
- 8.12.2 Unimicron Overview and Its Total Revenue
- 8.12.3 Unimicron Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.12.4 Unimicron Product Description
- 8.12.5 Unimicron Recent Development
- 8.13 Kinsus
- 8.13.1 Kinsus Corporation Information
- 8.13.2 Kinsus Overview and Its Total Revenue
- 8.13.3 Kinsus Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.13.4 Kinsus Product Description
- 8.13.5 Kinsus Recent Development
- 8.14 Nan Ya PCB
- 8.14.1 Nan Ya PCB Corporation Information
- 8.14.2 Nan Ya PCB Overview and Its Total Revenue
- 8.14.3 Nan Ya PCB Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.14.4 Nan Ya PCB Product Description
- 8.14.5 Nan Ya PCB Recent Development
- 8.15 ASE Group
- 8.15.1 ASE Group Corporation Information
- 8.15.2 ASE Group Overview and Its Total Revenue
- 8.15.3 ASE Group Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.15.4 ASE Group Product Description
- 8.15.5 ASE Group Recent Development
- 8.16 TTM Technologies
- 8.16.1 TTM Technologies Corporation Information
- 8.16.2 TTM Technologies Overview and Its Total Revenue
- 8.16.3 TTM Technologies Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.16.4 TTM Technologies Product Description
- 8.16.5 TTM Technologies Recent Development
- 8.17 Zhen Ding Technology
- 8.17.1 Zhen Ding Technology Corporation Information
- 8.17.2 Zhen Ding Technology Overview and Its Total Revenue
- 8.17.3 Zhen Ding Technology Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.17.4 Zhen Ding Technology Product Description
- 8.17.5 Zhen Ding Technology Recent Development
- 8.18 Shenzhen Fastprint Circuit Tech
- 8.18.1 Shenzhen Fastprint Circuit Tech Corporation Information
- 8.18.2 Shenzhen Fastprint Circuit Tech Overview and Its Total Revenue
- 8.18.3 Shenzhen Fastprint Circuit Tech Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.18.4 Shenzhen Fastprint Circuit Tech Product Description
- 8.18.5 Shenzhen Fastprint Circuit Tech Recent Development
9 Production Forecasts by Regions
- 9.1 Global Top Package Substrates Regions Forecast by Revenue (2021-2026)
- 9.2 Global Top Package Substrates Regions Forecast by Production (2021-2026)
- 9.3 Key Package Substrates Production Regions Forecast
- 9.3.1 North America
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
10 Package Substrates Consumption Forecast by Region
- 10.1 Global Package Substrates Consumption Forecast by Region (2021-2026)
- 10.2 North America Package Substrates Consumption Forecast by Region (2021-2026)
- 10.3 Europe Package Substrates Consumption Forecast by Region (2021-2026)
- 10.4 Asia Pacific Package Substrates Consumption Forecast by Region (2021-2026)
- 10.5 Latin America Package Substrates Consumption Forecast by Region (2021-2026)
- 10.6 Middle East and Africa Package Substrates Consumption Forecast by Region (2021-2026)
11 Value Chain and Sales Channels Analysis
- 11.1 Value Chain Analysis
- 11.2 Sales Channels Analysis
- 11.2.1 Package Substrates Sales Channels
- 11.2.2 Package Substrates Distributors
- 11.3 Package Substrates Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
- 12.1 Market Opportunities and Drivers
- 12.2 Market Challenges
- 12.3 Market Risks/Restraints
- 12.4 Porter's Five Forces Analysis
13 Key Finding in The Global Package Substrates Study
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.2 Data Source
- 14.2 Author Details
Package substrate transmits electric signals between semiconductors and the main board, and it is mainly used for the core semiconductors of mobile devices and PCs.
Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt, and will significantly affect the Package Substrates market in 2020.
COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets.
The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.
This report also analyses the impact of Coronavirus COVID-19 on the Package Substrates industry.
Based on our recent survey, we have several different scenarios about the Package Substrates YoY growth rate for 2020. The probable scenario is expected to grow by a xx% in 2020 and the revenue will be xx in 2020 from US$ xx million in 2019. The market size of Package Substrates will reach xx in 2026, with a CAGR of xx% from 2020 to 2026.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Package Substrates market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Package Substrates market in terms of both revenue and volume.
Players, stakeholders, and other participants in the global Package Substrates market will be able to gain the upper hand as they use the report as a powerful resource. For this version of the report, the segmental analysis focuses on sales (volume), revenue and forecast by each application segment in terms of sales and revenue and forecast by each type segment in terms of revenue for the period 2015-2026.
Production and Pricing Analyses
Readers are provided with deeper production analysis, import and export analysis, and pricing analysis for the global Package Substrates market. As part of production analysis, the report offers accurate statistics and figures for production capacity, production volume by region, and global production and production by each type segment for the period 2015-2026.
In the pricing analysis section of the report, readers are provided with validated statistics and figures for price by manufacturer and price by region for the period 2015-2020 and price by each type segment for the period 2015-2026. The import and export analysis for the global Package Substrates market has been provided based on region.
Regional and Country-level Analysis
The report offers an exhaustive geographical analysis of the global Package Substrates market, covering important regions, viz, North America, Europe, China, Japan and South Korea. It also covers key countries (regions), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by each application segment in terms of volume for the period 2015-2026.
Competition Analysis
In the competitive analysis section of the report, leading as well as prominent players of the global Package Substrates market are broadly studied on the basis of key factors. The report offers comprehensive analysis and accurate statistics on sales by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on price and revenue (global level) by player for the period 2015-2020.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Package Substrates market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Package Substrates market.
The following manufacturers are covered in this report:
Ibiden
Shinko Electric Industries
Kyocera
Samsung Electro-Mechanics
Fujitsu
Hitachi
Eastern
LG Innotek
Simmtech
Daeduck
AT&S
Unimicron
Kinsus
Nan Ya PCB
ASE Group
TTM Technologies
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
Package Substrates Breakdown Data by Type
FCCSP
WBCSP
SiP
BOC
FCBGA
Package Substrates Breakdown Data by Application
Mobile Devices
Automotive Industry
Others