Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 PCB
    • 1.1.2.2 I/O rectangular
    • 1.1.2.3 IC sockets
    • 1.1.2.4 RF coax
    • 1.1.2.5 Circular
    • 1.1.2.6 Telecom
    • 1.1.2.7 Fibre optics
    • 1.1.2.8 Terminal block
    • 1.1.2.9 Heavy duty
    • 1.1.2.10 Power
    • 1.1.2.11 Application specific
  • 1.1.3 Market by Application
    • 1.1.3.1 Telecom/Datacom
    • 1.1.3.2 Auto/Transportation
    • 1.1.3.3 Computer, Peripherals, and Business Equipment
    • 1.1.3.4 Instrumentation/Industrial
    • 1.1.3.5 Consumer/Medical Equipment
    • 1.1.3.6 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Delphi
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 Amphenol
• 6.3 Hon Hai/Foxconn Technology
• 6.4 Molex
• 6.5 TE Connectivity
• 6.6 3M
• 6.7 ABB
• 6.8 Belden Incorporated
• 6.9 Emerson
• 6.10 EDAC
• 6.11 HARTING Technology Group
• 6.12 Hirose Electric
• 6.13 JAE
• 6.14 JST
• 6.15 LOTES
• 6.16 METZ
• 6.17 Phoenix Contact
• 6.18 Rosenberger
• 6.19 Sumitomo Wiring Systems
• 6.20 Weidmüller
• 6.21 Yazaki

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary

Market Segment as follows:
By Type
PCB
I/O rectangular
IC sockets
RF coax
Circular
Telecom
Fibre optics
Terminal block
Heavy duty
Power
Application specific
By Application
Telecom/Datacom
Auto/Transportation
Computer, Peripherals, and Business Equipment
Instrumentation/Industrial
Consumer/Medical Equipment
Others
By Company
Delphi
Amphenol
Hon Hai/Foxconn Technology
Molex
TE Connectivity
3M
ABB
Belden Incorporated
Emerson
EDAC
HARTING Technology Group
Hirose Electric
JAE
JST
LOTES
METZ
Phoenix Contact
Rosenberger
Sumitomo Wiring Systems
Weidmüller
Yazaki
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.