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Global (United States, European Union and China) 3D IC and 2.5D IC Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 3D wafer-level chip-scale packaging
      • 1.3.3 3D TSV
      • 1.3.4 2.5D
    • 1.4 Market Segment by Application
      • 1.4.1 Global 3D IC and 2.5D IC Market Share by Application (2019-2025)
      • 1.4.2 Consumer electronics
      • 1.4.3 Telecommunication
      • 1.4.4 Industry sector
      • 1.4.5 Automotive
      • 1.4.6 Military and Aerospace
      • 1.4.7 Smart technologies
      • 1.4.8 Medical devices
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global 3D IC and 2.5D IC Production Value 2014-2025
      • 2.1.2 Global 3D IC and 2.5D IC Production 2014-2025
      • 2.1.3 Global 3D IC and 2.5D IC Capacity 2014-2025
      • 2.1.4 Global 3D IC and 2.5D IC Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global 3D IC and 2.5D IC Market Size CAGR of Key Regions
      • 2.2.2 Global 3D IC and 2.5D IC Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global 3D IC and 2.5D IC Capacity by Manufacturers
      • 3.1.2 Global 3D IC and 2.5D IC Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 3D IC and 2.5D IC Revenue by Manufacturers (2014-2019)
      • 3.2.2 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global 3D IC and 2.5D IC Market Concentration Ratio (CR5 and HHI)
    • 3.3 3D IC and 2.5D IC Price by Manufacturers
    • 3.4 Key Manufacturers 3D IC and 2.5D IC Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into 3D IC and 2.5D IC Market
    • 3.6 Key Manufacturers 3D IC and 2.5D IC Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 3D wafer-level chip-scale packaging Production and Production Value (2014-2019)
      • 4.1.2 3D TSV Production and Production Value (2014-2019)
      • 4.1.3 2.5D Production and Production Value (2014-2019)
    • 4.2 Global 3D IC and 2.5D IC Production Market Share by Type
    • 4.3 Global 3D IC and 2.5D IC Production Value Market Share by Type
    • 4.4 3D IC and 2.5D IC Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global 3D IC and 2.5D IC Consumption by Application

    6 Production by Regions

    • 6.1 Global 3D IC and 2.5D IC Production (History Data) by Regions 2014-2019
    • 6.2 Global 3D IC and 2.5D IC Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States 3D IC and 2.5D IC Production Growth Rate 2014-2019
      • 6.3.2 United States 3D IC and 2.5D IC Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States 3D IC and 2.5D IC Import & Export
    • 6.4 European Union
      • 6.4.1 European Union 3D IC and 2.5D IC Production Growth Rate 2014-2019
      • 6.4.2 European Union 3D IC and 2.5D IC Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union 3D IC and 2.5D IC Import & Export
    • 6.5 China
      • 6.5.1 China 3D IC and 2.5D IC Production Growth Rate 2014-2019
      • 6.5.2 China 3D IC and 2.5D IC Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China 3D IC and 2.5D IC Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 3D IC and 2.5D IC Consumption by Regions

    • 7.1 Global 3D IC and 2.5D IC Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States 3D IC and 2.5D IC Consumption by Type
      • 7.2.2 United States 3D IC and 2.5D IC Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union 3D IC and 2.5D IC Consumption by Type
      • 7.3.2 European Union 3D IC and 2.5D IC Consumption by Application
    • 7.4 China
      • 7.4.1 China 3D IC and 2.5D IC Consumption by Type
      • 7.4.2 China 3D IC and 2.5D IC Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World 3D IC and 2.5D IC Consumption by Type
      • 7.5.2 Rest of World 3D IC and 2.5D IC Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 TSMC (Taiwan)
      • 8.1.1 TSMC (Taiwan) Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.1.4 3D IC and 2.5D IC Product Introduction
      • 8.1.5 TSMC (Taiwan) Recent Development
    • 8.2 Samsung (South Korea)
      • 8.2.1 Samsung (South Korea) Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.2.4 3D IC and 2.5D IC Product Introduction
      • 8.2.5 Samsung (South Korea) Recent Development
    • 8.3 Toshiba (Japan)
      • 8.3.1 Toshiba (Japan) Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.3.4 3D IC and 2.5D IC Product Introduction
      • 8.3.5 Toshiba (Japan) Recent Development
    • 8.4 ASE Group (Taiwan)
      • 8.4.1 ASE Group (Taiwan) Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.4.4 3D IC and 2.5D IC Product Introduction
      • 8.4.5 ASE Group (Taiwan) Recent Development
    • 8.5 Amkor (U.S.)
      • 8.5.1 Amkor (U.S.) Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.5.4 3D IC and 2.5D IC Product Introduction
      • 8.5.5 Amkor (U.S.) Recent Development
    • 8.6 UMC (Taiwan)
      • 8.6.1 UMC (Taiwan) Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.6.4 3D IC and 2.5D IC Product Introduction
      • 8.6.5 UMC (Taiwan) Recent Development
    • 8.7 Stmicroelectronics (Switzerland)
      • 8.7.1 Stmicroelectronics (Switzerland) Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.7.4 3D IC and 2.5D IC Product Introduction
      • 8.7.5 Stmicroelectronics (Switzerland) Recent Development
    • 8.8 Broadcom (U.S.)
      • 8.8.1 Broadcom (U.S.) Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.8.4 3D IC and 2.5D IC Product Introduction
      • 8.8.5 Broadcom (U.S.) Recent Development
    • 8.9 Intel (U.S.)
      • 8.9.1 Intel (U.S.) Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.9.4 3D IC and 2.5D IC Product Introduction
      • 8.9.5 Intel (U.S.) Recent Development
    • 8.10 Jiangsu Changjiang Electronics (China)
      • 8.10.1 Jiangsu Changjiang Electronics (China) Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of 3D IC and 2.5D IC
      • 8.10.4 3D IC and 2.5D IC Product Introduction
      • 8.10.5 Jiangsu Changjiang Electronics (China) Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global 3D IC and 2.5D IC Capacity, Production Forecast 2019-2025
      • 9.1.2 Global 3D IC and 2.5D IC Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global 3D IC and 2.5D IC Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global 3D IC and 2.5D IC Production Forecast by Type
      • 9.7.2 Global 3D IC and 2.5D IC Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 3D IC and 2.5D IC Sales Channels
      • 10.2.2 3D IC and 2.5D IC Distributors
    • 10.3 3D IC and 2.5D IC Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
      3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
      In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
      In 2019, the market size of 3D IC and 2.5D IC is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC and 2.5D IC.

      This report studies the global market size of 3D IC and 2.5D IC, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the 3D IC and 2.5D IC production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      TSMC (Taiwan)
      Samsung (South Korea)
      Toshiba (Japan)
      ASE Group (Taiwan)
      Amkor (U.S.)
      UMC (Taiwan)
      Stmicroelectronics (Switzerland)
      Broadcom (U.S.)
      Intel (U.S.)
      Jiangsu Changjiang Electronics (China)

      Market Segment by Product Type
      3D wafer-level chip-scale packaging
      3D TSV
      2.5D

      Market Segment by Application
      Consumer electronics
      Telecommunication
      Industry sector
      Automotive
      Military and Aerospace
      Smart technologies
      Medical devices

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the 3D IC and 2.5D IC status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key 3D IC and 2.5D IC manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of 3D IC and 2.5D IC are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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