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Global 3D IC and 2.5D IC Market Professional Survey Report 2019

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Table of Contents

    Executive Summary

      1 Industry Overview of 3D IC and 2.5D IC

      • 1.1 Definition of 3D IC and 2.5D IC
      • 1.2 3D IC and 2.5D IC Segment by Type
        • 1.2.1 Global 3D IC and 2.5D IC Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 3D wafer-level chip-scale packaging
        • 1.2.3 3D TSV
        • 1.2.4 2.5D
      • 1.3 3D IC and 2.5D IC Segment by Applications
        • 1.3.1 Global 3D IC and 2.5D IC Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Consumer electronics
        • 1.3.3 Telecommunication
        • 1.3.4 Industry sector
        • 1.3.5 Automotive
        • 1.3.6 Military and Aerospace
        • 1.3.7 Smart technologies
        • 1.3.8 Medical devices
      • 1.4 Global 3D IC and 2.5D IC Overall Market
        • 1.4.1 Global 3D IC and 2.5D IC Revenue (2014-2025)
        • 1.4.2 Global 3D IC and 2.5D IC Production (2014-2025)
        • 1.4.3 North America 3D IC and 2.5D IC Status and Prospect (2014-2025)
        • 1.4.4 Europe 3D IC and 2.5D IC Status and Prospect (2014-2025)
        • 1.4.5 China 3D IC and 2.5D IC Status and Prospect (2014-2025)
        • 1.4.6 Japan 3D IC and 2.5D IC Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia 3D IC and 2.5D IC Status and Prospect (2014-2025)
        • 1.4.8 India 3D IC and 2.5D IC Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of 3D IC and 2.5D IC
      • 2.3 Manufacturing Process Analysis of 3D IC and 2.5D IC
      • 2.4 Industry Chain Structure of 3D IC and 2.5D IC

      3 Development and Manufacturing Plants Analysis of 3D IC and 2.5D IC

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global 3D IC and 2.5D IC Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of 3D IC and 2.5D IC
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 3D IC and 2.5D IC Production and Capacity Analysis
      • 4.2 3D IC and 2.5D IC Revenue Analysis
      • 4.3 3D IC and 2.5D IC Price Analysis
      • 4.4 Market Concentration Degree

      5 3D IC and 2.5D IC Regional Market Analysis

      • 5.1 3D IC and 2.5D IC Production by Regions
        • 5.1.1 Global 3D IC and 2.5D IC Production by Regions
        • 5.1.2 Global 3D IC and 2.5D IC Revenue by Regions
      • 5.2 3D IC and 2.5D IC Consumption by Regions
      • 5.3 North America 3D IC and 2.5D IC Market Analysis
        • 5.3.1 North America 3D IC and 2.5D IC Production
        • 5.3.2 North America 3D IC and 2.5D IC Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America 3D IC and 2.5D IC Import and Export
      • 5.4 Europe 3D IC and 2.5D IC Market Analysis
        • 5.4.1 Europe 3D IC and 2.5D IC Production
        • 5.4.2 Europe 3D IC and 2.5D IC Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe 3D IC and 2.5D IC Import and Export
      • 5.5 China 3D IC and 2.5D IC Market Analysis
        • 5.5.1 China 3D IC and 2.5D IC Production
        • 5.5.2 China 3D IC and 2.5D IC Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China 3D IC and 2.5D IC Import and Export
      • 5.6 Japan 3D IC and 2.5D IC Market Analysis
        • 5.6.1 Japan 3D IC and 2.5D IC Production
        • 5.6.2 Japan 3D IC and 2.5D IC Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan 3D IC and 2.5D IC Import and Export
      • 5.7 Southeast Asia 3D IC and 2.5D IC Market Analysis
        • 5.7.1 Southeast Asia 3D IC and 2.5D IC Production
        • 5.7.2 Southeast Asia 3D IC and 2.5D IC Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia 3D IC and 2.5D IC Import and Export
      • 5.8 India 3D IC and 2.5D IC Market Analysis
        • 5.8.1 India 3D IC and 2.5D IC Production
        • 5.8.2 India 3D IC and 2.5D IC Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India 3D IC and 2.5D IC Import and Export

      6 3D IC and 2.5D IC Segment Market Analysis (by Type)

      • 6.1 Global 3D IC and 2.5D IC Production by Type
      • 6.2 Global 3D IC and 2.5D IC Revenue by Type
      • 6.3 3D IC and 2.5D IC Price by Type

      7 3D IC and 2.5D IC Segment Market Analysis (by Application)

      • 7.1 Global 3D IC and 2.5D IC Consumption by Application
      • 7.2 Global 3D IC and 2.5D IC Consumption Market Share by Application (2014-2019)

      8 3D IC and 2.5D IC Major Manufacturers Analysis

      • 8.1 TSMC (Taiwan)
        • 8.1.1 TSMC (Taiwan) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.1.2 TSMC (Taiwan) Product Introduction, Application and Specification
        • 8.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Samsung (South Korea)
        • 8.2.1 Samsung (South Korea) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.2.2 Samsung (South Korea) Product Introduction, Application and Specification
        • 8.2.3 Samsung (South Korea) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 Toshiba (Japan)
        • 8.3.1 Toshiba (Japan) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.3.2 Toshiba (Japan) Product Introduction, Application and Specification
        • 8.3.3 Toshiba (Japan) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 ASE Group (Taiwan)
        • 8.4.1 ASE Group (Taiwan) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.4.2 ASE Group (Taiwan) Product Introduction, Application and Specification
        • 8.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 Amkor (US)
        • 8.5.1 Amkor (US) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.5.2 Amkor (US) Product Introduction, Application and Specification
        • 8.5.3 Amkor (US) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 UMC (Taiwan)
        • 8.6.1 UMC (Taiwan) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.6.2 UMC (Taiwan) Product Introduction, Application and Specification
        • 8.6.3 UMC (Taiwan) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 Stmicroelectronics (Switzerland)
        • 8.7.1 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.7.2 Stmicroelectronics (Switzerland) Product Introduction, Application and Specification
        • 8.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 Broadcom (US)
        • 8.8.1 Broadcom (US) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.8.2 Broadcom (US) Product Introduction, Application and Specification
        • 8.8.3 Broadcom (US) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 Intel (US)
        • 8.9.1 Intel (US) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.9.2 Intel (US) Product Introduction, Application and Specification
        • 8.9.3 Intel (US) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 Jiangsu Changjiang Electronics (China)
        • 8.10.1 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production Sites and Area Served
        • 8.10.2 Jiangsu Changjiang Electronics (China) Product Introduction, Application and Specification
        • 8.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served

      9 Development Trend of Analysis of 3D IC and 2.5D IC Market

      • 9.1 Global 3D IC and 2.5D IC Market Trend Analysis
        • 9.1.1 Global 3D IC and 2.5D IC Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 3D IC and 2.5D IC Regional Market Trend
        • 9.2.1 North America 3D IC and 2.5D IC Forecast 2019-2025
        • 9.2.2 Europe 3D IC and 2.5D IC Forecast 2019-2025
        • 9.2.3 China 3D IC and 2.5D IC Forecast 2019-2025
        • 9.2.4 Japan 3D IC and 2.5D IC Forecast 2019-2025
        • 9.2.5 Southeast Asia 3D IC and 2.5D IC Forecast 2019-2025
        • 9.2.6 India 3D IC and 2.5D IC Forecast 2019-2025
      • 9.3 3D IC and 2.5D IC Market Trend (Product Type)
      • 9.4 3D IC and 2.5D IC Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 3D IC and 2.5D IC Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
        3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
        In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.

        The global 3D IC and 2.5D IC market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on 3D IC and 2.5D IC volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D IC and 2.5D IC market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of 3D IC and 2.5D IC in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their 3D IC and 2.5D IC manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        TSMC (Taiwan)
        Samsung (South Korea)
        Toshiba (Japan)
        ASE Group (Taiwan)
        Amkor (US)
        UMC (Taiwan)
        Stmicroelectronics (Switzerland)
        Broadcom (US)
        Intel (US)
        Jiangsu Changjiang Electronics (China)

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        3D wafer-level chip-scale packaging
        3D TSV
        2.5D

        Segment by Application
        Consumer electronics
        Telecommunication
        Industry sector
        Automotive
        Military and Aerospace
        Smart technologies
        Medical devices

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